A fabrication method of transparent material is a method of processing a thermosetting transparent material including a disposing step of disposing an uncured thermosetting transparent material, a laser beam irradiation step of irradiating the disposed uncured thermosetting transparent material with a laser beam so that cavitation bubbles are generated in the uncured thermosetting transparent material, and a curing step of performing a curing process on the uncured thermosetting transparent material in which the cavitation bubbles are generated.

A glass substrate is reused. The mass productivity of a semiconductor device is increased. A glass substrate one surface of which includes a first material and a second material. The first material includes one or both of a metal and a metal oxide. The second material includes one or both of a resin and a decomposition product of a resin. A cleaning method of a glass substrate, which includes a step of preparing the glass substrate one surface of which includes a first material and a second material and a step of exposing the first material by removing at least part of the second material.

The present invention relates to a composite container comprising a bottom film layer and a top film layer at least partially adhered to the bottom film layer. The top film layer is scored to form at least one resealable flap and at least one pull tab which is not adhered to the bottom film layer. The bottom film layer comprises at least one cavity opening. A cardboard layer is adhered on its lower surface to the upper surface of the top film layer, wherein the cardboard layer has at least one cavity opening which is substantially aligned with the scoring of the top film layer resealable flap and the cardboard layer is perforated to define a perimeter of at least one pull tab which is substantially aligned with and adhered, on its underside, to the upper surface of the top film layer pull tab.

The invention relates to footwear and portions thereof having structural features and decorative designs thereon, and related systems and methods for manufacturing same. An exemplary method for providing a feature on a surface of an object includes positioning a laser proximate the surface of the object, directing a laser beam from the laser to the surface of the object to mark or engrave at least a portion of the surface of the object, and moving at least one of the laser and the object to create a pattern on the surface of the object, the pattern providing at least one of an aesthetic and a structural feature on the surface of the object.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A method of additive manufacture is disclosed. The method may include creating, by a 3D printer contained within an enclosure, a part having a weight greater than or equal to 2,000 kilograms. A gas management system may maintain gaseous oxygen within the enclosure atmospheric level. In some embodiments, a wheeled vehicle may transport the part from inside the enclosure, through an airlock, as the airlock operates to buffer between a gaseous environment within the enclosure and a gaseous environment outside the enclosure, and to a location exterior to both the enclosure and the airlock.

A method is proposed for producing a packaging, having a method step of microperforation of a flexible material as a packaging film, comprising: provision of the flexible material as a packaging film, transport of the flexible material over a transport section, provision of a laser in order to generate a perforation of the flexible material with its beam. For a packaging with improved gas exchange, a laser system with a wavelength in the range of from 150 nm to 1064 nm, preferably from 355 nm to 532 nm, is used for the laser, and the perforation with the laser is carried out during the movement of the flexible material of the packaging film during the transport.

A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.

A first flexible electronic circuit includes a non-conductive substrate and a conductive trace layer, including a bonding pad, on a surface of the non-conductive substrate. A second flexible electronic circuit likewise includes a substrate and a conductive trace layer, including a bonding pad, on a surface of the non-conductive substrate. The second flexible electronic circuit also includes a conductive interface layer on an opposite surface of the non-conductive substrate to the bonding pad. A plurality of vias, filled with conductive material, extend through the substrate of the second flexible electronic circuit and couple the conductive interface layer to the bonding pad. The bonding pads are brought in contact with each other, and energy (e.g., ultrasonic energy or thermal energy) is applied to the conductive interface layer until the bonding pads are bonded (e.g., ultrasonically welded or soldered) to each other.

A cutting method of a mother substrate includes: irradiating a laser to the mother substrate at first intervals along a first cutting line overlapping dummy areas positioned adjacent to sides of each of display panel areas on the mother substrate; and irradiating the laser to the mother substrate at second intervals different from the first intervals along the first cutting line overlapping edge areas positioned adjacent to corner portions of each of the display panel areas.