A spacer assembly and method for using same to fix a first component to a second component are provided. The method includes positioning the first and second spacer segments between the first and second components, the first and second spacer segments each including an inner face, an opposite outer face, and an exterior surface extending along a longitudinal axis between the inner face and the outer face. The exterior surfaces of the first and second spacer segments are coaxially aligned and secured by a securing device such that the inner faces of the first and second spacer segments define supplementary non-perpendicular angles relative to the longitudinal axis and the outer faces of the first and second spacer segments are parallel to one another. The securing device and the first and second spacer segments are removed after the first component is mechanically coupled to the second component.

A method of welding a workpiece assembly includes positioning a flange adjacent to a web to form a workpiece assembly having an interface between a flange edge surface and a web side surface, and in which a web edge portion protrudes beyond a flange front surface on a front side of the workpiece assembly. The method additionally includes constraining the flange and the web against movement, and moving a plasma arc welding (PAW) torch, located on the front side of the workpiece assembly, along a lengthwise direction of the interface, while causing a plasma arc to pass through a flange edge portion and the web side surface, and generate molten material that joins the flange to the web.

A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.

A method of additive manufacture is disclosed. The method may include creating, by a 3D printer contained within an enclosure, a part having a weight greater than or equal to 2,000 kilograms. A gas management system may maintain gaseous oxygen within the enclosure atmospheric level. In some embodiments, a wheeled vehicle may transport the part from inside the enclosure, through an airlock, as the airlock operates to buffer between a gaseous environment within the enclosure and a gaseous environment outside the enclosure, and to a location exterior to both the enclosure and the airlock.

A method and an apparatus for collecting powder samples in real-time in powder bed fusion additive manufacturing may involves an ingester system for in-process collection and characterizations of powder samples. The collection may be performed periodically and uses the results of characterizations for adjustments in the powder bed fusion process. The ingester system of the present disclosure is capable of packaging powder samples collected in real-time into storage containers serving a multitude purposes of audit, process adjustments or actions.

A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.

A cleaving assembly and a method for cleaving a glass body having a face at a desired angle greater than 0 degrees are disclosed. The assembly comprises a laser device for emitting a laser beam, a rotating device, and a positioning fixture. The rotating device has a head that rotates about a central axis that is orthogonal to the laser beam. The positioning fixture is operatively mounted to the head and centered axially along the central axis and is also rotatably driven by the rotating device. The positioning fixture has a tapered surface that is transverse to the central axis and that supports the glass body at a predetermined angle relative to the central axis. Rotation of the positioning fixture about the central axis when the glass body is exposed to the laser beam, cleaves the face of the glass body at the desired angle due to the glass body being supported transverse to the central axis.

A method for matching and tracking workpieces in laser etching operation includes generating by the computer a label image that uniquely identifies the workpiece, moving a laser head to the workpiece, setting the laser head to a first power level by a power controller, etching the product image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the first power level in accordance with a product image in a pixel wise fashion across the workpiece, moving the laser head to the label by the transport mechanism, setting the laser head to a second power level by the power controller, etching the label image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the second power level in accordance with the label image in a pixel wise fashion across the label.

A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.

A spacer assembly and method for using same to fix a first component to a second component are provided. The method includes positioning the first and second spacer segments between the first and second components, the first and second spacer segments each including an inner face, an opposite outer face, and an exterior surface extending along a longitudinal axis between the inner face and the outer face. The exterior surfaces of the first and second spacer segments are coaxially aligned and secured by a securing device such that the inner faces of the first and second spacer segments define supplementary non-perpendicular angles relative to the longitudinal axis and the outer faces of the first and second spacer segments are parallel to one another. The securing device and the first and second spacer segments are removed after the first component is mechanically coupled to the second component.