Laser processing equipment includes a base, a platform, a first image capturing device, a main control device, a second image capturing device and a laser module. The platform, the first and second image capturing device and the laser module are arranged on the top surface of the base and are electrically connected with the main control device. The first image capturing device shoots a workpiece and generates a first image. The main control device searches a target area in the workpiece based on the first image, and the target area includes specific features. The second image capturing device shoots the target area and generates a second image. The main control device performs a feature identification step for specific features based on the first or second image and controls the laser module to process the workpiece based on the result of identification. The invention also provides a laser processing method.

A slag removal apparatus for removing slag from support plates provided to support an object to be processed in a cutting machine is disclosed. The slag removal apparatus includes a scraper including a plurality of blades around an outer surface of a bar crossing the support plates, and a plurality of slots formed in the respective blades along a length direction and thus formed around the bar and in a length direction of the bar, a rotation support unit to which the scraper is rotatably installed, a rotation driving unit rotating the scraper from the rotation support unit to remove slag attached to the support plates by the blades, when the support plates are inserted into the slots, a lifting unit lowering the scraper, for insertion of the support plates into the slots and raising the scraper to an original position by raising and lowering the rotation support unit, and a first transfer unit moving the rotation support unit along a length direction of the support plates to allow the scraper to remove the slag along the length direction of the support plates.

A system for producing an object is disclosed including a build device having a build area and a material bonding component to receive portions of a material that are used to produce the object, at least one gripper within the build area to contact the object to provide support and to provide for at least one of a heat sink for the object, a cold sink for the object, and electrical dissipation path from the object, and a movement mechanism to move the build device relative to the object to position the build device at a position to further produce the object. Another system and methods are also disclosed.

The disclosure relates to a workpiece support for a processing machine for flat workpieces, wherein the workpiece support has support elements forming a plurality of support points for the workpieces which span a workpiece support plane for the flat workpiece, wherein a transfer device for transferring at least one of the support elements from a first position into at least one further position is provided. At least one support element is thus configured to be transferred from the first position into the at least one further position even when a workpiece is loaded, by a movement parallel to the workpiece support plane. The disclosure also relates to a processing machine including such a workpiece support and a method for processing a workpiece.

A welder containing a weld part, a clamp and a number of tools that is for welding metal wires end-to-end to one another. The tools have a tool indicator that is either in complete or in non-complete condition, and can be processing tools used to finish the weld or testing tools allowing testing the weld once finished. Before starting the welding the first metal wire is held in the clamp. By that action all tool indicators are set to the non-complete condition. When a processing tool has been used, its processing tool indicator is set to complete. When the weld has passed the specification of a testing tool, the testing tool indicator is set to complete. When each processing and testing tool indicator is set to complete the clamp will open. In this case it is sure that the operator has done all necessary steps and checks on the weld.

Provided is a manufacturing method for a joint body having a blank material plated with a metal material and a hoop material plated with a metal material joined together by placing the hoop material on the blank material and causing a laser oscillation system to irradiate a surface of the hoop material with laser light to form a joint portion including a line-shaped welded portion where the blank material and the hoop material are joined together. In this manufacturing method, the hoop material is supplied to be placed on the blank material and form a predetermined gap d between the blank material and the hoop material, and the hoop material is irradiated with a laser at a position where the predetermined gap d is located between the blank material and the hoop material to join the blank material and the hoop material together by laser welding.

A slag removal apparatus for removing slag from support plates provided to support an object to be processed in a cutting machine is disclosed. The slag removal apparatus includes a scraper including a plurality of blades around an outer surface of a bar crossing the support plates, and a plurality of slots formed in the respective blades along a length direction and thus formed around the bar and in a length direction of the bar, a rotation support unit to which the scraper is rotatably installed, a rotation driving unit rotating the scraper from the rotation support unit to remove slag attached to the support plates by the blades, when the support plates are inserted into the slots, a lifting unit lowering the scraper, for insertion of the support plates into the slots and raising the scraper to an original position by raising and lowering the rotation support unit, and a first transfer unit moving the rotation support unit along a length direction of the support plates to allow the scraper to remove the slag along the length direction of the support plates.

A trimming and sizing apparatus for removing material from a metal piece including a travel way, a cutting assembly, and a table for holding the metal piece. The cutting assembly includes a carriage that travels along the travel way, a boom extending from the carriage in a direction perpendicular to the travel way, at least one cutting torch assembly extending from the boom and comprising a first trimming cutting torch and a second sectioning cutting torch, and a motor that rotates the second sectioning cutting torch in an arc around the first trimming cutting torch while the second sectioning cutting torch is simultaneously moved parallel to the longitudinal direction the travel way by the movement of the carriage. The apparatus may also include a deburring assembly opposite the cutting assembly. Also, a method of removing material from a metal piece using the trimming and sizing apparatus.

In an example method, a laser processing head is moved from an entrance region over a workpiece to a starting position above the workpiece. During this time, a distance control system is used to control the distance between the laser processing head and the workpiece based on measurements obtained from one or more distance sensors. Further, the laser processing head is moved from the starting position to a position beyond an edge of the workpiece. During this time, the distance control system is disengaged. When the laser processing head reaches the position beyond an edge of the workpiece, laser emission is initiated, and the laser processing head is moved back towards the starting position. Upon reaching the starting position, the distance control system is reengaged. The laser processing head is subsequently moved along a pre-determined path to cut the workpiece.

A method for dithering can include receiving, at a computer numerically controlled machine comprising a laser, a motion plan corresponding to a first image. The output of the laser can be dithered, in accordance with the motion plan, to effect a change in a material within an interior space of the computer numerically controlled machine. The change can substantially reproduce at least a portion of the first image on the material. The dithering can include providing laser energy to the material at a native resolution based at least on a spot size of the laser. The spot size can be determined based at least on one or more parameters of the computer numerically controlled machine and/or one or more properties of the material. The laser energy can be delivered at locations separated by a distance no less than the spot size.