Disclosed is an oscillating power tool comprising: a housing; a motor; a drive shaft; an output shaft driven by the drive shaft to oscillate around its own axis at a certain angle of oscillation; an eccentric transmission mechanism converting the rotational movement of the drive shaft to the oscillation of the output shaft, wherein the eccentric transmission mechanism comprises an eccentric apparatus mounted on the drive shaft and a shift fork assembly respectively connected to the eccentric apparatus and the output shaft; and the eccentric apparatus comprises at least two drive members, the shift fork assembly comprises a first shift fork member and a second shift fork member, the first shift fork member has a first cooperating part cooperating with the drive member and a second cooperating part cooperating with the second shift fork member, and the second shift fork member is connected to the output shaft. The oscillating power tool further comprises an adjusting mechanism placed on the housing, wherein the adjusting mechanism operably adjusts the movement of the first shift fork member, such that the first cooperating part abuts a different drive member, the second cooperating part abuts a different position of the second shift fork member, and the output shaft has a different angle of oscillation.

An oscillating power tool includes a drive motor producing rotary motion and an oscillating mechanism for converting the motor rotary motion to an oscillatory side-to-side movement. The oscillating mechanism includes a fork having two arms and coupled to an output spindle and includes a bearing positioned between the two arms of the fork and coupled to the drive motor. The arrangement of the fork and the bearing isolate relative rotation and translation between the components of the tool while still imparting an oscillatory motion to the output spindle.

An oscillating power tool includes a drive motor producing rotary motion and an oscillating mechanism for converting the motor rotary motion to an oscillatory side-to-side movement. The oscillating mechanism includes a fork having two arms and coupled to an output spindle and includes a bearing positioned between the two arms of the fork and coupled to the drive motor. The arrangement of the fork and the bearing isolate relative rotation and translation between the components of the tool while still imparting an oscillatory motion to the output spindle.

Disclosed is an oscillatingly driven machine tool including a tool spindle that is mounted pivotably about its longitudinal axis, further including a drive motor that is coupled to a hydraulic generator for generating an oscillating fluid flow which drives a hydraulic motor being configured as a rotor blade motor. The rotor blade motor drives the tool spindle in such a way that the tool spindle rotates oscillatingly about its longitudinal axis. The rotor blade motor includes symmetrically arranged rotor blades that are disposed at regular angular distances with respect to each other.

Disclosed is an oscillatingly driven machine tool including a tool spindle that is mounted pivotably about its longitudinal axis, further including a drive motor that is coupled to a hydraulic generator for generating an oscillating fluid flow which drives a hydraulic motor being configured as a rotor blade motor. The rotor blade motor drives the tool spindle in such a way that the tool spindle rotates oscillatingly about its longitudinal axis. The rotor blade motor includes symmetrically arranged rotor blades that are disposed at regular angular distances with respect to each other.

A double-face polishing device and a method capable of controlling rigidity of a polishing pad through a cluster dynamic magnetic field are provided. A whole process from double-face rough polishing to precision polishing of a workpiece is implemented by adjusting a rigidity of a flexible polishing pad. The double-face polishing device capable of controlling rigidity of a polishing pad through a cluster dynamic magnetic field includes a variable-rigidity cluster magnetically-controlled polishing pad generating mechanism, a workpiece fast clamping mechanism and a workpiece movement driving mechanism. The variable-rigidity cluster magnetically-controlled polishing pad generating mechanism includes a first magnetic field generating block and a second magnetic field generating block that are symmetrically arranged, wherein the first magnetic field generating block and the second magnetic field generating block each include a shell, a deflection spindle, an eccentric camshaft, a magnet mounting base, a permanent magnet and a motor, the workpiece fast clamping mechanism includes a working tank, a clamping plate, a connection rod, a hinge plate, a fixing hinge, a square magnet, an electrical soft iron block, an annular cast iron and a strip-shaped permanent magnet, and the workpiece movement driving mechanism includes a support block, a cross beam, a horizontal linear motor, a vertical beam and a vertical linear motor.

A double-face polishing device and a method capable of controlling rigidity of a polishing pad through a cluster dynamic magnetic field are provided. A whole process from double-face rough polishing to precision polishing of a workpiece is implemented by adjusting a rigidity of a flexible polishing pad. The double-face polishing device capable of controlling rigidity of a polishing pad through a cluster dynamic magnetic field includes a variable-rigidity cluster magnetically-controlled polishing pad generating mechanism, a workpiece fast clamping mechanism and a workpiece movement driving mechanism. The variable-rigidity cluster magnetically-controlled polishing pad generating mechanism includes a first magnetic field generating block and a second magnetic field generating block that are symmetrically arranged, wherein the first magnetic field generating block and the second magnetic field generating block each include a shell, a deflection spindle, an eccentric camshaft, a magnet mounting base, a permanent magnet and a motor, the workpiece fast clamping mechanism includes a working tank, a clamping plate, a connection rod, a hinge plate, a fixing hinge, a square magnet, an electrical soft iron block, an annular cast iron and a strip-shaped permanent magnet, and the workpiece movement driving mechanism includes a support block, a cross beam, a horizontal linear motor, a vertical beam and a vertical linear motor.

A polishing apparatus capable of accurately controlling a film thickness profile of a substrate by controlling each of a plurality of pressing actuators without having a complicated mechanism is disclosed. The polishing apparatus includes a polishing structure, a polishing head, and a head rotation mechanism configured to rotate the polishing head within a predetermined rotation angle range. The polishing head includes a plurality of pressing actuators. The polishing structure includes a polishing table or a polishing belt.

A polishing apparatus capable of accurately controlling a film thickness profile of a substrate by controlling each of a plurality of pressing actuators without having a complicated mechanism is disclosed. The polishing apparatus includes a polishing structure, a polishing head, and a head rotation mechanism configured to rotate the polishing head within a predetermined rotation angle range. The polishing head includes a plurality of pressing actuators. The polishing structure includes a polishing table or a polishing belt.

A power tool includes a housing, a motor, a ball sleeve, an oscillating member with a mounting portion, and an output shaft rotating around an output shaft axis. The oscillating member and the ball sleeve are engaged in an engagement region on the oscillating member, and the geometric center of the engagement region is an engagement center. A first plane bisects the first bearing assembly along a direction of the output shaft axis, and a second plane bisects the second bearing assembly along the direction of the output shaft axis. The height from the engagement center to the first plane is a first height H1, the height from the engagement center to the second plane is a second height H2, and the ratio H1/H2 of the first height H1 to the second height H2 is greater than or equal to 0.5 and less than or equal to 1.4.