A chuck for a machine tool having a rotation spindle with a main axis of rotation. The chuck comprises a base plate, a first rotatable plate eccentrically mounted on the base plate, a second rotatable plate eccentrically mounted on the first rotatable plate, balancing means for aligning a principal axis of inertia of the chuck with the main axis of rotation and a holding mechanism. The chuck is provided with an actuating mechanism for angularly displacing the first rotatable plate around a first rotation axis over a first angle of rotation and/or the second rotatable plate around a second rotation axis over a second angle of rotation such that the position of the object with respect to the main axis of rotation can be altered.

A glass-plate working apparatus 1 includes: a scribe line forming device 5, glass-plate bend-breaking devices 15A and 15B, glass-plate peripheral edge grinding devices 19A and 19B, and a glass-plate transporting device 20 for carrying in and carrying out two glass plates 2 at a time with respect to each of the scribe line forming device 5, the glass-plate bend-breaking devices 15A and 15B, and the glass-plate peripheral edge grinding devices 19A and 19B, and X-Y coordinate system controlled movement of the glass-plate peripheral edge grinding devices 19A and 19B in simultaneous grinding of peripheral edges of the glass plates 2 is adapted to be effected independently of each other.

A glass support system for a glass edge finishing apparatus includes a vacuum member that is configured to extend lengthwise in a glass feed direction and along an edge of a glass substrate. The vacuum member has a vacuum body that includes a pressure chamber located therein and a support surface having an array of vacuum openings extending therethrough and in communication with the pressure chamber. The array of vacuum openings is arranged in multiple, side-by-side rows with substantially uniform spacing between the vacuum openings along each one of the multiple rows.

A glass substrate support system includes a first and second vacuum members extending lengthwise in a glass substrate feed direction along opposing edges of a flexible glass substrate. Each vacuum member has a vacuum body including a pressure chamber located therein and a support surface having a vacuum opening extending therethrough and in communication with the pressure chamber. A support rod assembly is provided that includes a plurality of support rods located between the first second vacuum members in the glass substrate feed direction. The support rod assembly has an out-of-plane configuration that supports the flexible glass substrate in a downward arc orientation.

A substrate thinning apparatus includes a chuck table capable of supporting a substrate, a rotatable grinding device which includes a wheel tip capable of grinding the substrate supported by the chuck table, and a cleaning device configured to perform synchronized cleaning of the wheel tip while the grinding device is rotated. When the substrate thinning apparatus is used, even an extremely thin semiconductor device can be fabricated with substantial reliability.

A grinding machine includes a support and a board which is connected to the connection portion of the support. The board has a first opening and a second opening. A transportation device is connected across over the first and second openings. A grinding device has a driving portion and a grinding portion which is connected to the driving portion. The driving portion is connected to the support so that the grinding portion is located above the transportation device. An angle adjustment device is connected between the board and the transportation device so as to adjust inclination of the transportation device so as to grind a larger area of an object.

A method of machining a fibrous sheet for a composite structure is described. The sheet comprises a resin matrix having a glass transition temperature, wherein the method comprises cooling the sheet substantially to maintain the temperature of the matrix below its glass transition temperature during machining.

A processing apparatus includes a chuck table for holding a plate-like workpiece under suction. A suction unit is connected to the chuck table, and a processing unit is configured to process the workpiece while supplying processing water to the workpiece. The suction unit includes a first suction source, a first pipe providing fluid communication between the first suction source and the chuck table, a separator arranged in the first pipe, for separating a gas and a liquid drawn in from the chuck table, and a water discharging unit configured to discharge the liquid separated by the separator. The water discharging unit includes a second suction source, a second pipe providing fluid communication between the second suction source and a water discharge port of the separator, and a check valve arranged in the second pipe, for preventing a fluid from flowing from the second suction source to the separator.

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a laminated substrate manufactured by bonding a plurality of substrates to each other. The substrate processing apparatus has a filler-application module (300) that applies and cures filler (F) to a gap between peripheral portions of adjacent wafers (W1, W2) in a laminated substrate (Ws), a grinding module (400) that grinds an upper surface of the laminated substrate (Ws) to which the filler (F) has been applied, and a polishing module (500) that polishes an upper surface of the laminated substrate (Ws) that has been ground.

A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from said base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.