A double disc surface grinding machine includes a clamp band which has a non-circular outer circumferential portion. The clamp band is attached to an outer circumferential surface of a work and is housed, under the attached state, in a storage portion which has a non-circular inner circumferential portion engageable with the outer circumferential portion of the clamp band, movably in a first direction. A rotation drive unit rotates the storage portion around a first rotation shaft extending in the first direction, to make the inner circumferential portion of the storage portion engage with the outer circumferential portion of the clamp band, thereby rotates the clamp band and the work together with the storage portion. At least one of the grinding wheels is fed onto the work so as to sandwich the work with a pair of rotating grinding wheels for grinding two main surfaces of the work.

A double disc surface grinding machine includes a clamp band which has a non-circular outer circumferential portion. The clamp band is attached to an outer circumferential surface of a work and is housed, under the attached state, in a storage portion which has a non-circular inner circumferential portion engageable with the outer circumferential portion of the clamp band, movably in a first direction. A rotation drive unit rotates the storage portion around a first rotation shaft extending in the first direction, to make the inner circumferential portion of the storage portion engage with the outer circumferential portion of the clamp band, thereby rotates the clamp band and the work together with the storage portion. At least one of the grinding wheels is fed onto the work so as to sandwich the work with a pair of rotating grinding wheels for grinding two main surfaces of the work.

The invention refers to a double-sided polishing or sanding member (24) for releasable attachment to a hand-guided power tool (2). The polishing or sanding member (24) has an essentially disc-shaped form with an areal extension (26). A reinforcement plate (28) is located inside the polishing or sanding member (24) in the areal extension (26). The reinforcement plate (28) has a central attachment portion (30) for releasable attachment of the polishing or sanding member (24) to the power tool (2). It is suggested that the central attachment portion (30) comprises at least one magnetic element (32) adapted for interaction with at least one respective magnetic element (34) directly or indirectly attached to a tool shaft (14) of the power tool (2) in order to hold and secure the polishing or sanding member (24) in respect to the tool shaft (14).

The invention refers to a double-sided polishing or sanding member (24) for releasable attachment to a hand-guided power tool (2). The polishing or sanding member (24) has an essentially disc-shaped form with an areal extension (26). A reinforcement plate (28) is located inside the polishing or sanding member (24) in the areal extension (26). The reinforcement plate (28) has a central attachment portion (30) for releasable attachment of the polishing or sanding member (24) to the power tool (2). It is suggested that the central attachment portion (30) comprises at least one magnetic element (32) adapted for interaction with at least one respective magnetic element (34) directly or indirectly attached to a tool shaft (14) of the power tool (2) in order to hold and secure the polishing or sanding member (24) in respect to the tool shaft (14).

Provided a method of producing a carrier which make it possible to prevent the reduction in the flatness of a semiconductor wafer even if the semiconductor wafer is subjected to repeated double-side polishing procedures. The method of producing a carrier including a metal portion and a ring-shaped resin portion includes: a preparation step of preparing the metal portion and the resin portion (Step S1); a placement step of placing the resin portion in the retainer opening in the metal portion (Step S2); and a resin portion polishing step of polishing both surface of the resin portion (Step S4). The method includes, prior to the resin portion polishing step (Step S4), a production stage swelling step of swelling the resin portion placed in the retainer opening in the metal portion by impregnating the resin portion with a first liquid (Step S3).

Provided a method of producing a carrier which make it possible to prevent the reduction in the flatness of a semiconductor wafer even if the semiconductor wafer is subjected to repeated double-side polishing procedures. The method of producing a carrier including a metal portion and a ring-shaped resin portion includes: a preparation step of preparing the metal portion and the resin portion (Step S1); a placement step of placing the resin portion in the retainer opening in the metal portion (Step S2); and a resin portion polishing step of polishing both surface of the resin portion (Step S4). The method includes, prior to the resin portion polishing step (Step S4), a production stage swelling step of swelling the resin portion placed in the retainer opening in the metal portion by impregnating the resin portion with a first liquid (Step S3).

A manufacturing method of a carrier for a double-side polishing apparatus, including: preparing a carrier base material and insert thicker than the carrier base material, inserting the insert into a holding hole so as to protrude the insert from both sides of the front surface and back surface of the carrier base material, measuring each of a front protruding amount of the insert protruded from front surface of the carrier base material and a back protruding amount of the insert protruded from back surface of the carrier base material, setting each rotational speed of the upper turn table and lower turn table in starting-up polishing of the carrier so as to decrease the difference between the front protruding amount and back protruding amount, and a starting-up polishing step to subject the carrier to starting-up polishing at each set rotational speed of the upper turn table and the lower turn table.

A manufacturing method of a carrier for a double-side polishing apparatus, including: preparing a carrier base material and insert thicker than the carrier base material, inserting the insert into a holding hole so as to protrude the insert from both sides of the front surface and back surface of the carrier base material, measuring each of a front protruding amount of the insert protruded from front surface of the carrier base material and a back protruding amount of the insert protruded from back surface of the carrier base material, setting each rotational speed of the upper turn table and lower turn table in starting-up polishing of the carrier so as to decrease the difference between the front protruding amount and back protruding amount, and a starting-up polishing step to subject the carrier to starting-up polishing at each set rotational speed of the upper turn table and the lower turn table.

A rotor disk for guiding workpieces in a double-sided processing machine including a fluid feeding apparatus to feed a processing fluid into a working gap between a first working disk and a second working disk is provided. The rotor disk comprises a surface defining at least one workpiece opening configured to receive at least one workpiece to be processed on both sides in the double-sided processing machine in a material-removing manner using the processing fluid. A contact angle of a drop of the processing fluid with the surface is at least 60°.

The invention relates to an assembly for loading parts to be treated into a single-side or double-side treatment machine, comprising—a part holder in the form of a plate for holding at least one part to be treated, comprising a second side and first side, said first side being flat, and said part holder delimiting at least one through-hole forming a cell for housing at least one part to be treated, and a film mounted on the first side of the part holder opposite said through-hole, allowing said part to be treated to be held at least during the loading step.