A substrate processing apparatus includes: a cassette block configured to mount a cassette that accommodates a substrate; a processing block configured to process the substrate; a relay block configured to relay the substrate between the cassette block and the processing block; and a controller. The processing block includes a processing module that performs a removal process of removing a part of the substrate. The relay block includes a weight measuring unit that measures a weight of the substrate before or after being processed by the processing block. The controller includes a removal amount determination unit that calculates a weight difference of the substrate before and after being processed by the processing block using the measurement result of the weight measuring unit and determines whether a removal amount by the removal process is within a permissible range.

A processing machine includes a chuck table, a chuck table cover having an opening through which a holding surface of the chuck table can protrude, a processing unit having a spindle, a spindle housing, and a mount portion arranged on a lower end portion of the spindle, the processing unit being configured to process a workpiece by a processing tool mounted on a lower part of the mount portion, a processing chamber construction cover that covers the chuck table and the mount portion. The processing machine further includes a processing tool cover that is secured to a lower end portion of the spindle housing and that has an upper wall and a side wall that extends downwardly from the upper wall. The processing tool cover is disposed inside the processing chamber construction cover and covers the processing tool from above and sides by the upper and side walls.

A horizontal pre-clean (HPC) module for a chemical mechanical polishing (CMP) processing system is disclosed. The HPC module includes a chamber having a basin and a lid which collectively define a processing area. The module includes a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including an array of channels defined in a supporting surface thereof. The module includes a pad conditioning station disposed proximate to the rotatable vacuum table. The module includes a pad carrier positioning arm coupled to a pad carrier assembly. The module includes an actuator coupled to the pad carrier positioning arm and configured to position the pad carrier assembly between a first position over the rotatable vacuum table and a second position over the pad conditioning station.

The invention relates to an equipment having an upstream holder for a supply reel carrying a continuous ribbon, a portion of which is suitable for forming a film intended to cover a support plate, a downstream holder, an assembly station having a base comprising having a first platen, an actuator with a movable part carrying a second platen, the second platen or the first platen being adapted to receive a support plate, wherein the second platen is adapted to cooperate with the first platen to form a tooling capable of contacting the film and the support plate when the portion of the ribbon forming the film is located between the second platen and the first platen, facing the support plate.

The invention relates to a device (10) and a method for processing brake pads (44) fitted on pad holders (46), comprising a conveying device (16) for continuous and automatic movement of brake pads (44) to be processed and at least one processing station (12). The conveying device (16) of a device according to the invention (10) comprises several bearing faces, which are driven in a revolving manner by the conveying device (16), for the arrangement of pad holders (46) of the brake pads (44) to be processed and positioning means revolving with the bearing faces, said positioning means counteracting a rotation of the pad holders (46).

A method of manufacturing a wafer holder, the wafer holder having a frame having at least one cavity capable of receiving and supporting a wafer grown from an ingot to be polished in a polishing machine, the at least one cavity having a cross sectional footprint at least equal to a cross sectional footprint of the wafer, the wafer having a thickness to cross sectional area ratio of 0.001 per unit length or less, a polymer film pad being permanently affixed in the at least one cavity, including cutting a frame from a layer of a thermoset or thermoplastic material having a thickness tolerance and measuring a thickness of the frame at at least one location thereon. The method further includes forming a cavity in the frame having a predetermined depth, and permanently affixing a polymer film pad in the cavity.

A processing apparatus includes a holder configured to hold a substrate; a grinding device configured to perform a grinding on a processing surface of the substrate held on the holder; a transfer device configured to transfer the substrate to the holder; and a controller configured to control the holder, the grinding device and the transfer device. The controller controls the holder, the grinding device and the transfer device to perform performing initialization of the holder, initialization of the grinding device and initialization of the transfer device after the processing apparatus is stopped during an operation thereof and the processing apparatus is restarted; detecting the substrate on the holder; deciding whether the grinding on the detected substrate by the grinding device is required; and performing, by the grinding device, the grinding on the processing surface of the substrate on which the grinding is decided to be required.

A mechanism that conveys a substrate is cleaned in a cleaning unit. A substrate processing apparatus that includes a substrate polishing device and a substrate cleaning unit is disclosed. The substrate cleaning unit includes a cleaning module and a cleaning unit conveyance mechanism. The cleaning unit conveyance mechanism includes a hand and a hand open/close mechanism. The substrate processing apparatus further includes a hand cleaning unit. The hand cleaning unit includes a hand cleaning tank and a cleaning liquid injection mechanism.

A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.

A grinding apparatus includes a chuck table that holds a wafer on a holding surface; a grinding unit that has a spindle unit in which a spindle with an annular grindstone mounted to a tip thereof is rotatably supported and that grinds the wafer by use of the grindstone; a grinding feeding mechanism that puts the grinding unit into grinding feeding in a grinding feeding direction perpendicular to the holding surface; a first height gauge that measures the height of the holding surface; a second height gauge that measures the height of an upper surface of the wafer; and a calculation section that calculates the difference between the height of the holding surface and the height of the upper surface of the wafer, as the thickness of the wafer. In the grinding apparatus, the first height gauge and the second height gauge are disposed in the grinding unit.