Systems and methods for etching complex patterns on an interior surface of a hollow object are disclosed. A method generally includes positioning a laser system within the hollow object with a focal point of the laser focused on the interior surface, and operating the laser system to form the complex pattern on the interior surface. Motion of the laser system and the hollow object is controlled by a motion control system configured to provide rotation and/or translation about a longitudinal axis of one or both of the hollow object and the laser system based on the complex pattern, and change a positional relationship between a reflector and a focusing lens of the laser system to accommodate a change in distance between the reflector and the interior surface of the hollow object.

An active brazing material for the energy-efficient production of active-brazed connections that consists of layer sequences arranged on top of one another, the layer sequences of which consist of layers arranged on top of on another, the layer sequences of which each comprise at least one layer of brazing material, wherein the layers of brazing material of each layer sequence each contain at least one component of a base active braze and, in conjunction with each other, contain all components of the base active braze, the layer sequences of which each comprise at least one first reaction layer consisting of a first reactant to which at least one second reaction layer is directly adjacent in the active brazing material and consists of a second reactant that exothermally reacts with the first reactant, wherein an enthalpy of formation of the exothermic reaction of the reactants is greater than or equal to 45 kJ/mol—in particular, greater than or equal to 50 kJ/mol.

A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit sets at least one of a shape and a size of a processing region defined by the irradiation points in a first plane intersecting an optical axis of the laser light and a processing region defined by the irradiation points in a second plane intersecting the optical axis and separated from the first plane in a direction of the optical axis to be different from each other.

A method for stripping ceramic from a component includes applying a liquid to a ceramic coating of an outer surface of the component. The method also includes directing a plurality of laser pulses at the ceramic coating with the applied liquid in order to spall the ceramic coating from the component.

A method for manufacturing a power module substrate includes a first lamination step of laminating a ceramic substrate and a copper sheet through an active metal material and a filler metal having a melting point of 660° C. or lower on one surface side of the ceramic substrate; a second lamination step of laminating the ceramic substrate and an aluminum sheet through a bonding material on the other surface side of the ceramic substrate; and a heating treatment step of heating the ceramic substrate, the copper sheet, and the aluminum sheet laminated together, and the ceramic substrate and the copper sheet, and the ceramic sheet and the aluminum sheet are bonded at the same time.

A method and system to manufacture workpieces employing a high intensity energy source to create a puddle and at least one resistively heated wire which is heated to at or near its melting temperature and deposited into the puddle as droplets.

Methods for fabricating high-strength aluminum-boron nitride nanotube (Al—BNNT) wires or wire feedstock from Al—BNNT composite raw materials by mechanical deformation using wire drawing and extrusion are provided, as well as large-scale, high-strength Al—BNNT composite components (e.g., with a length on the order of meters (m) and/or a mass on the order of hundreds of kilograms (kg)). The large-scale, high-strength Al—BNNT composite components can be made via wire-based additive manufacturing.

A problem to be solved is to provide a method for processing zirconia without producing a monoclinic crystal. The solution is a method for processing zirconia, including the step of irradiating the zirconia with a laser with a pulse duration of 10.sup.−12 seconds to 10.sup.−15 seconds at an intensity of 10.sup.13 to 10.sup.15 W/cm.sup.2.

Provided are ceramic cutting methods and equipment: a beam irradiation unit for irradiating a beam of a wavelength absorbed by a pattern formed on an upper surface of a ceramic and partially absorbed by the ceramic; a coolant spraying unit for spraying a coolant onto the ceramic irradiated with the beam, wherein the pattern is removed by heating and cooling the ceramic , and is cut by reducing thermal damage by using the stress caused by the recrystallization of an upper layer or all of the ceramic or the stress generated by the thermal expansion and contraction of the upper layer or the entire ceramic, thereby recrystallizing the ceramic by heating and cooling the ceramic , or cutting the ceramic by heating until the ceramic melts, and cooling to apply thermal stress to the inside of the ceramic, followed by an additional separation process of a ceramic material without loss.

In both a case where a workpiece is a regular workpiece having a first residual peeling layer on one surface thereof and a case where the workpiece is an adjustment workpiece not having the first residual peeling layer, a wafer having a predetermined thickness is manufactured by grinding opposite surfaces of the workpiece. That is, in the present invention, because the opposite surfaces of the workpiece are ground, wafers can be manufactured from two kinds of workpieces irrespective of whether or not the first residual peeling layer is present on the one surface of the workpiece. Hence, even when two kinds of workpieces are housed in a mixed manner in a first cassette, wafers having the predetermined thickness can be manufactured easily from these workpieces.