A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

A laser apparatus including a stage. A target substrate is mounted on the stage. The laser apparatus further includes a coupling unit disposed below the stage and coupled with a conveying unit, the conveying unit conveying the stage. The laser apparatus additionally includes a discharge unit disposed at a predetermined position for laser machining, configured to communicate with the coupling unit when docked with the coupling unit, and configured to discharge foreign matter that is generated during laser machining.

A feed mechanism moves a workpiece relative to a cylindrical machining region of laser light. A light receiver receives the laser light that has passed through without being used for machining the workpiece. An intensity detector detects light intensity of the laser light thus received. A controller detects the end of machining on the basis of the light intensity thus detected.

A feed mechanism moves a workpiece relative to a cylindrical machining region of laser light. A light receiver receives the laser light that has passed through without being used for machining the workpiece. An intensity detector detects light intensity of the laser light thus received. A controller detects the end of machining on the basis of the light intensity thus detected.

A bonding apparatus includes a body part; a vacuum hole disposed in the body part; a first protruding part protruding in a first direction from a first surface of the body part; a second protruding part protruding from the first surface of the body part in the first direction and spaced farther apart from a center of the first surface of the body part than the first protruding part in a second direction intersecting with the first direction; and a trench defined by the first surface of the body part and second surfaces of the first protruding part, the second surfaces protruding in the first direction from the first surface of the body part, and the trench being connected to the vacuum hole, wherein the second protruding part protrudes farther from the first surface of the body part in the first direction than the first protruding part.

A bonding apparatus includes a body part; a vacuum hole disposed in the body part; a first protruding part protruding in a first direction from a first surface of the body part; a second protruding part protruding from the first surface of the body part in the first direction and spaced farther apart from a center of the first surface of the body part than the first protruding part in a second direction intersecting with the first direction; and a trench defined by the first surface of the body part and second surfaces of the first protruding part, the second surfaces protruding in the first direction from the first surface of the body part, and the trench being connected to the vacuum hole, wherein the second protruding part protrudes farther from the first surface of the body part in the first direction than the first protruding part.

A transport system for transporting material to be soldered through a soldering apparatus, and soldering apparatus with laterally movable middle support. The transport system for transporting the material to be soldered through the soldering apparatus, includes at least one transport track extending in the transport direction in which the material to be soldered is transportable in a transport plane in the transport direction, wherein the transport track includes two transport bars extending in the transport direction and at least one middle support with a middle bar extending in the transport direction. The middle bar has a revolving conveying means with folding elements, and the conveying means provides a feed in the transport direction and a return counter to the transport direction. The folding elements are displaceable between a support position and a folded position. Further provided is an adjusting device for transverse adjustment of the at least one middle support in a transverse direction running transversely to the transport direction, characterized in that a distance A between an underside of at least one transport bar facing away from the transport plane and the transport plane is smaller than a distance B between an upper side of the at least one middle support facing the transport plane and the transport plane, and that the adjustment device is designed such that the middle support with folding elements is movable in the folded position in the transverse direction underneath the at least one transport bar into a parked position provided laterally next to the transport bar.

A transport system for transporting material to be soldered through a soldering apparatus, and soldering apparatus with laterally movable middle support. The transport system for transporting the material to be soldered through the soldering apparatus, includes at least one transport track extending in the transport direction in which the material to be soldered is transportable in a transport plane in the transport direction, wherein the transport track includes two transport bars extending in the transport direction and at least one middle support with a middle bar extending in the transport direction. The middle bar has a revolving conveying means with folding elements, and the conveying means provides a feed in the transport direction and a return counter to the transport direction. The folding elements are displaceable between a support position and a folded position. Further provided is an adjusting device for transverse adjustment of the at least one middle support in a transverse direction running transversely to the transport direction, characterized in that a distance A between an underside of at least one transport bar facing away from the transport plane and the transport plane is smaller than a distance B between an upper side of the at least one middle support facing the transport plane and the transport plane, and that the adjustment device is designed such that the middle support with folding elements is movable in the folded position in the transverse direction underneath the at least one transport bar into a parked position provided laterally next to the transport bar.

Soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, with an entry and an exit for feeding and removing the printed circuit boards, with a process channel including a preheating zone, a soldering zone and/or a cooling zone, and including a main body and at least one cover hood movable between a closed position and an open position, the cover hood enclosing a hood compartment above the process channel in which fan motors are provided. A central suction channel is provided in the hood compartment, in that the first suction elements connected to the suction channel in the hood compartment are provided for the suction of hood compartment air from the hood compartment, in that second suction elements connected to the suction channel in the hood compartment are provided for the suction of process gas from the process channel, and in that a switching device is provided and is configured to switch between an operating mode in which hood compartment air is suctioned via the first suction elements and a cooling mode in which process gas is suctioned via the second suction elements.