Disclosed herein is a processing machine including a processing unit and a workpiece holding unit. The processing unit has a processor wheel with a processor fixed on a lower surface of an annular base, and a mount fixed on a spindle, and processes a workpiece by the processor with the processor wheel mounted on the mount. The processor wheel has a plurality of flange portions arranged at equal angular intervals on an inner peripheral surface of the annular base and extending from the inner peripheral surface toward a center of the processor wheel. The mount has a plurality of clasp portions configured to clasp the flange portions, a plurality of springs biasing the clasp portions in an upward direction in an axial direction of the spindle, and a plurality of support portions configured to support the clasp portions movably in the axial direction.

A device capable of being attached to a work machine and which is designed to remove fireproofing, insulation and other material from buildings. The device includes a brush element that, when in contact with the material, rotates and strips the material from the building. The device is elevated by the work machine to contact the material to be stripped. This enables rapid clearing of the material with significantly fewer personnel.

A device capable of being attached to a work machine and which is designed to remove fireproofing, insulation and other material from buildings. The device includes a brush element that, when in contact with the material, rotates and strips the material from the building. The device is elevated by the work machine to contact the material to be stripped. This enables rapid clearing of the material with significantly fewer personnel.

A system includes an abrasion assembly containing one or more abrasion pads configured to clean a faying surface of multiple nutplates, and a shaft attached to at least one of the abrasion pads and configured to rotate some or all of the abrasion pads during cleaning, wherein cleaning includes abrading the faying surfaces with the abrasion pads. The system also includes a base configured to attach to a pressure applicator, and a pressure applicator configured to attach to the base, hold the nutplates such that the faying surface of each nutplate is capable of contacting one of the abrasion pads, and apply pressure to the nutplates such that each of the nutplates contact one of the abrasion pads during the cleaning. Furthermore, the abrasion assembly is configured to rotate the abrasion pads within at least one of the base and the pressure applicator during cleaning.

A system for abrading irregular surfaces includes a bracket that can be attached to a shop aid. The bracket carries two motors to which abrasive pads are attached, and the positions of the motors are controlled to move abrasive elements over the surface to be abraded. The abrasive pads are attached to abrasive-pad backing of different configurations. Disclosed configurations are generally flat, triangular, and U-shaped.

In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.

In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.

Chemical mechanical polishing can be used for “touch-up polishing” in which polishing is performed on a limited area of the front surface of the substrate. The contact area between the polishing pad and the substrate can be substantially smaller than the radius surface of the substrate. During polishing, the polishing pad can undergo an orbital motion. The polishing pad can be maintained in a fixed angular orientation during the orbital motion. The contact area can be arc-shaped. The contact area can be provided by one or more lower portions projecting downward from an upper portion of the polishing pad. A perimeter portion of the polishing pad can be vertically fixed to an annular member and a remainder of the polishing pad within the perimeter portion can be vertically free.

A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad, a reinforcement layer or ring, and multiple floor-contacting disks. In another aspect, the reinforcement layer includes a central hole through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension greater than a linear dimension of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape.

A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad, a reinforcement layer or ring, and multiple floor-contacting disks. In another aspect, the reinforcement layer includes a central hole through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension greater than a linear dimension of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape.