An apparatus for machining a cylindrical workpiece has a hollow spindle with a driving center on its tip end. The hollow spindle is rotationally journaled within a spindle unit. A tail stock spindle, with a centering center on its tip end, is rotationally supported and axially movable within a centering unit. A shaft-like kelly is non-rotationally and axially movably supported within an inner bore of the spindle. A drive rotates the spindle. Cylinders axially drive the kelly and the tail stock spindle, respectively. The spindle, the tail stock spindle and the cylinders are arranged on the same axial line. The cylindrical workpiece is sandwiched between the driving center and the centering center. An outer circumferential surface of the workpiece is finish machined while rotating the workpiece under a condition where the kelly engages the workpiece within an inner bore of the workpiece.

A grinding machine of one embodiment includes an abrasive wheel; a rectangular base including a top wall having a central through hole and an upper shoulder; a mounting member secured to the central through hole; an electric motor including a drive shaft passing through the mounting member to secure to the abrasive wheel; first and third workpiece holding units each including a board secured to the base; an adjustment knob on the board; and an L-shaped seat secured to the board and having a transverse channel, a front curved slot, a rear projection pivotably secured to the board, and a pin secured to the board and disposed in the slot; a second workpiece holding unit secured to the shoulder and including a vertical tunnel; and a fourth workpiece holding unit secured to the shoulder and including a vertical tunnel, an adjustment knob, and a fastening member.

A grinding machine of one embodiment includes an abrasive wheel; a rectangular base including a top wall having a central through hole and an upper shoulder; a mounting member secured to the central through hole; an electric motor including a drive shaft passing through the mounting member to secure to the abrasive wheel; first and third workpiece holding units each including a board secured to the base; an adjustment knob on the board; and an L-shaped seat secured to the board and having a transverse channel, a front curved slot, a rear projection pivotably secured to the board, and a pin secured to the board and disposed in the slot; a second workpiece holding unit secured to the shoulder and including a vertical tunnel; and a fourth workpiece holding unit secured to the shoulder and including a vertical tunnel, an adjustment knob, and a fastening member.

A machine tool including a non-contact affected layer detection sensor capable of detecting an affected layer with high precision is provided. A machine tool includes a non-contact affected layer detection sensor, a main body, probes and that contact the surface of an workpiece, arm portions supported by the main body, and dimension measurement sensors that output a signal that corresponds to the dimension of the workpiece on the basis of displacement of the arm portions with respect to the main body. The affected layer detection sensor is provided in the arm portion, and outputs a signal that corresponds to an affected state of the workpiece. The arm portions hold the probes respectively, and are displaceable with respect to the main body in accordance with the dimension of the workpiece.

A machine tool including a non-contact affected layer detection sensor capable of detecting an affected layer with high precision is provided. A machine tool includes a non-contact affected layer detection sensor, a main body, probes and that contact the surface of an workpiece, arm portions supported by the main body, and dimension measurement sensors that output a signal that corresponds to the dimension of the workpiece on the basis of displacement of the arm portions with respect to the main body. The affected layer detection sensor is provided in the arm portion, and outputs a signal that corresponds to an affected state of the workpiece. The arm portions hold the probes respectively, and are displaceable with respect to the main body in accordance with the dimension of the workpiece.

The invention relates to a machine (10) for machining and/or measuring a workpiece (49). Machine (10) has a machine frame (18), a first transverse member (24) which is rotatably mounted by means of a first round guide (25) about a first rotational axis (D1) on the machine frame (18) and on which a tool unit (11) with a tool (13, 14) is arranged, where the tool (13, 14) is arranged at a distance from the first rotational axis (D1). Machine (10) also has a second transverse member (40) which is rotatably mounted by means of a second round guide (41) about a second rotational axis (D2) on the machine frame (18), and on which a workpiece clamping device (12) is arranged at a distance from the second rotational axis (D2). The two rotational axis (D1, D2) are aligned parallel to one another.

The invention relates to a machine (10) for machining and/or measuring a workpiece (49). Machine (10) has a machine frame (18), a first transverse member (24) which is rotatably mounted by means of a first round guide (25) about a first rotational axis (D1) on the machine frame (18) and on which a tool unit (11) with a tool (13, 14) is arranged, where the tool (13, 14) is arranged at a distance from the first rotational axis (D1). Machine (10) also has a second transverse member (40) which is rotatably mounted by means of a second round guide (41) about a second rotational axis (D2) on the machine frame (18), and on which a workpiece clamping device (12) is arranged at a distance from the second rotational axis (D2). The two rotational axis (D1, D2) are aligned parallel to one another.

The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.

A method of grind hardening a workpiece is provided. The method may include securing the workpiece in a workpiece retainer and a grind tool in a tool retainer, rotating the grind tool in a first angular direction at a first angular speed, controlling the workpiece and tool retainers such that the grind tool engages the workpiece, and controlling the workpiece and tool retainers such that the grind tool is guided along a grinding track of the workpiece. The grind tool may engage and/or disengage the workpiece at portions of sacrificial material disposed thereon. Coolant and cleaning nozzles may be provided and controlled such that at least a portion of the coolant from the coolant nozzle is diverted to the cleaning nozzle in a manner which reduces heat dissipation, improves thermal efficiency of the grind hardening and reduces loading of the grind tool.

Disclosed is a device and a method for manufacturing semiconductor crystal wafer, with the device and the method being capable of easily and reliably manufacture semiconductor crystal wafers of high-quality. This manufacturing method for a SiC wafer, being a semiconductor crystal wafer, includes: a pad groove formation step and a bobbin groove formation step prior to a groove machining step, and after the groove machining step, a polishing step, a cutting step, a first surface machining step, and a second surface machining step.