The present invention has an object of providing a stepped wafer that can prevent a resist from remaining after development, and a method for manufacturing the stepped wafer. The stepped wafer according to the present invention is a stepped wafer having a step and whose main surface is thinner in a center portion and is thicker in an outer periphery. The step includes a curved surface with a radius of curvature ranging from 300 m to 1800 m.

To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing.

The polishing apparatus 100 comprises: a holding/polishing unit 102 for holding and polishing a workpiece W1; and an identifying unit 104 for identifying data 104a associated with a state of the peripheral portion of the substrate W1 before polishing. The holding/polishing unit 102 comprises: a holder 106 for holding and rotating the substrate W1; and a polisher 108 for polishing the peripheral portion of the substrate W1 by pressing a polishing member against the peripheral portion. A polishing-condition determiner 110 determines a polishing condition, based on data 104a indicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.

A polishing device includes a bearing mechanism including a bearing plate configured to carry wafers and drive the wafer to rotate and a first polishing mechanism including at least one group of rotatable first polishing wheels. Each first polishing wheel is formed with a first polishing groove extending along a circumferential direction. Each group includes two first polishing wheels. The two first polishing wheels in each group are arranged symmetrically with respect to the bearing plate and rotation axes of the two first polishing wheels are coplanar with a rotation axis of the bearing plate. The two first polishing wheels in each group are capable of moving close to or away from the wafer, so that an inner sidewall of the first polishing groove is pressed against or moves away from the wafer.

A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process.

A rectangular substrate is prepared by providing a starting rectangular substrate having front and back surfaces and four side surfaces as ground, and pressing a rotary polishing pad perpendicularly against one side surface under a constant pressure, and relatively moving the rotary polishing pad and the substrate parallel to the side surface, for thereby polishing the side surface of the substrate. In the imprint lithography, the rectangular substrate is capable of controlling compression and pattern shape at a high accuracy and thus transferring a complex pattern of fine feature size to a recipient.

An electronic grade glass substrate is provided with a recess, channel or step in one surface, and a first chamfer between the side surface of the recess, channel or step and the one surface. The side and bottom surfaces of the recess, channel or step are mirror finished, and the first chamfer is mirror finished.

Method for processing a semiconductor-wafer having a front surface, back surface, and chamfered-portion composed of a chamfered surface on the front surface side, a chamfered surface on the back surface side, and an end face at a peripheral end, including: mirror-polishing of each portion of the chamfered surface on the front surface side, the chamfered surface on the back surface side, the end face, and an outermost peripheral-portion on the front or back surface adjacent to the chamfered surface; wherein the end face mirror-polishing and mirror-polishing of the outermost peripheral-portion on the front or back surface are performed in one step, after step of mirror-polishing the chamfered surface on the front surface side and step of mirror-polishing the chamfered surface on the back surface side; roll-off amount of the outermost peripheral-portion on the front or back surface is adjusted by one step-performed mirror-polishing of the end face and outermost peripheral-portion.

In one aspect, the invention is directed to a sharpener for sharpening a snow/ice travel member such as a skate blade, a ski or a snowboard, which includes a sharpening surface that is movable lengthwise along an edge face of the item to be sharpened. The sharpening surface may be movable lengthwise by means of a motor and a reciprocating mechanism, or may be manually moved by a user.

A method includes partially forming a top chamfer on a disc substrate with a first brush, and partially forming a bottom chamfer on the disc substrate with a second brush. The method also includes completing the formation of the bottom chamfer with the first brush, and completing the formation of the top chamfer with the second brush.

A rectangular substrate is prepared by providing a starting rectangular substrate having front and back surfaces and four side surfaces as ground, and pressing a rotary polishing pad perpendicularly against one side surface under a constant pressure, and relatively moving the rotary polishing pad and the substrate parallel to the side surface, for thereby polishing the side surface of the substrate. In the imprint lithography, the rectangular substrate is capable of controlling compression and pattern shape at a high accuracy and thus transferring a complex pattern of fine feature size to a recipient.