A substrate processing method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other includes forming a peripheral modification layer along a boundary between a peripheral portion of the first substrate as a removing target and a central portion of the first substrate; forming a non-bonding region in which bonding strength between the first substrate and the second substrate in the peripheral portion is reduced; and removing the peripheral portion starting from the peripheral modification layer. A first crack is developed from the peripheral modification layer toward the second substrate. The peripheral modification layer is formed such that a lower end of the first crack is located above the non-bonding region and an inner end of the non-bonding region is located at a diametrically outer side than the first crack.

Provided are a laser control structure and a laser bonding method using the same, and more particularly, a laser bonding method including: forming bonding portions on a substrate; providing a bonding object onto the bonding portions; providing a laser control structure onto the bonding object or the substrate; irradiating a laser toward the bonding object and the bonding portions; controlling quantity of laser light absorbed through the laser control structure; using the controlled quantity of laser light to heat the bonding portions and the bonding object to a bonding temperature; and bonding the bonding portions and the bonding object, wherein the laser control structure includes: a first substrate including a first region and a second region; a first thin film laminate on the first region; and a second thin film laminate on the second region, wherein: the first thin film laminate includes at least one first thin film layer and at least one second thin film layer, which are laminated on the first region; the second thin film laminate includes at least one third thin film layer and at least one fourth thin film layer, which are laminated on the second region; reflectance or absorptivity of the first thin film laminate with respect to laser is different from reflectance or absorptivity of the second thin film laminate; and the bonding temperature varies according to the quantity of laser light.

A method for producing a detachment area in a solid body in described. The solid body has a crystal lattice and is at least partially transparent to laser beams emitted by a laser. The method includes: modifying the crystal lattice of the solid by a laser beam, wherein the laser beam penetrates through a main surface of a detachable solid portion of the solid body, wherein a plurality of modifications are produced in the crystal lattice, wherein the modification are formed in a plane parallel to the main surface and at a distance from one another, wherein as a result of the modifications, the crystal lattice cracks the regions surrounding the modifications sub-critically in at least the one portion, and wherein the subcritical cracks are arranged in a plane parallel to the main surface.

There is provided a laser processing device that performs laser processing on an object made of a birefringent material, the device including: a light source that outputs laser light; a spatial light modulator that modulates the laser light output from the light source; a focusing lens that focuses the laser light toward the object; and a polarized light component control unit that is a function of the spatial light modulator to control polarized light components of the laser light such that the laser light is focused on one point in the object in a Z direction (optical axis direction).

A protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a light absorbent. The solution has an absorbance, i.e., an absorbance converted for a solution diluted 200 times, equal to 0.05 or more per an optical path length of 1 cm at a wavelength of 532 nm. Alternatively, the protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a polyhydroxyanthraquinone derivative.

An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.

A method for manufacturing a display device including a display panel having a folding area to be folded along a virtual folding axis and first and second non-folding areas adjacent to both sides of the folding area, and a window disposed on the display panel, the method including preparing a mother substrate having an effective area and a non-effective area divided by a cutting line, performing a first laser process along a first cutting line disposed in the first non-folding area, performing a second laser process along a second cutting line disposed in the second non-folding area, and performing a third laser process along a third cutting line disposed in the folding area, in which one end of the third cutting line overlaps a first end of the first cutting line, and the other end of the third cutting line overlaps a first end of the second cutting line.

A laser machining apparatus includes, a processing chamber, a window disposed in a surface of the processing chamber, a substrate carrier disposed inside the processing chamber and facing the window, a laser irradiator which irradiates a laser onto the substrate carrier through the window, a protector supplier disposed on a side of the processing chamber, a protector retriever disposed on an opposite side of the processing chamber opposite to the side of the processing chamber, and a protector which connects the protector supplier with the protector retriever, where at least a portion of the protector is disposed between the substrate carrier and the window in the processing chamber.

A laser beam application unit of a laser processing machine includes a laser oscillator that emits a laser beam, an fθ main lens that focuses and applies the laser beam which has been emitted from the laser oscillator, to a workpiece held on a holding table, a scan unit that is arranged on an optical path between the laser oscillator and the fθ main lens, scans the laser beam, and guides the resulting scanned laser beam to the fθ main lens, and an fθ sub-lens that is arranged on the optical path between the laser oscillator and the scan unit and converts the laser beam from parallel light into diffused light.

A laser beam applying unit in a laser processing apparatus includes a laser oscillator for emitting a laser beam, a beam condenser for focusing the laser beam emitted from the laser oscillator and applying the focused laser beam to a workpiece held on a holding table, and a scanning unit that is disposed on an optical path of the laser beam between the laser oscillator and the beam condenser and that has scanning mirrors for scanning the laser beam and guiding the scanned laser beam toward the beam condenser. The scanning mirrors are housed in a chamber having a first window for allowing the laser beam emitted from the laser oscillator to pass therethrough to the scanning mirrors and a second window for allowing the laser beam scanned by the scanning mirrors to pass therethrough to the beam condenser.