A carrier for use in a polishing machine and a method for using the carrier during the polishing of glass substrate disks intended for use in the hard disk media of a hard disk drive. Grooves are provided in top and bottom surfaces of the carrier to, e.g., increase the flow of polishing slurry between the carrier and a pair of upper and lower polishing pads of the polishing machine during a polishing operation. Opposing grooves within the top and bottom surfaces of the carrier may be staggered or offset relative to one another. Slurry passage holes may be provided in the carrier that intersect with the grooves to allow for the passage of slurry into the grooves during polishing. Method and apparatus examples are described.

This disclosure aims to provide a double-side polishing apparatus for a workpiece and a double-side polishing method for a workpiece, capable of suppressing roll-off of the outer peripheral shape of the workpiece. The temperature of polishing slurry is individually adjusted for each of a plurality of slurry supply systems.

This disclosure aims to provide a double-side polishing apparatus for a workpiece and a double-side polishing method for a workpiece, capable of suppressing roll-off of the outer peripheral shape of the workpiece. The temperature of polishing slurry is individually adjusted for each of a plurality of slurry supply systems.