A method and apparatus is provided for treating a floor surface with zero-tolerance edging. The apparatus includes a frame and wheels mounted to the frame so the frame can travel over the floor surface. The apparatus also includes a motor mounted to the frame and a head assembly including a bottom plate. The bottom plate is operatively coupled to the motor so that the bottom plate is configured to rotate about a first axis. The bottom plate is positioned such that a tooling plate mounted to the bottom plate is configured to treat the floor surface including an edge of the floor surface intersecting a wall surface.

A decorative concrete with a very uniform finish surface and a method of fabricating the same is disclosed. A concrete mixture is poured over a subgrade which defines an exposed surface. The exposed surface is finished with any of several techniques, and the surface is then worked with an abrasive material, and additional techniques are used to color and seal the concrete.

A decorative concrete with a very uniform finish surface and a method of fabricating the same is disclosed. A concrete mixture is poured over a subgrade which defines an exposed surface. The exposed surface is finished with any of several techniques, and the surface is then worked with an abrasive material, and additional techniques are used to color and seal the concrete.

A grinding method for grinding a plurality of platelike workpieces at a time is provided. The workpieces are attached to a support member and held on a chuck table. A grinding wheel is brought into contact with the workpieces to grind the workpieces at a time. The grinding wheel includes a disk-shaped wheel base having a first surface, a plurality of first abrasive members arranged annularly on the first surface of the wheel base, and a plurality of second abrasive members arranged annularly on the first surface of the wheel base radially inside the first abrasive members in a concentric relationship with the first abrasive members. The radial spacing between the first abrasive members and the second abrasive members is set larger than the minimum spacing between any adjacent ones of the workpieces.

A wafer held on a delivery pad is lifted from a holding surface, and when a lower surface of the wafer has been spaced in its entirety from the holding surface, an air flow rate regulating valve is opened to eject air from the holding surface. As the distance between the holding surface and the wafer spaced from the holding surface increases by lifting of a delivery unit, the degree of opening of the air flow rate regulating valve is adjusted to increase a flow rate of air from the holding surface, thereby spacing the wafer from the holding surface in a short period of time without rupturing the wafer.

A wafer processing method includes a first grinding step and a second grinding step. In the first grinding step, first grinding abrasives are moved in a processing feed direction that is a direction orthogonal to a holding surface of a chuck table of grinding apparatus and a wafer is ground to form a first circular recess in the back surface of the wafer. In the second grinding step, second grinding abrasives formed of finer abrasive grains than the first grinding abrasives are moved down in an oblique direction from the center side of the wafer toward the periphery of the wafer and the first circular recess is ground.

The present invention is directed to a method and apparatus for polishing stone and synthetic substrates. The apparatus uses a leather polishing pad to apply a finish to a stone or synthetic substrate. The pad has a specially designed fluid channeling pattern which cools by maintaining a quantity of liquid polishing slurry centrally of the pad for cooling purposes. The grit and amount of the abrasive used with the slurry varies based on the mechanical properties of the substrate.

A spindle unit mounted to a processing unit has a collar section extending from an outside surface of the spindle unit in a horizontal direction. The processing unit includes a bottom plate having a through-hole through which a lower portion of the spindle unit penetrates, a holder including a side plate that surrounds the spindle unit with the collar section supported by the bottom plate and that is connected to the bottom plate, and an inclination adjusting mechanism that acts on the collar section to adjust the inclination of the spindle unit. The inclination adjusting mechanism includes a spring interposed between a lower surface of the collar section and an upper surface of the bottom plate and an adjusting section that acts to compress the spring and adjusts the inclination of the spindle unit by a compression amount of the spring.

A RAMO.sub.4 substrate includes a single crystal represented by a formula of RAMO.sub.4 (in the formula, R indicates one or a plurality of trivalent elements selected from a group consisting of Sc, In, Y, and a lanthanoid element, A indicates one or a plurality of trivalent elements selected from a group consisting of Fe(III), Ga, and Al, and M indicates one or a plurality of bivalent elements selected from a group consisting of Mg, Mn, Fe(II), Co, Cu, Zn, and Cd). An epitaxially-grown surface is provided on at least one surface of the RAMO.sub.4 substrate. An unevenness having a height of 500 nm or more is not provided on the epitaxially-grown surface.

A RAMO.sub.4 substrate includes a single crystal represented by a formula of RAMO.sub.4 (in the formula, R indicates one or a plurality of trivalent elements selected from a group consisting of Sc, In, Y, and a lanthanoid element, A indicates one or a plurality of trivalent elements selected from a group consisting of Fe(III), Ga, and Al, and M indicates one or a plurality of bivalent elements selected from a group consisting of Mg, Mn, Fe(II), Co, Cu, Zn, and Cd). An epitaxially-grown surface is provided on at least one surface of the RAMO.sub.4 substrate. An unevenness having a height of 500 nm or more is not provided on the epitaxially-grown surface.