B23K2101/38

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION

A method for producing an electrically conductive connection between a contact surface of a functional component and a connection component. The connection component is pressed against the contact surface of the functional component with a normal force using a bonding tool. The bonding tool and the connection component are brought in contact with same to vibrate ultrasonically. A laser beam is generated by a laser generator and directed onto the bonding tool, and preferably onto a tip of the bonding tool, whereby the tip of the bonding tool is heated. An actual temperature of the tip is contactlessly measured and the laser generator is operated intermittently and/or with an adjustable laser output such that a predefined target temperature is adjusted at the tip of the bonding tool.

DEVICE FOR HEATING AND DETERMINING AN ACTUAL TEMPERATURE OF A BONDING TOOL OF AN ULTRASONIC BONDING DEVICE

A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.

APPARATUS AND METHOD FOR DETECTING THE TEMPERATURE OF A BONDING TOOL DURING LASER-ASSISTED ULTRASONIC BONDING

An apparatus for detecting the temperature of a bonding tool during laser-assisted ultrasonic bonding, comprising an automatic bonding machine having the bonding tool, having a displacement and/or positioning module for the bonding tool and having a device for exciting the bonding tool to ultrasonically vibrate, comprising a laser generator for providing a laser beam, and comprising an optical waveguide for guiding the laser beam from the laser generator to the bonding tool, wherein the optical waveguide has a multi-part design, that a deflecting and beam-splitting unit is provided between at least two adjacent parts of the optical waveguide and that furthermore a temperature sensor is provided.

SYSTEM AND METHOD FOR MANUFACTURING A BUSBAR
20220193818 · 2022-06-23 ·

An assembly that may include a press that may form an indentation within a tab, a roller assembly including a rolling element that may compress a first tab portion of the tab that extends from the indentation against a busbar, and a welding device that may weld the first tab portion of the tab to the busbar.

CONTACTLESS CARD MANUFACTURING APPARATUS AND CONTACTLESS CARD MANUFACTURING METHOD
20220188591 · 2022-06-16 ·

Disclosed are a contactless card manufacturing apparatus and a contactless card manufacturing method. The contactless card manufacturing apparatus comprises: an antenna implantation device, wherein the antenna implantation device is used for implanting a copper wire into a card manufacturing base material; a chip fixing device, wherein the chip fixing device is used for placing a chip at a fixed position on the card manufacturing base material; a pin welding device, wherein the pin welding device is used for respectively welding two ends of a wire to a pin of the chip and to the copper wire; and a transmission device, wherein the transmission device is used for transmitting the card manufacturing base material between the antenna implantation device, the chip fixing device and the pin welding device. According to the contactless card manufacturing apparatus and the contactless card manufacturing method, by means of the transmission device transmitting the card manufacturing base material, the card manufacturing base material is transmitted between the devices corresponding to various processing links, and with the card manufacturing base material as a reference, a required chip and antenna are disposed on the surface of the card manufacturing base material, such that a contactless card is manufactured in a more automated and standardized manner, and the labor costs for the manufacturing are reduced.

Tight-Contact Jig for Secondary Battery Tab Laser Welding and Welding Method

Disclosed are a tight-contact jig for secondary battery tab laser welding including an upper tight-contact jig including a ring-shaped spray portion capable of performing surface spray in order to inhibit deterioration in weld quality due to reaction with hydrogen or oxygen in air at the time of laser welding for forming an electrode terminal and to inhibit the occurrence of short circuit due to deposition of spatter generated at the time of welding and a welding method.

METAL PLATE FOR RESISTANCE WELDING AND RESISTANCE WELDING METHOD USING THE SAME

Discussed are a metal plate for resistance welding and a resistance welding method using the same, wherein the metal plate is for being resistance-welded to an electrode terminal of a cylindrical battery, and the metal plate includes a body; and a pair of protrusion units located spaced apart from each other by a predetermined distance, the pair of protrusion unit being provided at one side surface of the body, and a slit is formed between the pair of protrusion units.

Device for welding rod-shaped electrical conductors and sonotrode for such a device

A device for welding rod-shaped electrical conductors and a sonotrode for such includes a compression space for receiving two connection regions of the conductors to be connected, said connection regions extending in a first axial direction (x-axis), the compression space being defined by a working surface of a sonotrode, which transmits ultrasonic vibrations, and a counterface of an anvil at two opposite sides in a second axial direction (z-axis) and by a boundary surface of a slider element, displaceable in the second axial direction (z-axis), and a boundary surface of a boundary element on two opposite sides in a third axial direction (y-axis). In a special contact zone, which is a section of the working surface of the sonotrode and serves to subject at least one connection region to ultrasonic vibrations, the working surface has a surface configuration that differs from a contact zone formed by the remaining working surface.

ELECTRIC CABLE WITH TERMINAL AND METHOD FOR MANUFACTURING ELECTRIC CABLE WITH TERMINAL

An electric cable includes a terminal, and a manufacture method thereof is to suppress shedding of wire strands from a core wire. The electric cable with terminal includes an end of an electric cable connected to the terminal. The electric cable includes a core wire that is a bundle of a plurality of wire strands. The terminal includes a connection portion in which the core wire is exposed at the end of the electric cable. The core wire is placed on the connection portion including a welded portion that is to be ultrasonic welded to the connection portion. The welded portion includes a high compression portion in which the core wire is compressed, and a low compression portion in which a position that is closer than the high compression portion to the end of the core wire is compressed at a compression lower than that of the high compression portion.

TERMINAL FIXING METHOD
20220181832 · 2022-06-09 · ·

A terminal fixing method, for fixing one or more terminals to a plurality of lands provided on a substrate by laser welding, includes: constructing the plurality of lands by one or more terminal installation lands on which the terminals are installed and one or more dummy lands each larger than each of the terminal installation lands; irradiating each of divided laser beams emitted from a laser oscillator toward a corresponding land of two or more lands in the plurality of lands by the laser welding; and constructing the two or more lands by two or more terminal installation lands in the terminal installation lands, or one or more terminal installation lands in the terminal installation lands and the one or more dummy lands.