An aluminum alloy brazing sheet including a core material, a sacrificial material provided on one surface of the core material, a brazing filler material provided on the other surface side of the core material, and an intermediate layer provided between the core material and the brazing filler material. The core material contains Si: 0.30 to 1.00 mass %, Mn: 0.50 to 2.00 mass %, Cu: 0.60 to 1.20 mass %, Mg: 0.05 to 0.80 mass %, and Al. The sacrificial material contains Si: 0.10 to 1.20 mass %, Zn: 2.00 to 7.00 mass %, Mn: 0.40 mass % or less, and Al. The intermediate layer contains Si: 0.05 to 1.20 mass %, Mn: 0.50 to 2.00 mass %, Cu: 0.10 to 1.20 mass %, and Al.

A stable bonding processing for metal, of which at least a part is plated, is provided. A plated metal bonding apparatus performs bonding of a first metal and a second metal. At least one from among the first metal and the second metal has a plated bonding portion where the bonding processing is to be performed. A bonding processing unit performs bonding of the first metal and the second metal using sound vibration and/or ultrasound vibration. The bonding processing unit performs the bonding processing using a plated material or otherwise using a metal portion in a state in which a plating material has been removed.

A method for joining a first part formed of an aluminum material to a second part formed of a steel material by metal inert gas welding and cold metal transfer is provided. An aluminum filler material forms a fillet joint between the parts and provides a structure for automotive body applications, such an aluminum bumper extrusion joined to a steel crush box connection. The first part includes a notch for hiding the start and end of the joint. A transition plate formed of a mixture of aluminum material and steel material can be disposed between the first part and the second part to provide the notch. The second part can include a mechanical fastener further joining the parts together. In another embodiment, the second part includes a plurality of dimples and is welded to the first part along the dimples.

The disclosed technology generally relates to welding, and more particularly to welding multi-layered structures. In an aspect, a method of welding multi-layered metallic workpieces comprises providing a pair of multi-layered workpieces. Each of the workpieces has a base layer and an cladding layer, where the cladding layer comprises a corrosion resistant element adapted to suppress corrosion in a ferrous alloy. The method additionally comprises forming a root pass weld bead to join cladding layers of the workpieces using a first filler wire comprising the corrosion resistant element and focusing a first laser beam on the cladding layers. The method additionally comprises forming one or more weld beads to join base layers of the workpieces by resistively heating a second filler wire and directing a second laser beam over the root pass weld bead. The method is such that a concentration of the corrosion-resistant element in the one or more weld beads is less than 50% of a concentration of the corrosion-resistant element in the root pass weld bead.

Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.

Local metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a solar cell includes a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding a semiconductor region.

Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

A method for monitoring the energy density of a laser beam using parameters of the laser beam including regularly applying the laser beam to a reference substrate and measuring, with each application, the resulting light intensity; identifying a change in the light intensity on the reference substrate between at least two measurements; and, when the change in the light intensity is higher than a predetermined threshold, determining the unstable parameter or parameters of the energy density of the laser beam.

Provided herein are anode assembly, conductive contact strips, electrochemical cells containing the anode assembly and the conductive contact strips, and methods to use and manufacture the same, where the anode assembly includes a plurality of V-shaped, U-shaped, or Z-shaped elements positioned outside the anode shell and in electrical contact with the anode.