An insulation film peeling method which radiates laser light onto a front end portion of an insulation film-coated conducting wire including a conducting wire and an insulation film in a longitudinal direction, and which peels a part of the insulation film up to a peeling boundary of a predetermined regulated peeling length, includes performing a rectilinear scan of a first region, in which a radiation position of the laser light moves from one side toward the other side and then moves from the other side toward the one side upon reaching the other side, and performing a unidirectional scan of a second region, in which the radiation of the laser light is performed from one side toward the other side and then the radiation position returns to the one side in a state in which the radiation of the laser light stops upon reaching the other side.

In order to provide a method for establishing an electrically conductive connection between an electrical line which includes a plurality of individual conductors and an electrically conductive component which is easily realizable but nevertheless leads to a corrosion resistant connection between the individual conductors of the electrical line and the electrically conductive component, it is proposed that the method includes producing a crimping element that surrounds the individual conductors sectionally from a crimping element preform by means of a crimping tool, and connecting at least a portion of the individual conductors to the electrically conductive component by an ultrasonic welding process by means of a sonotrode.

A terminal includes a tubular crimp portion that crimp connects with an electric wire. The tubular crimp portion is composed of a metal member. The tubular crimp portion includes a non-weld portion and a weld portion, the weld portion being formed by welding. A metal base material constituting the metal member of the non-weld portion includes a normal portion and an annealed portion.

A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by ultrasonic welding is provided with a monolithic connector body with a bore. An annular flare seat is angled radially outward from the bore toward a connector end of the connector; the annular flare seat open to the connector end of the connector. The flare seat may be provided with an annular flare seat corrugation.

A fixture assembly for welding a plurality of stator wire end pairs may include an anvil, a movable clamp configured to translate between an unclamped state and a clamped state, a first grounding electrode, and a second grounding electrode. The movable clamp may be configured to urge the plurality of stator wire ends against the anvil when in the clamped state. The moveable clamp includes a separator feature that generally extends toward the anvil. Each of the first grounding electrode and second grounding electrodes may be configured to translate between a clamped state and an unclamped state. When in the clamped state, each of the first and second grounding electrodes is configured to urge a pair of the plurality of stator wire end pairs against the separator feature.

A hairpin welding method welds wire ends of at least two copper wires, arranged flush next to one another, to one another by a laser beam. The laser beam is generated with a beam cross section that impinges on the wire ends at an end side and has a round core region and a ring region surrounding the round core region. A ratio of an external diameter of the ring region to a diameter of the core region is between 7:1 and 2:1. A ratio of a laser power in the core region to a laser power in the ring region is between 10:90 and 70:30.

An electrode welding method includes a laser irradiation apparatus preparation step of preparing a laser irradiation apparatus including a laser oscillator that emits a laser beam with a wavelength having absorbability with respect to a semiconductor chip and a spatial light modulator that adjusts the energy distribution of the laser beam emitted by the laser oscillator, an electrode positioning step of positioning, corresponding to electrodes of a wiring substrate, bump electrodes of a device, and an electrode welding step of irradiating the back surface of the semiconductor chip with the laser beam and welding the bump electrodes to the electrodes of the wiring substrate.

An inductive thermo-crimping apparatus is provided, which is provided for crimping a crimping body which is formed by the contact of the connecting body and the to-be-joined member. The inductive thermo-crimping apparatus includes a driving part, a stamper part, and a heating part, the driving part is connected to the stamper part, and the heating part is fixedly connected to the driving part. After the heating part is activated, the crimping body is disposed on the heating part. The heating part includes an inductive heating coil. The inductive heating coil surrounds in the heating part. The inductive heating coil is provided for heating the crimping body to soften the crimping body, in which the driving part is provided for driving the stamper part to press the soften crimping body, so that the connecting body and the to-be-joined member is crimped and to form a rigid crimping body after cooling. The present invention utilizes the coil with an alternative current to heat the crimping body by an electromagnetic induction, so that the process of the crimping technology is convenient and fast.

A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.

The present disclosure provides a battery and a portable electrical device. The battery includes a housing and a battery cell disposed in the housing; the battery cell includes electrodes and tabs, where the electrode includes a current collector and an active material layer, and the current collector includes a coating zone coated and an empty foil zone, and an end of the tab is welded to the empty foil zone by a laser welding process; a surface of the empty foil zone facing away from the tab has a plurality of welding zones arranged at intervals, and each welding zone comprises at least one line-shaped welding mark and a surface of the tab facing away from the empty foil zone has no welding mark. The protrusion of the present disclosure is less likely to pierce a separator between a positive electrode and a negative electrode.