A grinding machine for machining workpieces includes a workpiece headstock and two grinding headstocks. A first grinding headstock has two grinding spindles each with one grinding wheel for grinding first and second planar and non-planar external surfaces. A second grinding headstock has a grinding spindle having a grinding wheel for grinding a central bore in the workpiece, and a clamping device to clamp the workpiece. First, the bore and the first planar and any non-planar external surface are ground on one side of the workpiece. Then, the workpiece is clamped in the bore. The second planar external surface can then be ground in the same grinding machine with one of the grinding wheels of the first headstock. The clamping device attached to the second grinding headstock is such that the central axis of the clamping device is exactly aligned with the central axis of the workpiece headstock.

A method of connecting a ferrule to an optical fiber polishing fixture assembly comprises obtaining a fixture base to which a clamping assembly is operatively connected, positioning a lever in an unlocked position thereby creating a gap between first and second base portions, obtaining a fiber optic connector and cable assembly including a ferrule operatively connected to a cable, positioning the ferrule in a ferrule bore, and moving the lever from the unlocked position to a locked position thereby causing the first and second base portions to engage the fiber optic connector and cable assembly.

A platen for a metallographic grinder has an outer peripheral rim with an upper surface having a lower height. Also, fingers engaging a specimen are allowed to move laterally (i.e., wobble) to minimize the tipping forces on the specimen during the grinding process. Either one or both of these structures can be employed and results in a much flatter specimen surface for use in subsequent analysis.

A wheel burr cleaning device comprises a lower turnover system, a lower turnover system, a center hole burr brushing system, a back cavity burr brushing system, an upper lifting rotation system. The present disclosure not only can be used for removing burrs from the center hole of the wheel, the roots of the flanges and the edge of each spoke, but also can adapt to the wheels of different sizes and different widths.

A rock sanding device includes a base, a bottom sanding plate, an adjustable connecting rod, an elastic loader, a connector, a side sanding brush, a top sanding plate, an inner rod, a prong and a drill rod. The top of the drill rod is fixedly connected with the rotating shaft of the external water drilling rig and the external water drilling rig has a water inlet joint to introduce water into the drill rod. The inner rod and drill rod are connected and fixed coaxially, and the bottom of the drill rod is symmetrically welded with four prongs. The rock specimen is placed in the center of the side sanding brush. The top sanding plate and the bottom sanding plate are provided in the top side and bottom side of the rock specimen, respectively.

A device for removing burrs from bolt holes of an aluminum alloy wheel is composed of a frame, a support plate, clamping guide rails, clamping motors, clamping sliders, support rods, clamping wheels, racks, gears, a brush disc, a support sleeve, a feed slide, guide pillars, a feed linear motor, a pitch adjustment linear motor, a conical pitch head, horizontal push rods, sliders, springs, burr brush drive motors and burr brushes. The device can meet the requirements of an automatic production line and can be used for automatically removing burrs from the inner walls of bolt hole countersinks. The device has certain flexibility and can adjust pitch diameter, can be used for removing burrs from bolt hole countersinks having different diameters, and is easy to manufacture, economical, practical and convenient to operate.

A substrate processing apparatus which can remove foreign matters attached to the entire upper surface of a substrate such as a wafer is disclosed. The substrate processing apparatus includes: a substrate holding apparatus; and a processing head configured to scrub an upper surface of a substrate. The substrate holding apparatus includes: a substrate holder configured to hold the substrate; and a substrate rotating mechanism configured to rotate the substrate held by the substrate holder. The substrate holder is disposed below the upper surface of the substrate so as not to project above the upper surface of the substrate in a state where the substrate is held by the substrate holder.

A cutting apparatus includes a chuck table for holding a workpiece thereon, a cutting unit for cutting the workpiece held on the chuck table with a cutting blade secured in place on a distal-end portion of a spindle by a mount flange mounted on the distal-end portion of the spindle, an indexing feed unit for moving the cutting unit in indexing feed directions parallel to axial directions of the spindle, a processing feed unit for moving the chuck table in processing feed directions perpendicular to the indexing feed directions, and an end face correction unit for correcting an end face of the mount flange that supports the cutting blade in contact therewith. The processing feed unit includes a table moving base that supports the chuck table thereon and an actuating mechanism for moving the table moving base. The end face correction unit is fixedly mounted on the table moving base.

A polishing head having a simple construction and a compact size is disclosed. The polishing head includes: a polishing-tool pressing member for supporting a polishing tool; a movable shaft coupled to the polishing-tool pressing member; a housing which houses the movable shaft therein; and a diaphragm which forms a pressure chamber between an end portion of the movable shaft and the housing, the diaphragm including a central portion in contact with the end portion of the movable shaft, an inner wall portion connecting with the central portion and extending along a side surface of the movable shaft, a folded-back portion connecting with the inner wall portion and having a curved cross section, and an outer wall portion connecting with the folded-back portion and located outside the inner wall portion.

A substrate holding apparatus which can stably hold a substrate, such as a wafer, while causing the substrate to make a circular motion and rotating the substrate about its axis is disclosed. The substrate holding apparatus includes: rollers; electric motors configured to rotate the rollers; eccentric shafts arranged around a central axis; and actuators. The eccentric shafts include movable shafts and reference shafts, the actuators are coupled to the movable shafts, respectively, and the actuators are configured to move the movable shafts in a direction closer to the reference shafts and in a direction away from the reference shafts.