Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use.

A detection device, detection method, and compensation method for tool wear, applied to a machine tool including a spindle connected to a tool. A first parameter set including a first cutting depth having a zero cutting depth is set, and the machine tool performs a cutting procedure with the first parameter set to record a first loading rate of the spindle. A second parameter set including a second cutting depth having a non-zero cutting depth is set, and the machine tool performs the cutting procedure with the second parameter set to record a second loading rate of the spindle. A processing device calculates an estimated cutting force according to the loading rates and a machine performance database. A fuzzy logic unit outputs a wear level according to a tool wear database and the estimated cutting force. The machine tool adjusts a cutting locus according to the wear level.

A detection device, detection method, and compensation method for tool wear, applied to a machine tool including a spindle connected to a tool. A first parameter set including a first cutting depth having a zero cutting depth is set, and the machine tool performs a cutting procedure with the first parameter set to record a first loading rate of the spindle. A second parameter set including a second cutting depth having a non-zero cutting depth is set, and the machine tool performs the cutting procedure with the second parameter set to record a second loading rate of the spindle. A processing device calculates an estimated cutting force according to the loading rates and a machine performance database. A fuzzy logic unit outputs a wear level according to a tool wear database and the estimated cutting force. The machine tool adjusts a cutting locus according to the wear level.

Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use. In one example, the cutting device includes a cutting wheel; an actuator to rotate the cutting wheel; a power source configured to provide power to the actuator for rotating the cutting wheel at an adjustable rotational velocity; and control circuitry configured to adjust the rotational velocity of the cutting wheel to maintain a substantially constant surface speed.

Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use. In one example, the cutting device includes a cutting wheel; an actuator to rotate the cutting wheel; a power source configured to provide power to the actuator for rotating the cutting wheel at an adjustable rotational velocity; and control circuitry configured to adjust the rotational velocity of the cutting wheel to maintain a substantially constant surface speed.

A substrate processing apparatus includes a substrate polishing unit 40 having a polishing pad for polishing a wafer W, and a top ring 41 for holding a wafer and pressing the wafer against the polishing pad. An elastic membrane 80 for holding a surface opposite to a polishing surface of the wafer W is attached to the top ring 41 as a consumable. The elastic membrane 80 is provided with a plurality of strain sensors 85 and 86 for measuring strain occurring in the elastic membrane 80 during polishing, and data of an amount of strain is read to a control device 15 by detection units 90 and 91. The control device 15 sets a processing condition such as a polishing recipe for the wafer W based on strain information of the elastic membrane 80 measured by the strain sensors.

A substrate processing apparatus includes a substrate polishing unit 40 having a polishing pad for polishing a wafer W, and a top ring 41 for holding a wafer and pressing the wafer against the polishing pad. An elastic membrane 80 for holding a surface opposite to a polishing surface of the wafer W is attached to the top ring 41 as a consumable. The elastic membrane 80 is provided with a plurality of strain sensors 85 and 86 for measuring strain occurring in the elastic membrane 80 during polishing, and data of an amount of strain is read to a control device 15 by detection units 90 and 91. The control device 15 sets a processing condition such as a polishing recipe for the wafer W based on strain information of the elastic membrane 80 measured by the strain sensors.

A turning method for a CNC lathe involves at least two machining steps, wherein a cutting element is re-arranged between the machining steps such that a nominal rake angle (?.sub.n) is changed. Thereby, the effective tool life may be increased and a high quality of the machined surfaces, and a stable cutting process, may be achieved even with a worn tool. A system and a computer program for performing the method is also provided.

A machining device can lengthen the lifespan of a tool and improve the machining quality of a workpiece by managing the amount of wear of the tool by machining the workpiece using the other portion of the tool when a portion of the tool is worn and the machining performance of the tool is decreased. The machining device includes: a tool-moving unit coupled to a machining unit to change the position of the tool with respect to the workpiece; a supporting unit supporting the workpiece; a sensor unit disposed at the machining unit and measuring a current amount supplied to a machining motor operating the tool, or an operation force of the tool; and a control unit receiving a measurement signal from the sensor unit and transmitting a control signal to the tool-moving unit and the supporting unit.

A machining device can lengthen the lifespan of a tool and improve the machining quality of a workpiece by managing the amount of wear of the tool by machining the workpiece using the other portion of the tool when a portion of the tool is worn and the machining performance of the tool is decreased. The machining device includes: a tool-moving unit coupled to a machining unit to change the position of the tool with respect to the workpiece; a supporting unit supporting the workpiece; a sensor unit disposed at the machining unit and measuring a current amount supplied to a machining motor operating the tool, or an operation force of the tool; and a control unit receiving a measurement signal from the sensor unit and transmitting a control signal to the tool-moving unit and the supporting unit.