A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

The present disclosure provides a printer system based on high power, high brightness visible laser source for improved resolution and printing speeds. Visible laser devices based on high power visible laser diodes can be scaled using the stimulated Raman scattering process to create a high power, high brightness visible laser source.

A method of forming openings in a polymer layer includes positioning a layer of a material over a cavity such that a portion of the first material lies over a cavity, ablating the portion of the material at a first shape, and ablating the portion of the material at a second shape, wherein the second shape lies within the first shape. A method of forming openings in a polymer layer includes positioning a layer of a first material over a second material having a cavity such that a portion of the first material lies over the cavity, ablating the portion of the first material over the cavity at a first shape, and ablating the portion of the second material over the cavity at a second shape, wherein the second shape lies within the first shape.

A method of inserting a rivet into a workpiece comprises moving the rivet and workpiece relative to one another, along a longitudinal axis of the rivet, so as to drive the rivet into the workpiece. The rivet is rotated about its longitudinal axis, relative to the workpiece, for at least part of the time during which it is in contact with the workpiece. The speed of said rotation, or the speed of movement along the longitudinal axis of the rivet, is altered at least once before driving of the rivet into the workpiece is complete. One axial end of the rivet has a tip for piercing the workpiece, and the rivet has a substantially cylindrical shank extending longitudinally from the tip. The shank has one or more surface irregularities.

The present invention involves laser machining polymer substrates to form a stent with laser parameters that minimize damage to the substrate in a surface region adjacent to the machined edge surface. The wavelength and pulse width are selected for this unique application and they can be controlled to minimize the surface modifications (such as voids, cracks which are induced by the laser-material interaction) which contribute to the variation in mechanical properties with distance from the edge surface, bulk mechanical properties, or a combination thereof.

In a device for separating a longitudinally-extended cylindrical workpiece, which has a diameter in the sub-millimeter range, into individual segments, the workpiece is guided in a clamping device. The clamping device includes a first and a second clamping jaw and a feed opening for the workpiece. The feed opening is fitted between the clamping jaws on the side facing the other clamping jaw and a longitudinal groove which defines a direction of advancement of the workpiece for receiving and guiding the workpiece between the clamping jaws. The clamping device has a passage for a laser beam and a cutting gas, which passage defines a working zone, disrupts the longitudinal groove and runs parallel thereto. A cutter head is arranged in the working zone and has an outlet opening for the laser beam and the cutting gas, which outlet opening is aligned with the passage.

Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 μm for fine line width/pitch.

A structural spacecraft component comprising internal microstructure; wherein said microstructure comprises a plurality of parallel layers and a plurality of spacers that connect adjacent parallel layers; wherein said structural spacecraft component is a product of an additive manufacturing process.

A method for treating a surface of a wall, that can reduce conductivity thereof, the surface being located in a first area located near a second area in which an electric arc is likely to occur in an electrical protection apparatus, the first area constituting an area for recondensing cutting residue. The method includes micro-texturizing the surface to promote inhomogeneity in recondensation of cutting residue, by growing deposits of the residue on the surface to create islands of residue and thus to restrict conductivity of the resulting deposit.

An ultrasonic machine tool comprises a stand that can be attached to a base plate. The machine furthermore has a vibration generator by means of which a working member can be driven, wherein the vibration generator is borne by a slide displaceably guided in the longitudinal direction of the stand. The slide is in turn borne by a linear drive attached to the stand. The vibration generator is located in the alignment of the adjustment path of the linear drive.