Patent classifications
B23K2103/166
BRAZING ALLOY
The present invention relates to new brazing alloys containing copper, silver, zinc, manganese, and indium, and a method for their production and their use.
TIN-SILVER DIFFUSION SOLDERING FOR THIN JOINTS WITHOUT FLUX
A method of bonding two components includes plating a first of the components with a first silver layer, a tin layer, and a second silver layer, plating a second of the components with silver, inserting the first and second components into a pre-heated press, and applying pressure to the components causing the components to bond. A stack of layers has a first component layer, a first silver layer, a tin layer, a second silver layer, a second component silver layer, and a second component layer.
METHOD FOR CUTTING OBJECTS OUT OF AN AT LEAST PARTIALLY TWO-PLY WEB OF MATERIAL BY MEANS OF A CUTTING DEVICE
Method for cutting objects out of an at least partially two-ply web of material by means of a cutting device, wherein two material plies are connected to one another at least partially in a linear, strip-like and/or areal manner. The position of the respective object to be cut out is detected contactlessly on the basis of changes in structure in the material, these being part of the object which arise on account of those regions in the web of material which are connected to one another in a linear, strip-like and/or areal manner. The position of the object is detected in the web of material at least on the basis of previously determined and stored, prominent and spaced-apart geometrical part shapes of those regions of the object which are connected to one another in a linear, strip-like and/or areal manner.
ANODE ASSEMBLY, CONTACT STRIPS, ELECTROCHEMICAL CELL, AND METHODS TO USE AND MANUFACTURE THEREOF
Provided herein are anode assembly, conductive contact strips, electrochemical cells containing the anode assembly and the conductive contact strips, and methods to use and manufacture the same, where the anode assembly includes a plurality of V-shaped, U-shaped, or Z-shaped elements positioned outside the anode shell and in electrical contact with the anode.
METHOD FOR PRODUCING A RAIL-SHAPED HYBRID COMPONENT, AND SUCH A HYBRID COMPONENT
In a method for producing a rail-shaped hybrid component, in particular for an aircraft or spacecraft, a second rail component made of a titanium material is positioned on a first bar of a first profile rail that is made of a carbon-fiber reinforced plastic material and moved in an advancing direction, in a fixed position relative to the first profile rail, such that a bar portion of the first bar is arranged between a first connecting portion of the second rail component and a second connecting portion of the second rail component, and the second rail component is cohesively connected to the first profile rail. Furthermore, the hybrid component has a first profile rail made of a carbon-fiber reinforced plastic material and a second rail component made of a titanium material.
MULTI-LAYER FLAT STEEL PRODUCT AND COMPONENT PRODUCED THEREFROM
A multilayer flat steel product may include a multitude of mutually bonded steel alloy layers. A steel of a first steel alloy may be provided in at least one of the steel alloy layers, and a steel of a second steel alloy different than the first steel alloy may be provided in at least one of the other steel alloy layers. The steel of the first steel alloy may have high strength, and the steel of the second steel alloy may have lower strength and lower carbon content. To enable function-optimized modelling of local material properties in all directions, at least one steel of the first steel alloy and at least one steel of the second steel alloy may be present at least within one layer of the flat steel product. Further, a component, such as for a motor vehicle body, may be comprised of a corresponding flat steel product.
METHOD OF PRODUCTION OF BRAZED JOINT AND SUCH A BRAZED JOINT
A brazed joint having excellent tensile strength (TSS and CTS) and a method of production of the same are provided. A sheet combination 200 comprised of steel sheets 210, 220 between which a brazing filler metal 230 is clamped is heated at a temperature of the Ac3 point of the steel sheet (matrix material) or more. The Ar3 point of the regions near the brazing filler metal at the steel sheets is made higher than the Ar3 point of the steel sheets (matrix material), then the quenching start temperature X is made a temperature of the Ar3 point of the steel sheet (matrix material) or less and hot stamping is performed to produce a brazed joint.
METHOD OF CREATING A BONDED STRUCTURE AND APPARATUSES FOR SAME
A method for creating a bonded zinc-coated structure is provided. In another aspect, a sheet metal joining system includes a heated roller contacting a sheet metal workpiece to braze together zinc-based coatings. A further aspect employs a zinc coated metal sandwich including a core having peaks and valleys.
METHODS AND SYSTEMS FOR CLADDING
A method of attaching a cladding element to a base element. A first inner side of the cladding element is positioned spaced apart from a second inner side of the base element to define a slot therebetween, and one or more heating elements are located in the slot. A non-oxidizing atmosphere is provided in the slot, and the heating element is energized, to heat at least portions of the cladding element and the base element to a hot working temperature. While at the hot working temperature, the first and second inner sides are engaged with each other, and one or both are moved relative to the other, for plastic deformation of the first and second inner sides, to subject the portions of the cladding element and the base element to shear stresses. The portions are allowed to cool, for recrystallization thereof.
LOCAL METALLIZATION FOR SEMICONDUCTOR SUBSTRATES USING A LASER BEAM
Local metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a solar cell includes a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding a semiconductor region.