A sharpening jig, in particular for holding a cutting tool which is to be sharpened or polished and which includes a blade, and for positioning the blade at least at one positioning angle with respect to a sharpening and/or polishing tool, e.g. a rolling sharpener. In order to be able to position the blade at different positioning angles and thus allow the sharpening jig to be used with more versatility, the sharpening jig has at least two parts which are movable relative to each other to set different positioning angles.

An apparatus for finishing a cut edge of a glass laminate includes a support including a surface and an edge, a rail disposed adjacent the support and extending substantially parallel to the edge, a carrier coupled to the rail, and a finishing tool coupled to the carrier and including an abrasive surface positioned adjacent the edge. The carrier is translatable along the rail to translate the abrasive surface relative to the edge. A method includes securing a glass laminate to a support and contacting a cut edge of the glass laminate with an abrasive surface of a finishing tool coupled to a carrier. The carrier is translated along a rail to move the abrasive surface along the cut edge of the glass laminate and transform the cut edge into a finished edge. The glass laminate can have an edge strength of at least about 100 MPa.

There is provided an inclination adjusting mechanism including an annular upper plate that has an upper surface for connecting a table and a lower surface inclined relative to the upper surface, an annular lower plate that has an upper surface parallel to the lower surface of the upper plate and a lower surface parallel to the upper surface of the upper plate and facing an upper surface of a base, an upper rotating mechanism that rotates the upper plate, a lower rotating mechanism that rotates the lower plate, a first bearing provided between the lower surface of the upper plate and the upper surface of the lower plate, a second bearing provided between the lower surface of the lower plate and the upper surface of the base, and a connecting mechanism that connects the upper plate, the lower plate, and the base.

The present disclosure discloses a device for cutting connection of multi-piece module electrode which includes a stand, the stand is provided with a workbench and the workbench is connected with a height adjusting device. The device further includes an angle grinding device, the angle grinding device includes a polishing shaft and an angle grinder, the angle grinder is arranged on the polishing shaft, and the angle grinding device is provided with a saw blade. According to the characteristics of the module electrode, the angle grinding device is matched with the workbench to implement simultaneous electrode disconnecting operation of multiple electrodes of the module, so that the device not only has higher efficiency and better cutting effect, but also is suitable for universal saw blades, saves the cost, and is safer.

A material loading apparatus includes a movable material support surface that is pivotally mounted to the frame. The loading apparatus also includes a first link that extends between the support surface and the frame and is pivotally connected to the support surface at a first end of the first link and pivotally connected to the frame at a second end of the first link. The loading apparatus also includes a second link that extends between the support surface and the frame and is pivotally connected to the support surface at a first end of the second link and pivotally connected to the frame at a second end of the second link. The loading apparatus also includes an actuator that is pivotally connected to the frame and configured to move the support surface between a generally horizontal position and a generally vertical position.

A polishing solution according to an embodiment includes an exothermic agent that generates heat through application of an alternating magnetic field thereto, and a viscosity modifier that undergoes a reversible phase transition between a gel state and a sol state depending on temperature.

A processing apparatus configured to process a substrate includes a substrate holder having a substrate holding surface configured to attract and hold the substrate thereon; and an edge cleaning device configured to clean an edge portion of the substrate holding surface. Further, a processing method of processing a rear surface of the substrate by using the processing apparatus includes processing the rear surface of the substrate while a front surface of the substrate is attracted to and held by a substrate holding surface of a substrate holder; and cleaning an edge portion of the substrate holding surface.

A polishing system for polishing a workpiece includes a sensor group detecting pressure information of the workpiece and generating a pressure sequence; a processor coupled to the sensor group and configured to: receive the pressure sequence; generate indication information including a predetermined track of a polishing head to polish the workpiece; based on the pressure sequence and the indication information, generate a deviation sequence of the pressure sequence; and based on the deviation sequence, generate an adjustment instruction, to adjust a position of the polishing head. A polishing method, an assistant polishing device, an assistant polishing system, and an assistant polishing method are also disclosed.

In order to respond flexibly to various processing modes, such as forming curved surface shapes, when cutting a workpiece using a wire saw, this wire saw device (1) is provided with: a single robot arm (2) that is capable of moving freely by means of multi-axis control; a wire saw unit (3) that is detachably connected to the robot arm (2) via a tool changer (7); a wire (8) that spans a plurality of pulleys supported within the wire saw unit (3); and a workpiece cutting zone (20) that is established between the pulleys. The workpiece is cut to a prescribed shape by moving the robot arm (2) in a preset direction while running the wire (8) of the wire saw unit (3) and pressing the wire (8) against the supported workpiece.

A crystal centering and clamping device has a first jig, a second jig, a clamping mechanism and an ejector mechanism. The first jig and the second jig are used for bonding on opposite end faces of a crystal, and positioning holes are arranged at the central positions of the first jig and the second jig. The ejector mechanism is located at one side of the clamping mechanism and can move towards or away from the clamping mechanism, so that the ejector mechanism can abut against the positioning hole of the first jig or the second jig above the crystal in the clamping mechanism.