A grinding package fitted on robotic arm includes a main body, a pneumatic motor, a bridging part and a grinding tool. The main body is formed with a first space, a second space, a communicating hole communicating the first space to the second space, a connecting wall within the first space, an intake channel, an exhaust channel, openings of the first space and the second space respectively located on each of two parallel sides of the main body, the connecting wall having a ventilation hole. The pneumatic motor includes a motor body within the first space, and a transmission shaft connected to the motor body while extended from the second space through the communicating hole. The bridging part is combined with the main body and the robotic arm, the bridging part closing off the first space, the grinding tool facing the second space and being joined to the transmission shaft.

[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.

[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.

A belt processing device moves a processing belt relative to a workpiece to process the workpiece. The belt processing device comprises a first roller that is a processing roller, a second roller that is a driven roller, a processing belt that is supported by the first roller and the second roller, a pneumatic motor that rotates the first roller or the second roller, an elastic ring that is installed on the outer circumference of the first roller, and an expansion prevention member that is installed on the elastic ring and has a greater modulus of elasticity than the elastic ring.

A power tool includes a housing, an output shaft, and a tool holder connected to the output shaft. A rotor assembly is attached to the output shaft that is configured to be acted on by a fluid flow through the housing to cause rotation of the output shaft. A centrifugally movable fluid flow governor is coupled to the output shaft that is configured to move outwardly from the output shaft to alter a force acting on the rotor assembly when the output shaft reaches a predetermined speed.

An air file has a body, a fastening member, and a driving assembly. The body has a handle and a front cover connected to the handle. The fastening member is swingably assembled to the front cover and has a pivoting end and a connecting end. The pivoting end of the fastening member is inserted inside the front cover. The connecting end of the fastening member extends out of the front cover. The driving assembly is mounted inside the body and has an eccentric shaft and a swinging unit. The eccentric shaft is connected to a driving device and has an eccentric hole facing to the front cover. The swinging unit has a pivoting portion and a ball joint. The pivoting portion is pivotally connected to the pivoting end of the fastening member. The ball joint is engaged in the eccentric hole of the eccentric shaft.

A grinding machine includes a rotatable spindle having a lower end to which a grindstone for grinding a wafer is attached; linear guides supporting the spindle slidably to a column; a spindle feeding mechanism feeding the spindle in a vertical direction; and constant-pressure feeding mechanism interposed between the spindle feeding mechanism and the column and suspending the spindle feeding mechanism. The constant-pressure feeding mechanism raises the spindle feeding mechanism in the vertical direction when a friction force acting on the grindstone is higher than a predetermined value.

A grinding machine includes a rotatable spindle having a lower end to which a grindstone for grinding a wafer is attached; linear guides supporting the spindle slidably to a column; a spindle feeding mechanism feeding the spindle in a vertical direction; and constant-pressure feeding mechanism interposed between the spindle feeding mechanism and the column and suspending the spindle feeding mechanism. The constant-pressure feeding mechanism raises the spindle feeding mechanism in the vertical direction when a friction force acting on the grindstone is higher than a predetermined value.

[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.

[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.