The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component. The techniques may also include inserting a solid retainer material into the joint region through an aperture in one of the first component or the second component to form a mechanical interlock between the first component and the second component and sealing the aperture to retain the solid retainer material within the joint region. The solid retainer material includes at least one of a metal, a metal alloy, or a ceramic.

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas, to minimize deleterious surface modifications and mitigate the oxide formation associated with laser machining.

Systems and method for aligning components of photonic systems are provided. An optical component for integration into and optical coupling within a photonic system is created by separating the component from a substrate to form a precisely defined surface on the optical component, the surface being precisely spaced from an optical feature of the component to be optically coupled within the photonic system. The precisely defined surface of the optical component is then pressed against a reference surface to position the optical feature in a predefined position and/or orientation for optical coupling of the optical feature within the photonic system. Passive precise alignment and optical coupling is thus provided without the need for iterative readjustment, multi-axis feedback, or active feedback.

A method of producing a wafer from a hexagonal single-crystal ingot includes the steps of planarizing an end face of the hexagonal single-crystal ingot, forming a peel-off layer in the hexagonal single-crystal ingot by applying a pulsed laser beam whose wavelength is transmittable through the hexagonal single-crystal ingot while positioning a focal point of the pulsed laser beam in the hexagonal single-crystal ingot at a depth corresponding to a thickness of a wafer to be produced from the planarized end face of the hexagonal single-crystal ingot, recording a fabrication history on the planarized end face of the hexagonal single-crystal ingot by applying a pulsed laser beam to the hexagonal single-crystal ingot while positioning a focal point of the last-mentioned pulsed laser beam in a device-free area of the wafer to be produced.

Systems and methods for delivering an injection fluid into a subterranean well include an injection tool having an injection tool body with an internal cavity. A fluid chamber is located within the internal cavity. A heating chamber includes a pipe segment arranged parallel to the central axis. A one way valve provides a fluid flow path for the injection fluids to travel in a downhole direction through the one way valve, and prevents the flow of fluids through the one way valve in an uphole direction. A fiber optic cable extends to the pipe segment, the fiber optic cable operable to deliver a laser radiation to the pipe segment, heating the pipe segment. The injection tool body provides a fluid flow path from the one way valve to an outside of the injection tool.

A wear-protected substrate includes a substrate and a continuous wear protection layer brazed to the substrate. The continuous wear protection layer includes components having interlocking features that are configured to interlock the components side-by-side to form the continuous wear protection layer.

The present invention is a method of manufacturing a ceramic substrate, the method including forming a mask on one surface of a metal layer, forming an inclined protrusion by etching the metal layer exposed by the mask, and bonding the metal layer on which the inclined protrusion is formed to a ceramic base material, and according to the present invention, the inclined protrusion is formed on an outer perimeter of the metal layer bonded to the ceramic base material to increase a bonding strength between the ceramic base material and the metal layer and facilitate a metal layer etching process.

A method for hardening a transparent material includes the steps of introducing a material modification to the transparent material using a laser beam of ultrashort laser pulses of an ultrashort pulse laser so as to harden at least a portion of the transparent material.

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with Nickel and an alloying element, under controlled atmosphere. The completed joint will be fully or substantially Nickel with another element in solution. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck. Semiconductor processing equipment comprising ceramic and joined with a nickel alloy and adapted to withstand processing chemistries, such as fluorine chemistries, as well as high temperatures.

A method of selectively removing at least part of a first phase from a surface of a nanocomposite includes at least a first phase and a second phase, each phase having a respective threshold fluence under a given number of applied laser pulses for removal of the phase by laser ablation. The threshold fluence of the first phase is less than the threshold fluence of the second phase. The method includes irradiating the surface of the nanocomposite with a laser beam having a laser beam diameter, a laser pulse duration, and a laser pulse energy during the irradiation. The laser fluence during the irradiation is less than the threshold fluence of the second phase and greater than the threshold fluence of the first phase. The laser beam diameter is greater than an average grain size of the first phase at the surface of the nanocomposite.