Systems and methods for treating concrete, which includes the steps of wetting a surface of concrete with colloidal silica, allowing time for the colloidal silica to penetrate the concrete surface, and cutting the surface of the concrete with a bladed or segmented tool wherein the longitudinal blade or edge portion is positioned approximately at an angle between 30 degrees and 90 degrees relative to the surface of the concrete.

A method of processing a plate-shaped workpiece is provided. The method includes the steps of sticking a protective member to a face side of the workpiece, holding the face side of the workpiece on a holding surface of a chuck table with the protective member interposed therebetween, grinding a reverse side of the workpiece held on the chuck table to thin the workpiece by rotating a grinding wheel including grinding stones that contain abrasive grains, while a grinding fluid is being supplied from a grinding fluid supply nozzle to the reverse side of the workpiece, and after the step of grinding the reverse side of the workpiece, treating the workpiece or the grinding stones by rotating the grinding wheel and bringing the grinding stones into contact with the reverse side of the workpiece, while stopping supplying the grinding fluid from the grinding fluid supply nozzle.

A method of processing a plate-shaped workpiece is provided. The method includes the steps of sticking a protective member to a face side of the workpiece, holding the face side of the workpiece on a holding surface of a chuck table with the protective member interposed therebetween, grinding a reverse side of the workpiece held on the chuck table to thin the workpiece by rotating a grinding wheel including grinding stones that contain abrasive grains, while a grinding fluid is being supplied from a grinding fluid supply nozzle to the reverse side of the workpiece, and after the step of grinding the reverse side of the workpiece, treating the workpiece or the grinding stones by rotating the grinding wheel and bringing the grinding stones into contact with the reverse side of the workpiece, while stopping supplying the grinding fluid from the grinding fluid supply nozzle.

The invention provides a float trowel blade attachment for cement floor finishers comprising a rectangular section of sheet metal having a top surface and a bottom surface and having its edges optionally bent upwardly, means for providing to the top surface a three-sided rearwardly open pocket on the back of the section adjacent the leading edge thereof adapted to partially receive a finish trowel blade of the finisher, a spring clip secured to the top surface or the pocket-forming means and extending rearwardly therefrom so as to be engageable with the finish trowel blade to retain the section thereon, and wherein said rectangular sheet metal has attached to its bottom surface using an adhesive or mechanical attachment material interlayer, a composite rigid abrasive element bonded to a resilient backing and wherein said abrasive element comprises a substrate of two or more non woven layers pads including holes for inserting grinding and polishing elements.

The invention provides a float trowel blade attachment for cement floor finishers comprising a rectangular section of sheet metal having a top surface and a bottom surface and having its edges optionally bent upwardly, means for providing to the top surface a three-sided rearwardly open pocket on the back of the section adjacent the leading edge thereof adapted to partially receive a finish trowel blade of the finisher, a spring clip secured to the top surface or the pocket-forming means and extending rearwardly therefrom so as to be engageable with the finish trowel blade to retain the section thereon, and wherein said rectangular sheet metal has attached to its bottom surface using an adhesive or mechanical attachment material interlayer, a composite rigid abrasive element bonded to a resilient backing and wherein said abrasive element comprises a substrate of two or more non woven layers pads including holes for inserting grinding and polishing elements.

A processing apparatus includes a chuck configured to hold a substrate; a moving unit to which a processing tool configured to process the substrate is mounted; a sprinkler configured to spray a cleaning liquid configured to clean the moving unit from an outside of the moving unit; and a housing accommodating the chuck, the processing tool, and the sprinkler therein. The sprinkler includes a fixed unit fixed to an inside of the housing, and a rotating unit rotatably supported at the fixed unit. The rotating unit includes a nozzle configured to discharge the cleaning liquid, and a rotation block configured to hold the nozzle.

A processing method of processing a substrate in a processing apparatus includes performing a first grinding processing on the substrate in a first grinder; performing a second grinding processing on the substrate in a second grinder; performing a first re-grinding processing on the substrate in the first grinder; and performing a second re-grinding processing on the substrate in the second grinder. The substrate is ground to a final thickness in the second re-grinding processing.

The embodiments of the present disclosure provide a polishing head management system and method. The polishing head management system includes: a storage device, a pick-and-place device and a data acquisition device, where the storage device is used to store polishing heads; the pick-and-place device is used to pick a polishing head or place a polishing head into the storage device; the data acquisition device is connected with the storage device and the pick-and-place device, and is used to record at least one management cycle of the polishing head.

The embodiments of the present disclosure provide a polishing head management system and method. The polishing head management system includes: a storage device, a pick-and-place device and a data acquisition device, where the storage device is used to store polishing heads; the pick-and-place device is used to pick a polishing head or place a polishing head into the storage device; the data acquisition device is connected with the storage device and the pick-and-place device, and is used to record at least one management cycle of the polishing head.

There is provided a processing method of grinding a workpiece. The processing method includes a holding step of holding the workpiece on a side of its front surface on a chuck table, a coarse grinding step of grinding the workpiece on a side of its back surface with first grinding stones until the workpiece has a predetermined thickness, an auxiliary grinding step of grinding the workpiece on the side of its back surface with the first grinding stones such that an unground region remains at an outer peripheral portion of the workpiece, an unground region grinding step of grinding the unground region with second grinding stones having an average abrasive grain size smaller than that of the first grinding stones, and a finish grinding step of grinding the workpiece on the side of its back surface with the second grinding stones until the workpiece has a predetermined finish thickness.