B23K2103/12

Bimetallic joining with powdered metal fillers

A method of attaching a first metal object to a second metal object is presented. The first metal object and the second metal object are dissimilar materials. The first metal object comprises an upper surface and a lower surface. The method comprises: positioning the first metal object in intimate contact with the second metal object such that the second metal object is in contact with the lower surface of the first metal object; identifying at least one attachment location on the upper surface of the first metal object where the first metal object is in intimate contact with the second metal object; adding a powdered metal on the upper surface of the first metal object at the at least one attachment location; and firing a heat source at the powdered metal to melt the powdered metal and drive the melted powdered metal through the first metal object and into the second metal object.

BATTERY ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

In a battery assembly including a first battery and a second battery, the first battery includes a negative terminal, and the negative terminal has a first metal section and a second metal section formed of a metal different from the first metal section. The second metal section is joined to the top of the first metal section with the dissimilar metal joining, and the second metal section is formed with a joint surface and a recessed portion. A method of manufacturing the battery assembly includes a process of inserting a welding assist member into the recessed portion, and a process of placing a bus bar on the joint surface of the negative terminal in which the welding assist member is inserted in the recessed portion, and joining the bus bar onto the joint surface of the negative terminal by laser welding.

FRICTION HEAD AND FRICTION ADDITIVE MANUFACTURING METHOD OF ADJUSTING COMPONENTS AND SYNCHRONOUSLY FEEDING MATERIAL

A friction head and a friction additive manufacturing method of adjusting components and synchronously feeding material are provided. The friction head includes a friction body, a charging part and a feeding part. An axis of the friction body, an axis of the charging part and an axis of the feeding part are coincided with one another. The charging part and the feeding part are sleeved on the friction body. Spiral groove(s) extending in a same direction is formed in an inner ring wall of the feeding part. The spiral groove(s) extends through the inner ring wall of the feeding part and is symmetrical about the axis of the feeding part. The spiral groove(s) and a lower outer surface of the feeding part form spiral feeding channel(s). An upper end of each feeding channel is communicated with a corresponding one of feeding hole(s).

Zinc-cobalt barrier for interface in solder bond applications

A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.

PRODUCTION METHOD FOR WELDING A COPPER CONDUCTOR TO A WORKPIECE, WORKPIECE, AND VEHICLE
20220355415 · 2022-11-10 ·

A production method for welding a copper conductor to an electrical contact element of a workpiece for electrical contacting. The contact element has a first copper alloy, and the method has the following method steps: mechanical contacting between the copper conductor and the contact element at a join of the contact element, the welding of the copper conductor to the contact element being carried out with the aid of a focused laser beam, the laser beam having a wavelength of less than or equal to 0.6 μm, and a welded seam is produced which has a welding depth that is greater than or equal to 100 μm.

COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
20220359340 · 2022-11-10 · ·

A copper/ceramic bonded body includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12) and the ceramic member (11) being bonded to each other, in which a Mg solid solution layer in which Mg is solid-soluted in a Cu matrix is formed at a bonding interface between the copper member (12) and the ceramic member (11), an active metal nitride layer (41) containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a thickness of the active metal nitride layer (41) is set to be in a range of 0.05 μm or more and 1.2 μm or less.

ULTRASONIC WELDING SYSTEMS AND METHODS OF USING THE SAME

An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.

Component joining apparatus, component joining method and mounted structure

A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.

METHOD FOR MANUFACTURING STATOR FOR ROTARY ELECTRIC MACHINE

A method for manufacturing a stator for a rotary electric machine including: a process of abutting, on each other, tip end parts of one coil piece and an other one coil piece for forming a stator coil of a rotary electric machine; and a welding process of irradiating a welding target location regarding the tip end part having been abutted with a laser beam having a wavelength of 0.6 μm or less, in which in the welding process, the laser beam is generated for every pulse oscillation in a laser oscillator in a mode of having a laser output of 3.0 kW or more, and in at least a part of a period during one pulse oscillation, the laser beam is moved so that an irradiation position changes linearly parallel to an abutment surface of the tip end part.

BONDED BODY AND METHOD FOR MANUFACTURING BONDED BODY
20230099179 · 2023-03-30 · ·

A bonded body is a bonded body in which a first metal member is bonded to a second metal member, where the first metal member is formed of a material having a hardness higher than that of the second metal member. The bonded body has a structure in which the second metal member is inserted into a protruded and recessed portion formed on a bonding surface of the first metal member, and the bonded body has a region in which the first metal member is in direct contact with the second metal member, and a gap between the first metal member and the second metal member is filled with a resin material.