Systems and methods are provided for viscous and/or chemically erosive flow machining of work pieces. In certain examples, a tool for flow machining may be disclosed. The tool may include a cavity configured to receive a work piece and one or more inlets and outlets for viscous media flow. Viscous media and/or chemically erosive media can be flowed into the cavity and, via a media flow path, can be used to machine the work piece.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Aspects of the present disclosure are presented for techniques in removing roughness and surface anomalies in structures with internal passages and intricate external surfaces, such as structures with internal fluid passages constructed by additive manufacturing (AM), using an abrasive slurry. Post processing methods which are capable of smoothing non-uniform surface roughness within intricate fluid passages are a prerequisite to the widespread adoption of AM for complex fluid systems. In some embodiments, a mixture of abrasive powder and deionized (DI) water is used to create a viscous slurry which can then be pumped through the internal fluid passages of a workpiece until the desired surface roughness is achieved. This abrasive flow machine (AFM) is capable of smoothing a wide range of roughnesses, internal geometries, and printable materials.

Aspects of the present disclosure are presented for techniques in removing roughness and surface anomalies in structures with internal passages and intricate external surfaces, such as structures with internal fluid passages constructed by additive manufacturing (AM), using an abrasive slurry. Post processing methods which are capable of smoothing non-uniform surface roughness within intricate fluid passages are a prerequisite to the widespread adoption of AM for complex fluid systems. In some embodiments, a mixture of abrasive powder and deionized (DI) water is used to create a viscous slurry which can then be pumped through the internal fluid passages of a workpiece until the desired surface roughness is achieved. This abrasive flow machine (AFM) is capable of smoothing a wide range of roughnesses, internal geometries, and printable materials.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

The present subject matter relates to a method and an apparatus in the form of a machine system (1200) for machining a component (100) with an internal passage (115). In an aspect, the method comprises periodically injecting 5 abrasive slurry back and forth through the internal passage (115) at a pressure ranging from about 25 bar to about 35 bar. The abrasive slurry comprises a mixture of abrasive particles having a size in the range of about 40 m to about 60 m, and a slurry medium. The volume fraction of the abrasive particles in the slurry medium is about 40% to about 50%. Further, the injection of the abrasive 10 slurry is performed for a predefined number of process cycles at predetermined time versus pressure changes to obtain the component having a final average surface roughness of less than about 3.0 m.

The present subject matter relates to a method and an apparatus in the form of a machine system (1200) for machining a component (100) with an internal passage (115). In an aspect, the method comprises periodically injecting 5 abrasive slurry back and forth through the internal passage (115) at a pressure ranging from about 25 bar to about 35 bar. The abrasive slurry comprises a mixture of abrasive particles having a size in the range of about 40 m to about 60 m, and a slurry medium. The volume fraction of the abrasive particles in the slurry medium is about 40% to about 50%. Further, the injection of the abrasive 10 slurry is performed for a predefined number of process cycles at predetermined time versus pressure changes to obtain the component having a final average surface roughness of less than about 3.0 m.

A polishing system and method for polishing a channel formed within a component is disclosed. The polishing system may include a tooling element operable to be positioned within a recess formed partially through a component. The tooling element may include an outer surface having a geometry corresponding to a geometry of the recess formed in the component. The tooling element forms a channel between the recess of the component and the tooling element when positioned in the recess. The system may also include a first member in fluid communication with a first opening of the channel, and a second member in fluid communication with a second opening of the channel. The second opening may be in fluid communication with the first opening via the channel. Additionally, the first and second member may be configured to continuously vary a pressure within the channel to move an abrasive slurry within the channel.