A method of fabricating a decorated molding article includes forming an all-in-one coating on a substrate and performing a curing step, thereby forming a composite layer structure with a protective effect, a color effect, and a bonding effect. The composite layer structure may form a molded film with better physical properties (e.g., higher hardness, better protection effect, and the like) after the blister molding process. Therefore, the molded film of the embodiments may be applied to a laser engraving process to form a variety of light-transmitting decorated molding articles.

Markings for electronic devices are disclosed. Markings are formed through a laser-based process which transforms a colorant in a multilayer structure disposed along an interior surface of a cover. The transformed colorant defines a marking visible along an external surface of the electronic device.

A solder material is provided. The solder material may include a first amount of particles having particle sizes forming a first size distribution, a second amount of particles having particle sizes forming a second size distribution, the particle sizes of the second size distribution being larger than the particle sizes of the first size distribution, and a solder base material in which the first amount of particles and the second amount of particles is distributed. The first amount of particles and the second amount of particles consist of or essentially consist of a metal of a first group of metals. The first group of metals includes copper, silver, gold, palladium, platinum, iron, cobalt, and aluminum. The solder base material includes a metal of a second group of metals. The second group of metals includes tin, indium, zinc, gallium, germanium, antimony, and bismuth.

An aluminum alloy brazing sheet including a core material, a sacrificial material provided on one surface of the core material, a brazing filler material provided on the other surface side of the core material, and an intermediate layer provided between the core material and the brazing filler material. The core material contains Si: 0.30 to 1.00 mass %, Mn: 0.50 to 2.00 mass %, Cu: 0.60 to 1.20 mass %, Mg: 0.05 to 0.80 mass %, and Al. The sacrificial material contains Si: 0.10 to 1.20 mass %, Zn: 2.00 to 7.00 mass %, Mn: 0.40 mass % or less, and Al. The intermediate layer contains Si: 0.05 to 1.20 mass %, Mn: 0.50 to 2.00 mass %, Cu: 0.10 to 1.20 mass %, and Al.

An aluminum brazing sheet for flux-free brazing having a multilayer structure of two or more layers including at least one core material layer and one brazing material layer, wherein the brazing material layer is positioned on one or both sides of the core material layer and on an outermost surface of the brazing sheet. The brazing material layer is made of an Al—Si—Mg—X brazing material containing: in mass%, 0.05 to 2.0% of Mg, and 2.0 to 14.0% of Si, and further containing one or more of 0.01 to 0.3% of Bi, Ga, Sn, In and Pb, a total amount of Bi, Ga, Sn, In and Pb being 0.5% or less. X indicates one or more of Bi, Ga, Sn, In and Pb.

Provided is a metal particle for adhesive paste. The metal particle may include a core including at least one metal; and a shell on at least one surface of the core and including at least one metal and nanoparticles. The metal particle may be a transient liquid phase particle and the at least one metal of the core may have a higher melting point than a melting point of the at least one metal of the shell. In addition, provided are a method of preparing the metal particle for adhesive paste, a composite bonding structure formed from the metal particle for adhesive paste, and a semiconductor device including the composite bonding structure.

Disclosed is a clad steel plate with further improved low temperature toughness along with excellent HIC resistance while ensuring a tensile strength of 535 MPa or more. A clad steel plate includes: a base steel; and a clad metal made of a corrosion resistant alloy bonded to one surface of the base steel, in which the base steel has: a chemical composition with appropriately controlled values of ACR and P.sub.HIC; and a steel microstructure in which bainite is present in an area fraction of 94% or more at a ½ thickness position in a thickness direction of the base steel, and with an average crystal grain size of 25 μm or less, and shear strength at a bonded interface between the base steel and the cladding metal is 300 MPa or more.

Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

A composite component includes a reinforcement bonded to a base component by a bond formed by, or reinforced with, a localized coupling in the base component. The bond may be formed by ultrasonic additive manufacturing. The localized coupling may include a compression of the base component, a weld in the base component, or a heat affected zone of the weld. Where the bond is formed by the localized coupling, the localized coupling encompasses the reinforcement. Where the bond is reinforced with the localized coupling, the localized coupling may encompass the reinforcement, or be arranged at an inside radius of a turn in the reinforcement. The reinforcement results in the composite component having enhanced properties such as lower density, increased strength, stiffness, or energy absorption capabilities.

The invention relates to a device (1) for laser cladding, a method (100) for operating such a device, and a component (4′) produced using such a method and/or such a device comprising a laser cladding unit (2) having at least one laser cladding head (3) disposed thereon, one or more material sources (5) for supplying the laser cladding head with a material (M) to be applied, and a laser beam source (6) for supplying the laser cladding head with laser light (L) for carrying out the laser cladding, wherein the device is configured to apply material layers (42, 43, 44) from an adjacent application cladding track (MS) to a surface (41) of a component (4) in the form of at least a first layer (42) made from a material (M) that comprises structures (42s) projecting from the surface of the first layer and having a first hardness (H1), and a second layer (43) applied thereto made from a material (M) having a second hardness (H2) that is less than the first hardness, and the application process is controlled so that the second layer at least partly covers the structures projecting from the first layer.