A glass plate processing system includes a first aligning means. When first and second glass plates different upper and lower surface areas are processed, the first aligning means aligns a first side edge extending in a front-rear direction on one side in a width direction of a first glass plate to be processed first with a first side edge extending in the front-rear direction on the one side in the width direction of a second glass plate to be processed later. The glass plate processing system causes the first aligning means to align the first side edge of the second glass plate at a position of the first side edge of the first glass plate to perform processing on the second glass plate. The glass plate processing system shortens a moving distance and arrival time for a processing device and shortens cycle time of processing.

One object is to improve the uniformity of polishing of a substrate.

The present application discloses, as one embodiment, a substrate polishing device for a quadrilateral-shaped substrate, the device including: a surface plate; a substrate support mechanism that is attached to the surface plate and that supports the substrate; a polishing head mechanism for attaching a polishing pad, the polishing head mechanism opposing the surface plate; and an orbital drive mechanism for orbitally driving the polishing head mechanism. The substrate support mechanism includes: a base plate; a plate flow passage provided to the base plate; and a plurality of substrate support chambers that are connected to the plate flow passage, wherein each substrate support chamber independently applies a vertical direction force to the substrate, and the vertical direction force applied to the substrate corresponds to an internal pressure of the substrate support chamber.

A method of grinding a back side of a workpiece having a device region and a peripheral surplus region on a front side thereof includes covering the front side of the workpiece with a protective member, holding a protective member side of the workpiece by a holding surface of a chuck table that is rotated around a rotational axis inclined at an angle of 45 to 180 degrees relative to a vertical direction, and grinding the back side of the workpiece corresponding to the device region by a grindstone rotated around a rotational axis orthogonal to the holding surface while supplying grinding water, to form a circular recess and an annular reinforcement section surrounding the circular recess. When grinding, discharge of the grinding water containing abrasive grains dropped from the grindstone is promoted by the inclination of the workpiece.

Provided is an automatic chamfering machine for chamfering workpieces, comprising: a feed inlet, a linear guide, a positioning mechanism, a working platform, an automatic grasping mechanism, a grinding stick and an outlet. One end of the linear guide is connected to the feed inlet and the other end of the linear guide is connected to the outlet; the positioning mechanism and the working platform are arranged on the linear guide. The workpieces enter the linear guide from the feed inlet and pass through the positioning mechanism, the positioning mechanism performs a position alignment calibration to the workpieces. The automatic grasping mechanism grasps the workpieces after the position alignment calibration to the working platform. The grinding stick chamfers the workpieces on the working platform. The workpieces after chamfering are discharged through the outlet along with the linear guide. A chamfering method using the automatic chamfering machine is further provided.

Provided is a grinding apparatus including a holding unit that holds a workpiece by a chuck table, a grinding unit, a transporting mechanism that has a holding part capable of holding the workpiece, a first table that holds the workpiece to be loaded onto the holding unit, a second table that holds the workpiece having been unloaded from the holding unit, and a controller. When the controller determines that replacement of a grinding wheel is necessary in a state in which all of the holding unit, the first table, and the second table are holding workpieces, the controller makes the holding part of the transporting mechanism hold the workpiece held by the holding unit.

A processing apparatus includes a chuck table configured to hold a plate-shaped workpiece thereon, a processing unit including a spindle having an end portion at which a processing tool for grinding or polishing a workpiece held on the chuck table is to be mounted, a processing room surrounded by a wall and configured to accommodate the chuck table and the end portion of the spindle therein, and a dirty situation indication unit configured to indicate a degree of adhesion of processing waste, which is generated by grinding or polishing of the workpiece, to the wall. The dirty situation indication unit includes a transmission window made of a member that passes visible rays therethrough and configuring part of the wall, and a color sample indication unit indicative of a relationship between an amount of the processing waste adhering on the transmission window and a color of the transmission window.

A material loading apparatus includes a movable material support surface that is pivotally mounted to the frame. The loading apparatus also includes a first link that extends between the support surface and the frame and is pivotally connected to the support surface at a first end of the first link and pivotally connected to the frame at a second end of the first link. The loading apparatus also includes a second link that extends between the support surface and the frame and is pivotally connected to the support surface at a first end of the second link and pivotally connected to the frame at a second end of the second link. The loading apparatus also includes an actuator that is pivotally connected to the frame and configured to move the support surface between a generally horizontal position and a generally vertical position.

Disclosed is a wheel cap section chamfering device, comprising a main frame, a secondary frame, a lower servo motor, a key, a bearing seat, a left bearing seat, a left shaft, a left bearing, a left driven friction wheel, a left sleeve, left corner cylinder pressure claws, a left turntable, a left mandrel seat, a left mandrel, a chamfer mill, a tool apron, a feeding platform, a feeding cylinder, guide sleeves, guide posts, a support plate, guide rails, a compression cylinder, a translation sliding table, an upper servo motor, a driving friction wheel, a right mandrel, a right mandrel seat, a right turntable, right corner cylinder pressure claws, a right sleeve, a right driven friction wheel, a right bearing, a right shaft, a right bearing seat, a station rotating platform, a shaft and a bearing.

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

A machine for processing a screen printing frame includes an upstream end and an opposed downstream end, a grinding assembly located between the upstream and downstream locations, wherein the grinding assembly includes a first grinder configured to grind a first pattern into the screen printing frame and a second grinder configured to grind a second pattern into the screen printing frame different from the first grinding pattern.