A manufacturing method for a joint body having a first metal member and a second metal member joined together by causing a laser oscillation system to irradiate a surface of the second metal member placed on the first metal member with laser light to form a joint portion including a welded portion where the first metal member and the second metal member are joined together includes continuously supplying the second metal member while pressing the second metal member against the first metal member, the second metal member being a hoop material, and causing the laser oscillation system to emit the laser light.

A method of producing a wafer from a hexagonal single-crystal ingot includes the steps of planarizing an end face of the hexagonal single-crystal ingot, forming a peel-off layer in the hexagonal single-crystal ingot by applying a pulsed laser beam whose wavelength is transmittable through the hexagonal single-crystal ingot while positioning a focal point of the pulsed laser beam in the hexagonal single-crystal ingot at a depth corresponding to a thickness of a wafer to be produced from the planarized end face of the hexagonal single-crystal ingot, recording a fabrication history on the planarized end face of the hexagonal single-crystal ingot by applying a pulsed laser beam to the hexagonal single-crystal ingot while positioning a focal point of the last-mentioned pulsed laser beam in a device-free area of the wafer to be produced.

A machining head emits a laser beam for cutting sheet metal of stainless steel. A moving mechanism moves the machining head relatively to a surface of the sheet metal. A beam vibrating mechanism vibrates a laser beam in a parallel direction with a cutting advancing direction of the sheet metal. In a machining condition database, a single specific vibration frequency at which cutting of the sheet metal is possible is set to a maximum moving velocity at which cutting of the sheet metal is possible, and a plurality of vibration frequencies from a maximum frequency to a minimum frequency at which cutting of the sheet metal is possible are set to a moving velocity more than or equal to a minimum moving velocity and less than the maximum moving velocity at which cutting of the sheet metal is possible.

A method for producing a zinc or zinc-alloy coated steel sheet with a tensile strength higher than 900 MPa, for the fabrication of resistance spot welds containing in average not more than two Liquid Metal Embrittlement cracks per weld having a depth of 100 μm or more, with steps of providing a cold-rolled steel sheet, heating cold-rolled steel sheet up to a temperature T1 between 550° C. and Ac1+50° C. in a furnace zone with an atmosphere (A1) containing from 2 to 15% hydrogen by volume, so that the iron is not oxidized, then adding in the furnace atmosphere, water steam or oxygen with an injection flow rate Q higher than (0.07%/h×α), α being equal to 1 if said element is water steam or equal to 0.52 if said element is oxygen, at a temperature T≥T1, so to obtain an atmosphere (A2) with a dew point DP2 between −15° C. and the temperature Te of the iron/iron oxide equilibrium dew point, then heating the sheet from temperature T.sub.1 up to a temperature T.sub.2 between 720° C. and 1000° C. in a furnace zone under an atmosphere (A2) of nitrogen containing from 2 to 15% hydrogen and more than 0.1% CO by volume, with an oxygen partial pressure higher than 10.sup.−21 atm., wherein the duration t.sub.D of heating of the sheet from temperature T.sub.1 up to the end of soaking at temperature T.sub.2 is between 100 and 500 s., soaking the sheet at T.sub.2, then cooling the sheet at a rate between 10 and 400° C./s, then coating the sheet with zinc or zinc-alloy coating.

An apparatus for repairing elements, includes: a bonding material transfer stamp transferring a new bonding material to a repair area on a substrate, the repair area having a defective element or a residual bonding material removed therefrom; and an element transfer stamp transferring a new element to the new bonding material, wherein the element transfer stamp comprises a load control portion for elements, the load control portion being bent and deformed upon receiving pressing force such that a zero-stiffness load smaller than a critical damage load of the new element is applied to the new element.

A workpiece support member for a thermal processing machine is installed on a workpiece support table to support a workpiece to be thermally processed, and includes a base member and a supporting member. The base member is formed of a plate-like member in a horizontally long shape, and provided with a plurality of protruding supporting member attachment parts at predetermined distance intervals on an upper part thereof. The supporting member is formed of a plate-like member in a horizontally long shape, and is installed in an attachable and removable state with a lower side thereof fitted alternately to a front surface and a rear surface of each of the adjacent supporting member attachment parts of the base member.

A method for producing workpiece parts from a plate-shaped workpiece in a processing machine or laser processing machine includes positioning and holding the workpiece on a workpiece support by clamping devices. A plurality of workpiece parts are cut out of the workpiece with a process beam. The process beam is moved relative to the workpiece support by a processing head and/or the workpiece is moved relative to the workpiece support by the clamping devices. A cutting process for processing the workpiece to produce the workpiece parts is interrupted at least once by a relaxation step for the workpiece. During the relaxation step at least one clamping device is released to relax the workpiece. The at least one clamping device is closed following the relaxation and before continuing the cutting process. A data processing program and a processing machine for producing the workpiece parts are also provided.

A holding table assembly has a base that includes three or more cylinder sections spaced apart at regular intervals in a circumferential direction, a circular recess formed at an upper part thereof, and a flow channel communicating with the cylinder sections and the circular recess. A holding table includes a holding surface inserted into the circular recess of the base that holds an ingot under suction. A circular plate has a plurality of minute holes and insertion holes formed at positions corresponding to each of the cylinder sections and spaced apart at regular intervals in the circumferential direction. Pistons are inserted in the cylinder sections, the number of pistons being equal to the number of cylinder sections, and support pins of which base ends abut against the pistons and tip ends are inserted in the insertion holes.

A method includes applying laser pulses along a direction to a side of a wafer to create first and second stealth damage regions at respective first and second depths in the wafer and to create cracks that extend in the wafer from the respective stealth damage regions and that are spaced apart from one another along the direction, applying a compressive and retractive cyclical force to the wafer along the third direction to propagate and join the cracks from the respective stealth damage regions together, and expanding the wafer to separate individual dies from the wafer.

The present invention relates to a bonding apparatus for a power terminal of a heating plate, for bonding the power terminal supplying power to a heating wire of a substrate. The bonding apparatus for a power terminal of a heating plate comprises: a chamber; a stage which is disposed in an inner space of the chamber and on which the substrate is placed; an upper press portion disposed in the inner space of the chamber to face the stage, provided to be vertically movable, and having a terminal fixing portion configured to fix the power terminal; and an elevating driver configured to move the upper press portion up and down, wherein the terminal fixing portion further includes a magnetic holder configured to hold the power terminal by a magnetic force.