A wafer polishing system, comprising at least one polishing unit, wherein the polishing unit comprises a wafer transfer passage and at least two polishing modules; and the polishing modules are located on both sides of the wafer transfer passage. After a polishing arm of one polishing module obtains a wafer from a working position in the wafer transfer passage, the polishing process is completed; the wafer is then placed back to the wafer transfer passage along a first trajectory; a wafer transfer device moves to transfer the wafer to another working position, and after a polishing arm of the other polishing module obtains the wafer from the working position along a second trajectory, another polishing process is completed; and the first trajectory, a movement trajectory of the wafer transfer device, and the second trajectory are approximately Z-shaped.

A wafer polishing system, comprising at least one polishing unit, wherein the polishing unit comprises a wafer transfer passage and at least two polishing modules; and the polishing modules are located on both sides of the wafer transfer passage. After a polishing arm of one polishing module obtains a wafer from a working position in the wafer transfer passage, the polishing process is completed; the wafer is then placed back to the wafer transfer passage along a first trajectory; a wafer transfer device moves to transfer the wafer to another working position, and after a polishing arm of the other polishing module obtains the wafer from the working position along a second trajectory, another polishing process is completed; and the first trajectory, a movement trajectory of the wafer transfer device, and the second trajectory are approximately Z-shaped.