A laser processing device includes an irradiation unit configured to irradiate an object with laser light, an image capturing part configured to capture an image of the object, and a control unit configured to control at least the irradiation unit and the image capturing part. A plurality of lines is set in the object. The control unit performs a first process of irradiating the object with the laser light for each of the plurality of lines by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object.

A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.

A cutting method of a mother substrate includes: irradiating a laser to the mother substrate at first intervals along a first cutting line overlapping dummy areas positioned adjacent to sides of each of display panel areas on the mother substrate; and irradiating the laser to the mother substrate at second intervals different from the first intervals along the first cutting line overlapping edge areas positioned adjacent to corner portions of each of the display panel areas.

A device includes a first substrate, a silicon layer supported by the first substrate, and an active glass layer with a layer including a crystal material with a chemical formula ABX.sub.3 supported by a glass substrate. The active glass layer is stacked on the first substrate such that the layer including the crystal material with a chemical formula ABX.sub.3 and silicon layer are arranged between the first substrate and the glass substrate.

A method of assembling together a first part and at least one second part that are made of materials compatible with bonding by molecular adhesion includes a step of pressing a first surface of the first part against a second surface of the second part so as to create molecular bonds at an interface between the parts, and a step of consolidating the interface bonding as created in this way by heat treatment. The consolidation includes a step of emitting a power laser beam towards an impact point forming a portion of the outline of the interface, and a step of moving the impact point along the outline of the interface.

Systems and method for aligning components of photonic systems are provided. An optical component for integration into and optical coupling within a photonic system is created by separating the component from a substrate to form a precisely defined surface on the optical component, the surface being precisely spaced from an optical feature of the component to be optically coupled within the photonic system. The precisely defined surface of the optical component is then pressed against a reference surface to position the optical feature in a predefined position and/or orientation for optical coupling of the optical feature within the photonic system. Passive precise alignment and optical coupling is thus provided without the need for iterative readjustment, multi-axis feedback, or active feedback.

A spacer wafer for producing spacers of electro-optical converter housings is provided. The spacer wafer is a transparent glass plate having a multiplicity of openings separated from one another and distributed in a grid so that singulated spacers are obtainable by severing sections of the glass plate along separating lines between the openings. The openings have side walls with microstructuring that has a roughness with an average roughness value R.sub.a of less than 0.5 μm with a measurement distance of 500 μm.

A cleaving assembly and a method for cleaving a glass body having a face at a desired angle greater than 0 degrees are disclosed. The assembly comprises a laser device for emitting a laser beam, a rotating device, and a positioning fixture. The rotating device has a head that rotates about a central axis that is orthogonal to the laser beam. The positioning fixture is operatively mounted to the head and centered axially along the central axis and is also rotatably driven by the rotating device. The positioning fixture has a tapered surface that is transverse to the central axis and that supports the glass body at a predetermined angle relative to the central axis. Rotation of the positioning fixture about the central axis when the glass body is exposed to the laser beam, cleaves the face of the glass body at the desired angle due to the glass body being supported transverse to the central axis.

The present disclosure may provide semiconductor perovskite layers and method of making thereof. In some cases, the perovskite layer may comprise a composition of MA.sub.n1FA.sub.n2Cs.sub.n3PbX.sub.3. MA may be methylammonium, FA may be formamidinium, n1, n2, and n3 may independently be greater than 0 and less than 1, and n1 + n2 + n3 may equal 1.

A method including emitting a laser beam toward a transparent workpiece such that portions of the laser beam pass through openings of a beam shaping structure and form corresponding laser beam focal lines across the transparent workpiece. The laser beam focal lines forming a plurality of defects in the transparent workpiece disposed along a contour line. The method further including separating the transparent workpiece along the contour line to provide a first workpiece section and a second workpiece section and a cut edge surface on each of the first and second workpiece sections, each cut edge including a defect region and an unaffected region. The defect region having a higher surface roughness than the unaffected region and a minimum distance of the unaffected region to the first major surface being about 20% or less of a thickness between the first major surface and the second major surface.