Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

A control device for a machine tool and a machine tool capable of easily performing cutting with vibration according to the amount of feed is provided. A control device (180) for a machine tool comprises a control means (181) for controlling the relative rotation and feeding of a cutting tool and a material, the control means performing control such that cutting is performed with vibrating the cutting tool relative to the material by combining a forward feed movement in the machining direction, in which the cutting tool machines the material, and a return movement in the counter-machining direction. A return position calculation section (191) for calculating a return position of the cutting tool at time when one vibration is completed on the basis of the number of vibrations and an amount of feed that are predetermined for one rotation of the cutting tool or the material, a forward feed setting section (192) for setting the forward feed movement on the basis of one or more change point setting values that determine a change point from the machining direction to the counter-machining direction, and making the cutting tool reach the determined change point, and a return movement setting means (193) for setting a pulse-like signal that is output as a command for the return movement so that the cutting tool reaches the calculated return position at time when one vibration is completed are included.

A miller, a non-transitory computer readable medium, and a method for milling a multi-layered object. The method may include (i) receiving or determining milling parameters related to a milling process, the milling parameters may include at least two out of (a) a defocus strength, (b) a duration of the milling process, (c) a bias voltage supplied to an objective lens during the milling process, (d) an ion beam energy, and (e) an ion beam current density, and (ii) forming a crater by applying the milling process while maintaining the milling parameters, wherein the applying of the milling process includes directing a defocused ion beam on the multi-layered object.

A miller, a non-transitory computer readable medium, and a method for milling a multi-layered object. The method may include (i) receiving or determining milling parameters related to a milling process, the milling parameters may include at least two out of (a) a defocus strength, (b) a duration of the milling process, (c) a bias voltage supplied to an objective lens during the milling process, (d) an ion beam energy, and (e) an ion beam current density, and (ii) forming a crater by applying the milling process while maintaining the milling parameters, wherein the applying of the milling process includes directing a defocused ion beam on the multi-layered object.

Provided is a servo controller that can prevent an unnecessary cut from being generated during oscillation machining. A servo controller which controls a machine tool 10 that turns a workpiece W by cooperative operation of a plurality of axes includes: an oscillation command generating unit 23 that generates an oscillation command for causing the workpiece W and the tool 11 to relatively oscillate; a deviation deducting unit 31, 241 that applies the oscillation command to a position deviation based on a moving command for causing the workpiece W and the tool 11 to relatively move, and deducts a steady-state position deviation; and a learning control unit 27 that calculates a compensation amount from a position deviation based on the moving command after deducting the steady-state position deviation.

Provided is a servo controller that can prevent an unnecessary cut from being generated during oscillation machining. A servo controller which controls a machine tool 10 that turns a workpiece W by cooperative operation of a plurality of axes includes: an oscillation command generating unit 23 that generates an oscillation command for causing the workpiece W and the tool 11 to relatively oscillate; a deviation deducting unit 31, 241 that applies the oscillation command to a position deviation based on a moving command for causing the workpiece W and the tool 11 to relatively move, and deducts a steady-state position deviation; and a learning control unit 27 that calculates a compensation amount from a position deviation based on the moving command after deducting the steady-state position deviation.

A machine system includes a transport control section which controls transport of a workpiece based on a transport deceleration line provided upstream of an operation limit line of a machine in a direction of travel of the workpiece and a transport acceleration line provided upstream of the transport deceleration line, wherein the transport control section reduces a transport speed of the workpiece when the workpiece passes through the transport deceleration line in an incomplete operation state and increases the transport speed of the workpiece after the operation on the workpiece present between the operation limit line and the transport acceleration line has completed.

A workpiece machining device includes a positional deviation correction unit configured to correct a positional deviation of a radius end mill by detecting a positional deviation between a real contour line and an ideal contour line of the radius end mill. The positional deviation correction unit calculates a first correction value configured to make a center of a first arc section formed into an arc shape at a corner portion of the ideal contour line and a center of a second arc section formed into an arc shape at a corner portion of the real contour line to be identical to each other in a plane perpendicular to the rotational axis, and corrects a machining point by the radius end mill using the first correction value.

A workpiece machining device includes a positional deviation correction unit configured to correct a positional deviation of a radius end mill by detecting a positional deviation between a real contour line and an ideal contour line of the radius end mill. The positional deviation correction unit calculates a first correction value configured to make a center of a first arc section formed into an arc shape at a corner portion of the ideal contour line and a center of a second arc section formed into an arc shape at a corner portion of the real contour line to be identical to each other in a plane perpendicular to the rotational axis, and corrects a machining point by the radius end mill using the first correction value.