B24B31/116

Chamber components with polished internal apertures

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Device for precision machining of sphere, and method for precision machining of sphere using same

A sphere precision machining device and a machining method comprise a cavity, an abrasive grain stream, and a circulation device. The cavity holds the workpiece, and comprises two hollow hemispheres, each of said two hemispheres being provided with a main flow channel. Said main flow channel is connected to the cavity. One end of the main flow path of each of the two said hemispheres is connected to a circulating means by which a stream of abrasive grains is made to grind the workpiece. A plurality of main flow channels are disposed homogeneously inside the hemisphere, each of said main flow channels being provided with a plurality of branch flow channels connected to the cavity, said branch flow channels tapering in the flow direction. The present disclosure uses the difference in abrasive grain flow pressure on the surface of the workpiece to achieve precision machining.

Device for precision machining of sphere, and method for precision machining of sphere using same

A sphere precision machining device and a machining method comprise a cavity, an abrasive grain stream, and a circulation device. The cavity holds the workpiece, and comprises two hollow hemispheres, each of said two hemispheres being provided with a main flow channel. Said main flow channel is connected to the cavity. One end of the main flow path of each of the two said hemispheres is connected to a circulating means by which a stream of abrasive grains is made to grind the workpiece. A plurality of main flow channels are disposed homogeneously inside the hemisphere, each of said main flow channels being provided with a plurality of branch flow channels connected to the cavity, said branch flow channels tapering in the flow direction. The present disclosure uses the difference in abrasive grain flow pressure on the surface of the workpiece to achieve precision machining.

Device for polishing workpiece surfaces
09623536 · 2017-04-18 · ·

A device for polishing metallic workpiece surfaces. The device includes a tool holder which can be exchangeably fitted into a rotationally driven working spindle of a program-controlled milling machine, and a polishing tool, which is fastened in the tool holder. The device also includes a tool shank and a polishing head at the free end thereof, and is coupled to a polishing agent supply which arrives at the effective surface of the polishing head. The tool shank contains a chamber, which can admit a pressure medium and is at least partially filled with the polishing agent, wherein this chamber is in connection with the polishing head by way of a channel and wherein the polishing head has polishing agent permeable material or it contains passages for the polishing agent that is forced out of the chamber.

Device for polishing workpiece surfaces
09623536 · 2017-04-18 · ·

A device for polishing metallic workpiece surfaces. The device includes a tool holder which can be exchangeably fitted into a rotationally driven working spindle of a program-controlled milling machine, and a polishing tool, which is fastened in the tool holder. The device also includes a tool shank and a polishing head at the free end thereof, and is coupled to a polishing agent supply which arrives at the effective surface of the polishing head. The tool shank contains a chamber, which can admit a pressure medium and is at least partially filled with the polishing agent, wherein this chamber is in connection with the polishing head by way of a channel and wherein the polishing head has polishing agent permeable material or it contains passages for the polishing agent that is forced out of the chamber.

DIE FOR DRAWING METAL WIRE ROD, AND METHOD FOR MANUFACTURING SAME
20170056946 · 2017-03-02 · ·

Provided are a metal wire rod drawing die that has a longer life than conventional dies and that can prevent damage to a metal wire rod surface and a method for manufacturing the die. In a metal wire rod drawing die (1), a die hole (2) for inserting a metal wire rod is formed. Where Ra1 represents a surface roughness of an inner surface of the die hole from a bearing section (2b) to an approach section (2a) corresponding to an area reduction rate of 30% in an axial direction of the die hole, Ra2 represents a surface roughness of the inner surface of the die hole from the bearing section to the approach section corresponding to the area reduction rate of 30% in a direction orthogonal to the axial direction of the die hole, and Ra3 represents a surface roughness of an inner surface of the bearing section of the die hole in the axial direction of the die hole, the Ra1, the Ra2, and the Ra3 satisfy a relationship represented by 0.14 m>Ra2>Ra1>Ra3.

POLISHING SYSTEM BASED ON THE NON-NEWTON FLUID AND POLISHING METHOD THEREOF
20170050285 · 2017-02-23 ·

A polishing system based on a non-Newtonian fluid and a polishing method thereof are provided. The polishing system includes a polishing device, a non-Newtonian fluid auxiliary device and a control device. The polishing device is able to move a work piece in a polishing container containing the non-Newtonian fluid with abrasives that cause the polishing action. The non-Newtonian fluid auxiliary device is able to manipulate the viscosity of the non-Newtonian fluid by varying the pressure, speed, vibration or ultrasonic frequency, which causes the abrasives to polish the work piece. The control device is used to optimize the polishing process by controlling how the polishing device moves the work piece inside the polishing container. In this way, by using the polishing method, the polishing system provided is able to polish a work piece with any three-dimensional shape.

Tool for abrasive flow machining of airfoil clusters

A tool for use during the abrasive flow polishing of an airfoil cluster in an abrasive flow machine is described. The tool may comprise a body and prongs extending from the body. Each prong of the tool may be configured to insert between an adjacent pair of airfoils of the airfoil cluster to create at least one channel therebetween. The channel may allow the flow of an abrasive media therethrough.

Tool for abrasive flow machining of airfoil clusters

A tool for use during the abrasive flow polishing of an airfoil cluster in an abrasive flow machine is described. The tool may comprise a body and prongs extending from the body. Each prong of the tool may be configured to insert between an adjacent pair of airfoils of the airfoil cluster to create at least one channel therebetween. The channel may allow the flow of an abrasive media therethrough.

Method and apparatus for finishing a surface of a component

A method and apparatus for finishing a surface of a component. The method includes installing the component in an apparatus configured to deliver a flow of abrasives to the surface and to generate cavitation bubbles in a liquid contacting the surface using a cavitation generator that includes an ultrasonic generator configured to generate cavitation bubbles in the liquid contacting the surface by ultrasonic excitation in the liquid or a laser configured to generate cavitation bubbles in the liquid contacting the surface by laser excitation in the liquid; controlling the cavitation generator such that cavitation bubbles are generated to finish the surface by implosion of the cavitation bubbles; and controlling the flow of slurry to the surface so as to finish the surface by abrasion. An apparatus for finishing a surface of a component is also disclosed.