A processing apparatus includes a rotary table that causes a workpiece to rotate around a rotary axis, a roller-shaped member that rotates on an axis orthogonal to the rotary axis of the rotary table, a vertical driving section that is driven in a direction of the rotary axis of the rotary table so as to bring the roller-shaped member and the workpiece into contact with each other, an ultraviolet ray irradiation source that irradiates a portion between the roller-shaped member and the workpiece with an ultraviolet ray, a polishing material that is supplied to the portion between the roller-shaped member and the workpiece, and a light scattering medium that is supplied to the portion between the roller-shaped member and the workpiece and scatters an ultraviolet ray from the ultraviolet ray irradiation source.

A processing apparatus includes a rotary table that causes a workpiece to rotate around a rotary axis, a roller-shaped member that rotates on an axis orthogonal to the rotary axis of the rotary table, a vertical driving section that is driven in a direction of the rotary axis of the rotary table so as to bring the roller-shaped member and the workpiece into contact with each other, an ultraviolet ray irradiation source that irradiates a portion between the roller-shaped member and the workpiece with an ultraviolet ray, a polishing material that is supplied to the portion between the roller-shaped member and the workpiece, and a light scattering medium that is supplied to the portion between the roller-shaped member and the workpiece and scatters an ultraviolet ray from the ultraviolet ray irradiation source.

A method for removing a flaw on a treated, finally painted surface by grinding involves, after the flaw has been detected, moving a flexible abrasive sheet to the surface and pressing it against the flaw to be machined in such a way that the flaw is detected by a sensor system, which is operatively connected to a robotic arm carrying the grinding plate. The abrasive sheet, which is designed as an abrasive belt, is fed to the grinding plate and the abrasive sheet being pressed against the flaw.

A method for removing a flaw on a treated, finally painted surface by grinding involves, after the flaw has been detected, moving a flexible abrasive sheet to the surface and pressing it against the flaw to be machined in such a way that the flaw is detected by a sensor system, which is operatively connected to a robotic arm carrying the grinding plate. The abrasive sheet, which is designed as an abrasive belt, is fed to the grinding plate and the abrasive sheet being pressed against the flaw.

A processing element for processing a profile-shaped or flat metallic workpiece, with the processing element designed such that a plurality of similar processing elements can be arranged one behind the other on a supporting device in the longitudinal direction of the supporting device, the supporting device can be driven in a circulating manner and the plurality of processing elements can be guided past the workpiece for surface processing at least approximately linearly by means of the supporting device. A rectangular or block-shaped main body having bearing surfaces for bearing on the supporting device is provided, and oblong ribs protruding outward in a web-like manner are provided on the main body on opposite flat longitudinal sides and overlap the corresponding opposite flat longitudinal sides of the main body on an identically embodied processing element, which is arranged between the ribs.

A processing element for processing a profile-shaped or flat metallic workpiece, with the processing element designed such that a plurality of similar processing elements can be arranged one behind the other on a supporting device in the longitudinal direction of the supporting device, the supporting device can be driven in a circulating manner and the plurality of processing elements can be guided past the workpiece for surface processing at least approximately linearly by means of the supporting device. A rectangular or block-shaped main body having bearing surfaces for bearing on the supporting device is provided, and oblong ribs protruding outward in a web-like manner are provided on the main body on opposite flat longitudinal sides and overlap the corresponding opposite flat longitudinal sides of the main body on an identically embodied processing element, which is arranged between the ribs.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

A polisher includes a wafer carrier, a polishing head, a movement mechanism, and a rotation mechanism. The wafer carrier has a supporting surface. The supporting surface is configured to carry a wafer thereon. The polishing head is present above the wafer carrier. The polishing head has a polishing surface. The polishing surface of the polishing head is smaller than the supporting surface of the wafer carrier. The movement mechanism is configured to move the polishing head relative to the wafer carrier. The rotation mechanism is configured to rotate the polishing head relative to the wafer carrier.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.