Rather than machine tools, nowadays robots are used to some extent for the machining of workpieces. The robot holds the tool and machines the workpiece directly. On account of the stiffness of the robot arm, this is currently possible only with imprecise applications with tolerances of not less than 0.1 mm. The invention is intended to make it possible to improve the feed by such robots or portal solutions such that the tolerances are reduced without substantially acting on the production processes. This is allowed by a table-mounted positioning apparatus, in which a positioning unit is connected to the table. The positioning unit has a position sleeve, into which the robot introduces an external holding device for receiving the workpiece, or for receiving the tool. On account of a defined mounting of the position sleeve about a first main axis of rotation about an inner holding device, which holds the tool, or the workpiece, improved positioning of the robot arm can be achieved by the additional support thus created. The positioning unit is in this case passive, i.e. is moved by the robot arm itself.

A clamping device for clamping an article or workpiece to be balanced includes a clamping apparatus for clamping the article. The clamping apparatus has an adjusting device for adjusting the clamping diameter of a clamping body of the clamping apparatus for clamping the article on a placement surface. The clamping body has a disk-shaped spring element sprung in radial direction with a centrally disposed clearance forming at least one spring element cone. The clamping body also has a clamping element inserted into the clearance and having at least one corresponding clamping element cone. The adjusting device has an actuating device for displacing the clamping element relative to the spring element, for moving the cone surfaces of the clamping element cone and the spring element cone relative to one another and for consequently clamping and/or unclamping the spring element in radial direction by the cone surfaces.

A grinding apparatus has a hermetically sealed chamber defined by a portion of a holding surface which extends radially outwardly from a wafer, an outer wall surface of a first annular packing, a lower surface of a plate, and an inner wall surface of a second annular packing. A negative pressure is developed by suction forces applied from the holding surface, allowing the atmospheric pressure to press the plate toward the holding surface and causing the first annular packing to press an outer circumferential portion of the wafer against the holding surface. Since the outer circumferential portion of the wafer is pressed against the holding surface under the suction forces from the holding surface and the atmospheric pressure, the forces pressing the outer circumferential portion of the wafer against the holding surface are increased easily at a low cost without increasing the size and weight of the grinding apparatus.

A workpiece spindle for a magnetic-shoe external cylindrical grinding machine a spindle for rotating a ring-shaped workpiece, a holding device for holding the ring-shaped workpiece and a hydraulic magnetic core lifting device coupled to the spindle and to the holding device to vary an axial spacing between the holding device and the spindle. The holding device has a magnetic shoe for clamping the ring-shaped workpiece in the holding device.

A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

The present disclosure provides an adjustable device for removing burrs of a back cavity of a wheel. The adjustable device for removing the burrs of the back cavity of the wheel includes a frame provided with a rotary table inside, a support frame is fixedly connected to the rotary table, and a left rotary table and a right rotary table are arranged on the support frame. The device is ingenious in design, novel in conception, high in universality, short in cycle time and high in efficiency, and is suitable for removing burrs of wheels in different specifications.

A workpiece supporting device (6) includes a base stand (10), a shoe (11) which is disposed on at least one place in a circumferential direction of a workpiece (1a) that is rotationally driven using a rotary drive device (4) and is in sliding contact with a circumferential surface of the workpiece (1a), and a supporting body (12) which supports the shoe (11) with respect to the base stand (10). The supporting body (12) includes a compliant structure portion (a leaf spring (14)) which tilts the shoe (11) in accordance with tilting of the workpiece (1a) with respect to the base stand (10).

A system and method for grinding the exterior of a shaft part with rotationally symmetrical sections and bases which have centering bores and which define a reference longitudinal axis and rotational axis of the shaft part. The shaft part is held between tips which engage into the centering bores during the grinding process using a grinding disk, and the shaft part is additionally supported on the rotationally symmetrical sections by means of a support device. The current diameter values of the rotationally symmetrical sections are measured and transmitted to a controller, by means of which the support device is updated with respect to the measured diameter values while continuously supporting the rotationally symmetrical sections until target dimensions are achieved.

Disclosed in the application are a multifunctional wheel burr removing device, which includes a lower brush system, a turnover system, a synchronous clamping and rotating system, an upper brush system and the like. The multifunctional wheel burr removing device may be used for removing burrs from a riser, a cap seam allowance, a valve hole, bolt holes and bolt counter bores of a wheel, and has the characteristics of high automation degree, high removal efficiency, advanced process, strong universality, and safe and stable performance at the same time.

A method for processing fracture surfaces of a ductile metal component by processing fracture surfaces (51a and 52a) of fracture components (51 and 52) into which the ductile metal component (50) is divided by fracturing the ductile metal component (50) in a fracture direction includes: a holding step of holding the fracture components in a state in which the fracture surfaces of the fracture components are separated from each other; a vibration step of imparting predetermined vibration to at least either one of the fracture components being held in the holding step in a direction intersecting the fracture direction; a pressing step of pressing the fracture surfaces of the fracture components against each other by a specified pressing force in a state in which the vibration is imparted by the vibration step; and a separation step of separating the fracture surfaces of the fracture components from each other after the pressing step in the state in which the vibration is imparted by the vibration step.