B23K2103/52

Hollow welding pin for assembling two different materials.
20220355409 · 2022-11-10 ·

A method for assembling a sheet (40) and an iron-based metal part (80) comprising a step of fitting a tubular pin (10) which is open at both ends by punching through the sheet (40) with a shank of the pin with the pin being retained (10) by the sheet, wherein a pad is detached from the first sheet (40), and a flange of the pin abuts against the surface of the sheet (40) once the through-punching has been carried out, and the elastic returns of the shank of the pin (10) and the sheet (40) compress the outer surface of the shank, or by overmoulding the pin in the sheet, and subsequently a step of welding a metal tube of the pin (10) to the iron-based metal part (80) by bringing a flee end (24) of the metal tube into contact with the surface of the iron-based metal part (80) by means of electric resistance welding (90).

COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
20220359340 · 2022-11-10 · ·

A copper/ceramic bonded body includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12) and the ceramic member (11) being bonded to each other, in which a Mg solid solution layer in which Mg is solid-soluted in a Cu matrix is formed at a bonding interface between the copper member (12) and the ceramic member (11), an active metal nitride layer (41) containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a thickness of the active metal nitride layer (41) is set to be in a range of 0.05 μm or more and 1.2 μm or less.

METHOD FOR SEPARATING SUBSTRATES
20220355418 · 2022-11-10 ·

A method includes forming a plurality of perforations in a ceramic mastercard by a first laser process, wherein forming the plurality of perforations includes reducing a first thickness of the ceramic mastercard to a second thickness along first predefined lines, and cutting through an entire thickness of the ceramic mastercard along a plurality of second predefined lines by a second laser process, wherein the first predefined lines and the second predefined lines overlap only partly.

THREE-DIMENSIONAL PRINTING

The present disclosure provides three-dimensional (3D) objects, 3D printing processes, as well as methods, apparatuses and systems for the production of a 3D object. Methods, apparatuses and systems of the present disclosure may reduce or eliminate the need for auxiliary supports. The present disclosure provides three dimensional (3D) objects printed utilizing the printing processes, methods, apparatuses and systems described herein.

Roughing tool and method for its manufacture
11491558 · 2022-11-08 · ·

The invention relates to a method for producing a roughing tool (1), particularly a circular milling tool, comprising the following steps: fitting a lateral surface of a tool base body (10) that can be rotatably driven about an axis of rotation (2) with a number of cutting element blanks (20′) that are staggered in the axial and/or peripheral direction, such that a free edge of each cutting element blank (20′) protrudes out of the lateral surface in the mounted state; inserting a microtoothing comprising a plurality of axially spaced cutting teeth (21) into the respective free edges of the cutting element blanks (20′) by a material removal method, preferably by thermal machining, particularly preferably by eroding, in the premounted state on the tool base body (10). The invention further relates to a roughing tool produced by means of such a method.

Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Manufacture of cooling holes for ceramic matrix composite components

Systems and methods for machining openings of a component are provided. In one exemplary aspect, a laser system includes features for machining an opening into a component, such as a cooling hole for a CMC component of a gas turbine engine. The component can be oriented in a first position and lasered while oriented in the first position to form a portion of the opening. The component is then oriented to a second position and lasered while oriented in the second position to form another portion of the opening. The component is alternated between the first and second positions until the predetermined geometry of the opening is formed. The component is oriented in the first and second positions such that the laser beam can machine the component without clipping areas that are not desired to be machined.

Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer
20230031736 · 2023-02-02 ·

A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising: a base material and an active metal, wherein the solder material (30) is a foil comprising the base material in a first layer (31) and the active metal in a second layer (32), and wherein the foil has a total thickness (GD) which is less than 50 μm, preferably less than 25 μm and particularly preferably less than 15 μm.

COMPLIANT SUTURE-BASED JOINERY

Methods of forming joinery between components formed from dissimilar materials, and assemblies utilizing the joinery. The components include interface surfaces having complementary peaks and valleys that interlock. A compliant interface is formed between the interface surfaces and the interface can be configured to provide functionality.

Abrasive coating including metal matrix and ceramic particles
11612986 · 2023-03-28 · ·

A system may include a powder source; a powder delivery device; an energy delivery device; and a computing device. The computing device may be configured to: control the powder source to deliver metal powder to the powder delivery device; control the powder delivery device to deliver the metal powder to a surface of an abrasive coating; and control the energy delivery device to deliver energy to at least one of the abrasive coating or the metal powder to cause the metal powder to be joined to the abrasive coating.