In a machine tool that performs threading, a thread-cutting startable area parallel to an X-axis of the machine tool is set based on a timing when a relative feed rate between a tool and a workpiece reaches a thread-cutting feed rate after the tool starts cutting feed. Then, movement of the tool in an X-axis direction is started first, and a rotation position of a spindle is monitored. When a thread-cutting start angle of the spindle is detected, cutting feed in a Z-axis direction of the tool is started if the tool travels in the thread-cutting startable area.

In a machine tool that performs threading, a thread-cutting startable area parallel to an X-axis of the machine tool is set based on a timing when a relative feed rate between a tool and a workpiece reaches a thread-cutting feed rate after the tool starts cutting feed. Then, movement of the tool in an X-axis direction is started first, and a rotation position of a spindle is monitored. When a thread-cutting start angle of the spindle is detected, cutting feed in a Z-axis direction of the tool is started if the tool travels in the thread-cutting startable area.

A manipulator system configured to perform a work to a workpiece being moved by a moving device, includes a robotic arm, having one or more joints and to which a tool configured to perform the work to the workpiece is attached, an operating device configured to operate the robotic arm, a first imaging means configured to image the workpiece, while following the movement of the workpiece, a second imaging means fixedly provided in a work area to image a situation of the work to the workpiece, a displaying means configured to display an image imaged by the first imaging means and an image imaged by the second imaging means, and a control device configured to control the operation of the robotic arm based on an operating instruction of the operating device, while detecting a moving amount of the workpiece being moved by the moving device and carrying out a tracking control of the robotic arm according to the moving amount of the workpiece.

A manipulator system configured to perform a work to a workpiece being moved by a moving device, includes a robotic arm, having one or more joints and to which a tool configured to perform the work to the workpiece is attached, an operating device configured to operate the robotic arm, a first imaging means configured to image the workpiece, while following the movement of the workpiece, a second imaging means fixedly provided in a work area to image a situation of the work to the workpiece, a displaying means configured to display an image imaged by the first imaging means and an image imaged by the second imaging means, and a control device configured to control the operation of the robotic arm based on an operating instruction of the operating device, while detecting a moving amount of the workpiece being moved by the moving device and carrying out a tracking control of the robotic arm according to the moving amount of the workpiece.

An arrangement including a machine tool with a chuck, a measuring device, a robot arm as well as a control device. The chuck is rotatable about a chuck axis. The robot arm carries at its free end a gripping device for reception of a workpiece. The measuring device has two sensor units. The measuring device has two sensor units. By means of the control device an automatic adjustment method can be carried out. First the robot arm is controlled for gripping a workpiece and subsequently the workpiece is positioned in the range of the measurement locations of the sensor units depending on measurement signals such that the deviation in the inclination and the offset between the workpiece axis and the chuck axis is within a predefined tolerance range. This procedure is at least carried out in two different rotation positions and is iteratively repeated if necessary.

An arrangement including a machine tool with a chuck, a measuring device, a robot arm as well as a control device. The chuck is rotatable about a chuck axis. The robot arm carries at its free end a gripping device for reception of a workpiece. The measuring device has two sensor units. The measuring device has two sensor units. By means of the control device an automatic adjustment method can be carried out. First the robot arm is controlled for gripping a workpiece and subsequently the workpiece is positioned in the range of the measurement locations of the sensor units depending on measurement signals such that the deviation in the inclination and the offset between the workpiece axis and the chuck axis is within a predefined tolerance range. This procedure is at least carried out in two different rotation positions and is iteratively repeated if necessary.

A processing apparatus 1 includes: a workpiece-set-position recognition unit 114 that moves an arm distal-end portion to a specified position measurement point to measure a shape of a workpiece in a workpiece set state in which the workpiece is positioned by a workpiece positioning unit, and thereby recognizes a set position of the workpiece; a processing-point-information generation unit 115 that, based on the set position of the workpiece and processing-target-portion information 124 indicating a position of a target portion of the workpiece for specified processing, generates processing-point information 125 indicating a processing point which is a movement point of the arm distal-end portion to perform the specified processing on the workpiece using a processing tool in the workpiece set state; and a workpiece-processing control unit 116 that moves the arm distal-end portion to the processing point based on the processing-point information 125 to perform the specified processing on the workpiece using the processing tool.

A processing apparatus 1 includes: a workpiece-set-position recognition unit 114 that moves an arm distal-end portion to a specified position measurement point to measure a shape of a workpiece in a workpiece set state in which the workpiece is positioned by a workpiece positioning unit, and thereby recognizes a set position of the workpiece; a processing-point-information generation unit 115 that, based on the set position of the workpiece and processing-target-portion information 124 indicating a position of a target portion of the workpiece for specified processing, generates processing-point information 125 indicating a processing point which is a movement point of the arm distal-end portion to perform the specified processing on the workpiece using a processing tool in the workpiece set state; and a workpiece-processing control unit 116 that moves the arm distal-end portion to the processing point based on the processing-point information 125 to perform the specified processing on the workpiece using the processing tool.

A first optical path length from an emission surface of a first optical system to a reflection surface of a target object is calculated on the basis of first reflected light received by the first optical system and reference light generated by a splitter. A second optical path length from an emission surface of the second optical system to a reflection surface of a reflector is calculated on the basis of second reflected light reflected by the reflector and received by the second optical system and the reference light generated by the splitter A refractive index of a space is calculated on the basis of the second optical path length, and a distance from the emission surface of the first optical system to the reflection surface of the target object is calculated on the basis of the refractive index and the first optical path length.

A first optical path length from an emission surface of a first optical system to a reflection surface of a target object is calculated on the basis of first reflected light received by the first optical system and reference light generated by a splitter. A second optical path length from an emission surface of the second optical system to a reflection surface of a reflector is calculated on the basis of second reflected light reflected by the reflector and received by the second optical system and the reference light generated by the splitter A refractive index of a space is calculated on the basis of the second optical path length, and a distance from the emission surface of the first optical system to the reflection surface of the target object is calculated on the basis of the refractive index and the first optical path length.