An apparatus for separating a first liner from a lens wafer includes: at least one air nozzle including a first open end facing an edge of the lens wafer and configured to eject a gas, the at least one air nozzle disposed proximal to a first lens wafer holder configured to hold the lens wafer having the first liner attached to a first surface of the lens wafer, a first peeling device including a second lens wafer holder configured to hold the lens wafer, a first auxiliary air nozzle facing the lens wafer and including a first opening configured to eject a gas, and a first at least one suction cup configured to contact the first liner on the first surface of the lens wafer and form a vacuum seal with the first liner, each suction cup of the first at least one suction cup being retractable in a direction away from the lens wafer.

A wheel fixture is disclosed. A main shaft drives a first positioning pull rod on a chuck body to extend and contract in the radial direction via a tightening screw, a clamping jaw is at a position within the travel range of extension and contraction, a wheel is positioned and clamped by the fixture, airtight support blocks are pressed down by the wheel and flush with the support plane of the clamping jaw, at this time, airtight ejector rods press second O rings to prevent air from flowing out of the airtight detection position, a detection system of a machine tool detects a preset air pressure value which indicate that the wheel has been placed correctly, and if the wheel is not placed correctly on the fixture, the machine tool will alarm through the detected pressure feedback.

A polishing apparatus includes a holding table having a holding surface that holds a wafer, a polishing unit in which a polishing pad having an opening at the center of a polishing surface that polishes the wafer is mounted to a spindle and is rotated, a slurry supply unit that supplies slurry to the polishing surface of the polishing pad, and an air supply unit that shuts an upper end of a penetrating path penetrating through the axial center of rotation of the polishing pad and the spindle and supplies air into the penetrating path.

Provided is a cylindrical grinder that is capable of automatically moving and fixing a tailstock in accordance with variations in length of a workpiece and enables improvement in its productivity. An NC cylindrical grinder includes: a table as a base; a headstock and an NC tailstock both arranged on the table; a moving mechanism configured to move at least either one of the headstock and the tailstock in a Z-axis direction; and a protective cover provided to the table and configured to protect the moving mechanism. In an area between the headstock and the tailstock and at a height position above the protective cover, a tooling base for mounting a tooling instrument thereon is arranged in a freely movable manner in the Z-axis direction. Provided is a guide mechanism for guiding the tooling base in the Z-axis direction and fixing the tooling base to the table at a required position.

A component according to the disclosure may include: a rotatable body having an aperture therein for receiving one of a turbomachine shaft or a lathe chuck, wherein the aperture is oriented substantially axially relative to an axis of rotation of the rotatable body; and a flange coupled to and in direct axial contact with the body, the flange including a surface that extends axially relative to the axis of rotation of the body, wherein the surface of the flange comprises a matingly engageable face configured to contact an axially aligned surface during operation of the component, the matingly engageable face having a burnishing indentation thereon, wherein a surface roughness of the surface of the flange is less than a surface roughness of a remainder of the flange, and wherein a compressive stress of the surface of the flange is greater than a compressive stress of the remainder of the component.

Embodiments of the present disclosure provide surface treatment tools, methodologies, and/or repaired turbomachine components. A surface treatment tool according to the present disclosure can include a lathe assembly having a lathe chuck for receiving a component thereon, wherein the lathe chuck rotates the component about a first axis of rotation, and wherein the component includes an exposed axial target surface; and a sander or burnishing tool coupled to the lathe assembly and including a sanding or burnishing surface thereon, coupled to a drive system, wherein the sanding or burnishing surface rotates about a second axis of rotation substantially non-parallel with the first axis of rotation, such that the sanding or burnishing surface selectively contacts the target surface of the component to yield a polished target surface.

The present invention relates to several systems and methods for clamping, machining, inspecting, and/or correcting workpieces in an integrated machine.

Loopback rolls which can transfer and guide a polishing tape (T) in a tangential direction of a pressure contact roll (R) is provided, a top edge face (RG1) and a tapered peripheral edge (RG) having a pair of slant edge faces (RG2) are formed on a periphery of the pressure contact roll, by both of which the polishing tape can be bent into a substantially V-shape in cross section, and a switchable pressure contact mechanism (7) is switchably provided which pressure contacts each of bent portions (T) of the polishing tape, which is bent into the substantially V-shape in cross section by the tapered peripheral edge to one tooth face (B1) or the other tooth face of a bottom land (B) of a worm (W).

A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. The rotary joint has a communication channel by which the first suction channel and the second suction channel are held in fluid communication with at least a suction source.

A substrate processing apparatus includes: a first polishing head configured to polish a first surface of a substrate by sliding a polishing tool on the first surface; a second polishing head configured to polish the first surface of the substrate by sliding a polishing tool on the first surface, the second polishing head having a smaller diameter than a diameter of the first polishing head; and a substrate support mechanism configured to support the substrate by a fluid pressure at positions corresponding to the first polishing head and the second polishing head, the substrate support mechanism being configured to support the substrate from a second surface of the substrate opposite to the first surface.