A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.

The present invention relates to an improved cutting device and an improved cutting method, specifically For processing and cutting sheets of a stiff material, such as cardboard and others, in which the sheets are supplied and moved In a stable way along a first direction, and a laser cutting unit (or at least the resulting laser beams) is moved along a second, substantially perpendicular direction, in which by coordinating the two movements, a desired cut is executed in the sheets.

A system for generating a G-code for controlling an operation of a laser-cutting machine to cut parts from a sheet of material, upon receiving cutting data specifying a cutting order of parts and a cutting order of edges of each part, tests the parts for potential distortions and generates a G-code to avoid the potential distortion. For testing a current part, the system detects a potential distortion when the final edge of the current part is adjacent to an edge of a previously cut part scheduled for cutting before the current part according to the cutting order of parts. The system modifies the cutting order to select the modified cutting order for which the final edge is not adjacent to any edge of any previously cut part.

A method for producing a diffusion-optimized tipping paper for tobacco products, especially filter cigarettes, by plasma perforation of the web of tipping paper for the purpose of maximum carbon monoxide reduction, wherein the diffusivity and the permeability P of the perforated tipping paper are measured in-line and diffusivity is maximized by controlling the perforation parameters, the definable target permeability P.sub.soll being maintained at all times.

Disclosed are methods and apparatus for cleaning a substrate, such as a fabric material, involving the application of optical energy to the substrate, typically in the form of a beam of light, where the energy of the beam causes removal of the contaminant from substrate, such as from the fibres of a fabric material. The cleaning may occur via any mechanism, including one or more of, alone or in any combination, ablation, melting, heating or reaction with the substrate or contaminant or agent introduced to aid in the cleaning. The optical energy is typically applied to a selected area of the substrate (e.g., as a beam), and the substrate and beam or optical energy source moved relative to one another so as to clean a larger area of the substrate, either by moving the substrate or the beam, or both. Movement of the beam with respect to the substrate can be attained through a beam scanning mechanism or through movement of the optical source itself.

The present disclosure includes systems and method relating to laser marking, in particular an apparatus comprises a fiber laser operable to produce a laser beam, an optics assembly operable to focus and direct the laser beam onto a non-metalized layer side of a substrate, wherein the substrate comprises the non-metalized layer side comprising a nonmetalized material and a metalized layer side comprising a metalized material, the metalized layer side being opposite the non-metalized layer side; and electronics communicatively coupled with the fiber laser and the optics assembly, the electronics being operable to control the fiber laser and the optics assembly, based on one or more laser settings, to direct the laser beam through the non-metalized layer side to be absorbed by the metalized layer side, generate a laser marking on the metalized material, and avoid generating the laser marking on the non-metalized material.

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

A device for cutting a web of material comprises movement means for moving a web of material to be cut, defining a feed path for the web at least partly rotatable about a central axis and equipped with at least one conveyor mounted around the central axis, at least one cutting head equipped with a laser source and an optical system configured to direct the laser beam towards a cutting zone, where the optical system of the cutting head comprises at least one directing member located inside the conveyor to direct the laser beam away from the central axis towards the cutting zone.

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

A lab-on-skin biosensor for detecting target molecule and vital sign monitoring, a method of manufacturing, and a method of using the same, wherein the lab-on-skin biosensor is fabricated with a microfluidics layer, a moisture resistant layer, a multimodal sensing layer comprising an electrode, and a logic circuit that may include a processor and non-transitory memory with computer executable instructions embedded thereon.