A flaw grinding system, a flaw grinding method, and a steel-product manufacturing method enable automation of the task of grinding a flaw on the surface of a workpiece having a three-dimensional shape, while also reducing the occurrence of faulty grinding such as over-grinding or under-grinding. The flaw grinding system includes a grinding apparatus, a shape measurement apparatus, a flaw detection apparatus, and a grinding-tool control apparatus. The grinding apparatus includes a grinding tool that grinds a flaw on a surface of a workpiece. The shape measurement apparatus measures a three-dimensional shape and an attitude of the workpiece. The flaw detection apparatus detects a location of the flaw on the workpiece. The grinding-tool control apparatus generates a trajectory of the grinding tool to grind the flaw. The grinding-tool control apparatus controls the grinding apparatus in a manner that causes the grinding tool to move along the trajectory.

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

Systems and methods of providing run-time quality control and monitoring of a single or multiple sequencing runs are provided herein. In some embodiments, the run-time system includes or is in communication with a processor capable of determining various types of run-time information relating to the quality, progress, etc. of various sequencing runs. In some embodiments, the system can also be in communication with a user interface, for example, a GUI, capable of representing and communicating various types of information to a user regarding the quality of the individual or multiple runs, the functioning of the instrument, an error event, etc. Additionally, the system can capable of receiving actionable information from a user via the GUI thereby allowing the user to terminate or repeat various sequencing steps in a particular run, terminate a entire run, terminate all runs, allow a run to proceed, etc.

Systems and methods of providing run-time quality control and monitoring of a single or multiple sequencing runs are provided herein. In some embodiments, the run-time system includes or is in communication with a processor capable of determining various types of run-time information relating to the quality, progress, etc. of various sequencing runs. In some embodiments, the system can also be in communication with a user interface, for example, a GUI, capable of representing and communicating various types of information to a user regarding the quality of the individual or multiple runs, the functioning of the instrument, an error event, etc. Additionally, the system can capable of receiving actionable information from a user via the GUI thereby allowing the user to terminate or repeat various sequencing steps in a particular run, terminate a entire run, terminate all runs, allow a run to proceed, etc.

A system for polishing a cylindrical lip-seal surface includes a spin platter, a polisher having an abrasive surface, and a fixture. The spin platter rotates about a rotation axis to spin a workpiece, shaped as a hollow cylinder, about a cylinder axis of the hollow cylinder. The fixture holds the polisher against an outward-facing cylindrical surface of the hollow cylinder to polish the cylindrical surface with the abrasive surface while the workpiece is spun by the spin platter. A method for polishing a cylindrical lip-seal surface includes spinning, with a spin platter, a workpiece shaped as a hollow cylinder about a first cylinder axis of the cylinder. The method also includes holding, during the spinning, a polisher having an abrasive surface against an outward-facing cylindrical surface of the hollow cylinder to polish the cylindrical surface.

A system for polishing a cylindrical lip-seal surface includes a spin platter, a polisher having an abrasive surface, and a fixture. The spin platter rotates about a rotation axis to spin a workpiece, shaped as a hollow cylinder, about a cylinder axis of the hollow cylinder. The fixture holds the polisher against an outward-facing cylindrical surface of the hollow cylinder to polish the cylindrical surface with the abrasive surface while the workpiece is spun by the spin platter. A method for polishing a cylindrical lip-seal surface includes spinning, with a spin platter, a workpiece shaped as a hollow cylinder about a first cylinder axis of the cylinder. The method also includes holding, during the spinning, a polisher having an abrasive surface against an outward-facing cylindrical surface of the hollow cylinder to polish the cylindrical surface.

The present disclosure relates to a method for making a grinding wheel with abrasive surfaces located on an outer diameter of the grinding wheel to provide grinding characteristics of both coarse and fine abrasive textures. The method includes forming on the grinding wheel a coarse abrasive portion located proximate to a first axial end of the outer diameter, a fine abrasive portion located proximate to a second axial end of the outer diameter and a transition band formed at an interface between the abrasive surfaces. The transition band has an abrasive coating with a gradual change in texture from a coarse surface to a fine surface.

The present disclosure relates to a method for making a grinding wheel with abrasive surfaces located on an outer diameter of the grinding wheel to provide grinding characteristics of both coarse and fine abrasive textures. The method includes forming on the grinding wheel a coarse abrasive portion located proximate to a first axial end of the outer diameter, a fine abrasive portion located proximate to a second axial end of the outer diameter and a transition band formed at an interface between the abrasive surfaces. The transition band has an abrasive coating with a gradual change in texture from a coarse surface to a fine surface.

Systems and methods of providing run-time quality control and monitoring of a single or multiple sequencing runs are provided herein. In some embodiments, the run-time system includes or is in communication with a processor capable of determining various types of run-time information relating to the quality, progress, etc. of various sequencing runs. In some embodiments, the system can also be in communication with a user interface, for example, a GUI, capable of representing and communicating various types of information to a user regarding the quality of the individual or multiple runs, the functioning of the instrument, an error event, etc. Additionally, the system can capable of receiving actionable information from a user via the GUI thereby allowing the user to terminate or repeat various sequencing steps in a particular run, terminate a entire run, terminate all runs, allow a run to proceed, etc.