A structure and a method for mounting thermocouple on an intermetallic compounds such as TiAl by suppressing occurrence of cracks are provided. A thermocouple mounting structure is provided with a substrate, a coating formed on the substrate and a foil joined on the coating, and sandwiches a thermocouple between the substrate and the foil. A thermocouple mounting method includes forming a coating on a substrate and welding a foil on the coating, and the welding includes arranging a thermocouple so that the substrate and the foil sandwiches the thermocouple. Occurrence of cracks in the substrate formed with intermetallic compounds can be suppressed by providing a thermal spray coating between the substrate and the foil.

A welding method for welding an overlapping part of a first member and a second member includes: a first welding step of forming a friction-stirred part at a one-end-side spot being a spot that is closest to one end of the overlapping part by plunging a rotary tool into the one-end-side spot; a second welding step of forming a friction-stirred part at an other-end-side spot that is located away from the one-end-side spot and closer to the other end by plunging the rotary tool into the other-end-side spot; and a third welding step of forming a friction-stirred part at an intermediate spot located between the one-end-side spot and the other-end-side spot by plunging the rotary tool into the intermediate spot.

An interlayered structure for joining of dissimilar materials, includes a first material substrate, a second material substrate having a composition dissimilar from a composition of the first material substrate, and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers' solubility within the composition of the first material substrate. The last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers' solubility within the composition of the second material substrate. At least one of the plurality of interlayers is a sintered powder interlayer.

An interlayered structure for joining of dissimilar materials includes: a first material substrate; a second material substrate having a composition dissimilar from a composition of the first material substrate; and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers within the composition of the first material substrate, and the last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate.

There is provided a welding structure member excellent in corrosion resistance in an environment where high-concentration sulfuric acid condenses, the welding structure member including base material having a chemical composition containing, in mass percent, C0.05%, Si1.0%, Mn2.0%, P0.04%, S0.01%, Ni: 12.0 to 27.0%, Cr: 15.0% or more to less than 20.0%, Cu: more than 3.0% to 8.0% or less, Mo: more than 2.0% to 5.0% or less, Nb1.0%, Ti0.5%, Co0.5%, Sn0.1%, W5.0%, Zr1.0%, Al0.5%, N<0.05%, Ca0.01%, B0.01%, and REM0.01%, with the balance: Fe and unavoidable impurities, and the welding structure member including weld metal having a chemical composition containing, in mass percent, C0.10%, Si0.50%, Mn3.5%, P0.03%, S0.03%, Cu0.50%, Ni: 51.0 to 80.0%, Cr: 14.5 to 23.0%, Mo0.10%, Al0.40%, Ti+Nb+Ta4.90%, Co2.5%, V0.35%, and W4.5%, with the balance: Fe and unavoidable impurities.

Present embodiments include a system that includes a welding tool configured to receive a welding wire from a wire feeder, to receive welding power from a power source, and to supply the welding wire to a workpiece during a welding process. The system also includes a mechanical oscillation system configured to mechanically oscillate a structural component toward and away from the workpiece. The structural component is external to the wire feeder and the power source. The system further comprises control circuitry configured to control the welding power based on feedback relating to the welding process.

An example method for joining metals is described herein. The method can include forming an intermediate joint between a light metal member and a metal insert, where the intermediate joint is formed using a solid state welding process. The method can also include forming a primary joint between the light metal member and a high strength steel member, where the primary joint is formed using a welding process that produces coalescence at a temperature above the melting point of the light metal member and/or the high-strength steel member.

A process and apparatus are disclosed for the deposition of a layer of a first material onto a substrate of a second material. Powder particles of the first material are entrained into a carrier gas flow to form a powder beam directed to impinge on the substrate. This defines a powder beam footprint region at the substrate. The powder beam and the substrate are moved relative to each other to move the powder beam footprint relative to the substrate, thereby to deposit the layer of the first material. A laser is operated to cause direct, local heating of at least one of a forward substrate region and a powder beam footprint region. The laser beam direction is defined with reference to a plane coincident with or tangential to a surface of the substrate at the center of the laser beam footprint in terms of an elevation angle from the plane to the laser beam direction and in terms of an acute azimuthal angle from the movement direction to the laser beam direction. The elevation angle is 80 or less and the azimuthal angle is 60 or less. In the apparatus, there are provided at least three laser sources arrayed around the powder beam footprint, the angular spacing between the laser sources being 120 or less.

Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 m.

Solid-state joining of preformed features, such as bosses, flanges, gaskets, centralizers and other features to substrates or cast parts by a solid-state MELD additive manufacturing process is disclosed. Joining can be between same or different materials using same, similar or dissimilar filler material than the materials of the feature and the part that need to be joined.