Patent classifications
B23Q3/152
Work holder and work machining method
A work holder includes: a first holding part having three attracting members that are arranged circumferentially apart from each other to attract an axial end face of an annular work; and a second holding part having a contacting member that is held in contact with an inner periphery or outer periphery of the work and restricts radial movement of the work.
Mounting system for a grinding machine
A mounting system includes a magnet core arranged for positioning inside a magnet coil. The magnet core includes a cylindrical, elongate receiving region with a central axis, a rapid-mounting mandrel arranged for insertion into the cylindrical, elongate receiving region, and a discoid workpiece driver, detachably fastened to the rapid-mounting mandrel and extending normal to the central axis. A one of the magnet core or the rapid-mounting mandrel includes a rapid-mounting device for mounting the rapid-mounting mandrel in the magnet core. Example embodiments may includes the rapid-mounting device integrated into the magnet core or integrated into the rapid-mounting mandrel.
Mounting system for a grinding machine
A mounting system includes a magnet core arranged for positioning inside a magnet coil. The magnet core includes a cylindrical, elongate receiving region with a central axis, a rapid-mounting mandrel arranged for insertion into the cylindrical, elongate receiving region, and a discoid workpiece driver, detachably fastened to the rapid-mounting mandrel and extending normal to the central axis. A one of the magnet core or the rapid-mounting mandrel includes a rapid-mounting device for mounting the rapid-mounting mandrel in the magnet core. Example embodiments may includes the rapid-mounting device integrated into the magnet core or integrated into the rapid-mounting mandrel.
Transport carrier, deposition apparatus, and electronic device manufacturing apparatus
A transport carrier includes a carrier body being able to hold a substrate that is a deposition target, by which the substrate is transported in a deposition apparatus while being held, wherein the carrier body includes magnetic chucking means which magnetically chucks a mask which shields a non-deposition region of the substrate through the substrate and holds the mask in a state in which the mask has come into contact with a film formation surface of the substrate.
Transport carrier, deposition apparatus, and electronic device manufacturing apparatus
A transport carrier includes a carrier body being able to hold a substrate that is a deposition target, by which the substrate is transported in a deposition apparatus while being held, wherein the carrier body includes magnetic chucking means which magnetically chucks a mask which shields a non-deposition region of the substrate through the substrate and holds the mask in a state in which the mask has come into contact with a film formation surface of the substrate.
WORK HOLDER AND WORK MACHINING METHOD
A work holder includes: a first holding part having three attracting members that are arranged circumferentially apart from each other to attract an axial end face of an annular work; and a second holding part having a contacting member that is held in contact with an inner periphery or outer periphery of the work and restricts radial movement of the work.
High conductivity electrostatic chuck
In accordance with an embodiment of the invention, there is provided an electrostatic chuck comprising a conductive path covering at least a portion of a workpiece-contacting surface of a gas seal ring of the electrostatic chuck, the conductive path comprising at least a portion of an electrical path to ground; and a main field area of a workpiece-contacting surface of the electrostatic chuck comprising a surface resistivity in the range of from about 10.sup.8 to about 10.sup.12 ohms per square.
High conductivity electrostatic chuck
In accordance with an embodiment of the invention, there is provided an electrostatic chuck comprising a conductive path covering at least a portion of a workpiece-contacting surface of a gas seal ring of the electrostatic chuck, the conductive path comprising at least a portion of an electrical path to ground; and a main field area of a workpiece-contacting surface of the electrostatic chuck comprising a surface resistivity in the range of from about 10.sup.8 to about 10.sup.12 ohms per square.
Deposition apparatus, electronic device manufacturing apparatus, and deposition method
A deposition apparatus includes a transport mechanism including a transport carrier which holds and transports a substrate and transport modules which constitute a transport path through which the transport carrier moves, an alignment chamber in which the substrate held by the transport carrier is loaded and a mask is positioned and fixed to the loaded substrate, a deposition chamber in which the substrate held by the transport carrier is loaded from the alignment chamber and deposition materials are deposited on the loaded substrate, and control means which controls a magnetic force generated between a plurality of magnets arranged in the transport carrier in a transport direction of the substrate and a plurality of coils arranged to face the plurality of magnets in each transport module by applying a current or a voltage to the plurality of coils.