Patent classifications
B24B5/24
Machining apparatus
A machining apparatus is of an in-feed type configured to machine an outer peripheral surface of a rotating tapered roller, and includes a rotating mechanism having a lateral pair of rollers on which the tapered roller is mounted, the rotating mechanism rotating the pair of rollers, and a grinding stone that is brought into contact with the outer peripheral surface of the tapered roller mounted on the pair of rollers. Each roller of the pair of rollers is shaped like a truncated cone. Small-diameter portions of the pair of rollers come into contact with a small-diameter portion of the tapered roller. Large-diameter portions of the pair of rollers come into contact with a large-diameter portion of the tapered roller.
Processing method
A method of processing a crowned portion of a roller includes disposing first and second feed drums so as to extend parallel to each other, each of the first and second feed drums having an outer periphery formed with respective spirally extending threaded guide surfaces, the first and second feed drums being driven to rotate to transport the roller from a first location towards a second location through between the first and second feed drums, and successively processing the crowned portion of the roller, by means of a through feed processing with the use of a grinding stone. The threaded guide surface of one of the first and second feed drums is formed so that an angle of inclination of an outer peripheral surface of the roller relative to a processing surface of the grinding stone is varied in dependence on a roller passing position of the feed drum.
Device and method for grinding workpieces using a control unit
A system for grinding solid workpieces includes a grinding wheel, a bearing for rotatable mounting of the grinding wheel about an axis of rotation, and a grinding wheel drive for rotating the grinding wheel. The system allows the production of freely-definable surfaces on the face of the rigid workpiece that comes into contact with the grinding wheel. The bearing is fastened to a pivotable and displaceable bearing carrier. The bearing plane is pivotable in any desired direction with respect to an initial plane and is displaceable in a direction perpendicular to the initial plane. Actuators are coupled to the bearing carrier to pivot and displace the bearing carrier. A digital control unit controls and synchronizes the actuators such that the surface of the grinding wheel creates a freely-definable face about a positionally fixed reference point which is at a radial distance from the center point of the grinding wheel.
Device and method for grinding workpieces, in particular welding electrodes
A system for grinding workpieces includes a grinding wheel, a first support for rotatably supporting the grinding wheel about a first rotational axis, and a grinding wheel drive for rotating the grinding wheel. The first support can be rotated about a second rotational axis using a support rotating device, the first rotational axis being inclined relative to the second rotational axis such that the grinding wheel lies diagonally against the surface of the workpiece and grinds a substantially conical surface on the workpiece while rotating about the second rotational axis when the workpiece contacts the grinding wheel surface at a distance from the second rotational axis. A position adjusting device may move the first support along the second rotational axis. The angle of inclination between the first rotational axis and the second rotational axis may be adjusted using an inclination adjusting device.
Device and method for grinding workpieces, in particular welding electrodes
A system for grinding workpieces includes a grinding wheel, a first support for rotatably supporting the grinding wheel about a first rotational axis, and a grinding wheel drive for rotating the grinding wheel. The first support can be rotated about a second rotational axis using a support rotating device, the first rotational axis being inclined relative to the second rotational axis such that the grinding wheel lies diagonally against the surface of the workpiece and grinds a substantially conical surface on the workpiece while rotating about the second rotational axis when the workpiece contacts the grinding wheel surface at a distance from the second rotational axis. A position adjusting device may move the first support along the second rotational axis. The angle of inclination between the first rotational axis and the second rotational axis may be adjusted using an inclination adjusting device.
GRINDING METHOD AND GROUND WAFER MANUFACTURING METHOD
A method for grinding a workpiece with a grinding apparatus including a holding table with a rotatable conical-shaped holding surface, a grinding unit including a spindle and grindstones, which grinds the workpiece by bringing the rotating grindstones into contact with the workpiece to thereby form a grinding surface lying along the holding surface, and a moving unit that moves the holding table and the grindstones relative to each other. The method includes holding the workpiece on the holding surface, grinding the workpiece by performing grinding feed where the holding table and the spindle approach each other along a rotational axis of the spindle with the workpiece and the grindstones contacting each other while the holding table and the spindle are independently rotated, and, after grinding the workpiece, stopping the grinding feed and moving the holding table and the spindle relative to each other while rotating the table and the spindle.
GRINDING METHOD AND GROUND WAFER MANUFACTURING METHOD
A method for grinding a workpiece with a grinding apparatus including a holding table with a rotatable conical-shaped holding surface, a grinding unit including a spindle and grindstones, which grinds the workpiece by bringing the rotating grindstones into contact with the workpiece to thereby form a grinding surface lying along the holding surface, and a moving unit that moves the holding table and the grindstones relative to each other. The method includes holding the workpiece on the holding surface, grinding the workpiece by performing grinding feed where the holding table and the spindle approach each other along a rotational axis of the spindle with the workpiece and the grindstones contacting each other while the holding table and the spindle are independently rotated, and, after grinding the workpiece, stopping the grinding feed and moving the holding table and the spindle relative to each other while rotating the table and the spindle.