A method for separating a solid-state layer from a solid-state material includes: moving the solid-state material relative to a laser processing system; successively emitting a plurality of laser beams from the laser processing system to the solid-state material to create modifications within the solid-state material; adjusting the laser processing system for defined focusing of the plurality of laser beams and/or for continuous adjustment of energy of the plurality of laser beams as a function of at least one parameter; and detaching the solid-state layer from the solid-state material in a region of the modifications.

A method for making an article is disclosed. According to the method, a digital model of the article is generated. The digital model is inputted into an additive manufacturing apparatus comprising an energy source. The additive manufacturing apparatus applies energy from the energy source to successively applied incremental quantities of a powder to fuse the powder to form the article corresponding to the digital model. The powder particles individually include a composite core including a first phase of a first metal and a second phase of a ceramic. A first shell including a second metal is disposed over the core.

Disclosed are a high-strength corrosion-resistant cladding chequered steel and a manufacturing method therefor. The high-strength corrosion-resistant cladding chequered steel includes a substrate and a chequered cladding layer cladded on the substrate by single-sided or double-sided rolling. The mass percentages of the chemical elements of the substrate are: C: 0.01% to 0.20%, Si: 0.10% to 0.5%, Mn: 0.5% to 2.0%, Al: 0.02% to 0.04%, Ti: 0.005% to 0.018%, Nb: 0.005% to 0.020%, 0<B≤0.0003%, N≤0.006%, and the balance being steel and other inevitable impurities. The high-strength corrosion-resistant cladding steel plate has a high strength, a high corrosion resistance, a yield strength ≥470 MPa, a tensile strength ≥610 MPa, a shear strength ≥410 MPa, and an elongation ≥40%.

Disclosed is a clad steel plate with further improved low temperature toughness along with excellent HIC resistance while ensuring a tensile strength of 535 MPa or more. A clad steel plate includes: a base steel; and a clad metal made of a corrosion resistant alloy bonded to one surface of the base steel, in which the base steel has: a chemical composition with appropriately controlled values of ACR and P.sub.HIC; and a steel microstructure in which bainite is present in an area fraction of 94% or more at a ½ thickness position in a thickness direction of the base steel, and with an average crystal grain size of 25 μm or less, and shear strength at a bonded interface between the base steel and the cladding metal is 300 MPa or more.

Provided is an Al—Fe-alloy plated steel sheet for hot forming, having excellent TWB welding characteristics since excellent hardness uniformity of a TWB weld zone after hot forming is obtained by suitably controlling a batch annealing condition, after plating Al, such that an Al—Fe-alloy layer is formed; a hot forming member; and manufacturing methods therefor.

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

A stable bonding processing for metal, of which at least a part is plated, is provided. A plated metal bonding apparatus performs bonding of a first metal and a second metal. At least one from among the first metal and the second metal has a plated bonding portion where the bonding processing is to be performed. A bonding processing unit performs bonding of the first metal and the second metal using sound vibration and/or ultrasound vibration. The bonding processing unit performs the bonding processing using a plated material or otherwise using a metal portion in a state in which a plating material has been removed.

A method of fabricating a decorated molding article includes forming an all-in-one coating on a substrate and performing a curing step, thereby forming a composite layer structure with a protective effect, a color effect, and a bonding effect. The composite layer structure may form a molded film with better physical properties (e.g., higher hardness, better protection effect, and the like) after the blister molding process. Therefore, the molded film of the embodiments may be applied to a laser engraving process to form a variety of light-transmitting decorated molding articles.

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

Disclosed herein are methods of bonding a multi-layer film to a substrate and resulting structures thereof. A method of laser bonding a multi-layer film to a substrate can include forming a film over a first surface of a first substrate that is transmissive to light at a first wavelength. The film may include a reflective layer that is reflective to light at the first wavelength and a refractive layer that is refractive to light at the first wavelength. The method may include irradiating a region of the film using laser radiation passing through the first substrate. A wavelength profile of the laser radiation can have a peak at about the first wavelength. The first wavelength can be between about 300 nm and about 5000 nm.