B24B5/14

GRINDING METHOD AND GROUND WAFER MANUFACTURING METHOD
20260107744 · 2026-04-16 ·

A method for grinding a workpiece with a grinding apparatus including a holding table with a rotatable conical-shaped holding surface, a grinding unit including a spindle and grindstones, which grinds the workpiece by bringing the rotating grindstones into contact with the workpiece to thereby form a grinding surface lying along the holding surface, and a moving unit that moves the holding table and the grindstones relative to each other. The method includes holding the workpiece on the holding surface, grinding the workpiece by performing grinding feed where the holding table and the spindle approach each other along a rotational axis of the spindle with the workpiece and the grindstones contacting each other while the holding table and the spindle are independently rotated, and, after grinding the workpiece, stopping the grinding feed and moving the holding table and the spindle relative to each other while rotating the table and the spindle.