A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.

There is provided a an apparatus for manufacturing a display device. An apparatus for manufacturing a display device comprises a body generating ultrasonic vibration; and a horn including a horn body portion connected to the body and amplifying the ultrasonic vibration and a horn tip portion connected to the horn body portion and applying the ultrasonic vibration onto a bonding object, wherein the horn body portion includes at least one body groove surrounded by the horn body portion and completely penetrating the horn body portion in a thickness direction from the surface of the horn body portion.

A bonding apparatus provided with a gas supplying unit for causing an inert gas to be sprayed from a spray aperture provided adjacent to a holding section of the bonding head. The spray aperture is provided so as to surround the holding section of the bonding head, in which a portion of the slits is a wide slit set to a higher jet flow rate of the inert gas than narrow slits of another portion, and the inert gas sprayed from the wide slit and the narrow slits forms an air curtain that surrounds the bonding portion between the semiconductor chip and the substrate. The inert gas sprayed from the wide slit forms a flow that passes between the semiconductor chip and the substrate.

Component mounting machine includes head, a device for moving head, transfer unit, and a mounting controller. Circular plate is an example of a container in which paste is placed. The bottom face of circular plate and the upper surface of the side wall have a predetermined height relationship. Height sensor is disposed on the lower face of head. Height sensor measures the height of the upper surface of the side wall of circular plate, which is a measurement point. The mounting controller recognizes the height of the bottom face of circular plate or the height of the surface of coating film disposed on circular plate from the height of the top surface of the side wall of circular plate measured by height sensor.

There is provided a laser welding method of joining a bus bar and an intermediate member by irradiating a laser beam on a surface of the intermediate member with the bus bar and the intermediate member being overlapped with each other. The laser welding method includes: a first welding step of forming a first welding line by moving the laser beam in a C shape from a welding start point to a welding intermediate point when viewed from a direction orthogonal to a surface of the intermediate member; and a second welding step of forming a second welding line continuous with the first welding line by moving the laser beam from the welding intermediate point to a welding end point located in a welding region formed inside the first welding line from the welding start point and the welding intermediate point.

An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.

The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected. It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.

A peeling method at low cost with high mass productivity is provided. A silicon layer having a function of releasing hydrogen by irradiation with light is formed over a formation substrate, a first layer is formed using a photosensitive material over the silicon layer, an opening is formed in a portion of the first layer that overlaps with the silicon layer by a photolithography method and the first layer is heated to form a resin layer having an opening, a transistor including an oxide semiconductor in a channel formation region is formed over the resin layer, a conductive layer is formed to overlap with the opening of the resin layer and the silicon layer, the silicon layer is irradiated with light using a laser, and the transistor and the formation substrate are separated from each other.

A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.

A manufacturing method for a printed circuit board includes: passing a first laser beam output from a laser output device through a first aperture so as to define an outer diameter of the first laser beam, positioning the first laser beam by an optical axis positioning device including a galvano device and an fθ lens, and irradiating the printed circuit board with the first laser beam such that a through-hole is formed in a copper layer; and passing a second laser beam output from the laser output device through a second aperture so as to define an outer diameter of the second laser beam whereby a diameter of the second aperture is smaller than a diameter of the first aperture, positioning the second laser beam by the optical axis positioning device, and irradiating the printed circuit board with the second laser beam such that an insulating layer is processed.