A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice pattern. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.

A grinding apparatus includes a chuck table, a grinding unit, a thickness measuring device for measuring a thickness of the workpiece, and a control unit. The thickness measuring device includes a measuring unit for measuring the thickness of the workpiece and a measuring unit moving mechanism for moving the measuring unit back and forth on a measuring track. The control unit controls the measuring unit to measure thicknesses of the workpiece at various points thereon while moving the measuring unit back and forth on the measuring track, calculates a cross-sectional shape of the workpiece from average values of thickness values measured by the measuring unit in a forward stroke on the measuring track and thickness values measured by the measuring unit in a return stroke on the measuring track, and calculates a tilt adjustment variable for a table rotational axis according to the calculated cross-sectional shape.

A grinding apparatus includes a chuck table, a grinding unit, a thickness measuring device for measuring a thickness of the workpiece, and a control unit. The thickness measuring device includes a measuring unit for measuring the thickness of the workpiece and a measuring unit moving mechanism for moving the measuring unit back and forth on a measuring track. The control unit controls the measuring unit to measure thicknesses of the workpiece at various points thereon while moving the measuring unit back and forth on the measuring track, calculates a cross-sectional shape of the workpiece from average values of thickness values measured by the measuring unit in a forward stroke on the measuring track and thickness values measured by the measuring unit in a return stroke on the measuring track, and calculates a tilt adjustment variable for a table rotational axis according to the calculated cross-sectional shape.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.

Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.

According to one example, a CNC machine tool system may perform error compensation for improving the accuracy of the geometry (or form) of a machined workpiece to, for example, better than 2 micrometers. To do so, a first machined workpiece may be created using the CNC machine tool system. The CNC machine tool system may create the machined workpiece by jig grinding. Following the creation of the first machined workpiece, metrology of the workpiece error may then be performed on the machined workpiece. The metrology of the workpiece error may be used to create a corrected toolpath trajectory for re-machining. This corrected toolpath trajectory may then be utilized by the CNC machine tool system to machine a second machined workpiece having a geometry (or form) with an accuracy of, for example, better than 2 micrometers.

A multi-angle two-dimensional ultrasonic vibration assisted nanofluid micro-lubrication grinding device includes a workpiece fixture for clamping a workpiece and a grinding wheel for grinding the workpiece, the fixture being connected with a two-dimensional ultrasonic vibration device to maintain the sharpness of the grinding wheel cutting edge and cool the grinding temperature on the workpiece surface; a jetting mechanism used for jetting nanofluid to the workpiece is arranged on one side of the grinding wheel so as to form two-dimensional ultrasonic vibration and nanofluid micro-lubrication grinding coupling; the device applies the variable-angle two-dimensional ultrasonic vibration technology to grinding processing, and adjusts the angles of two ultrasonic vibrators to generate different combined vibration directions to change the relative movement trajectories of abrasive particles and a workpiece. A grinding force and grinding temperature are detected in real time by force measurement and temperature measurement devices, meanwhile cooperation with nanofluid micro-lubrication is utilized.

A multi-angle two-dimensional ultrasonic vibration assisted nanofluid micro-lubrication grinding device includes a workpiece fixture for clamping a workpiece and a grinding wheel for grinding the workpiece, the fixture being connected with a two-dimensional ultrasonic vibration device to maintain the sharpness of the grinding wheel cutting edge and cool the grinding temperature on the workpiece surface; a jetting mechanism used for jetting nanofluid to the workpiece is arranged on one side of the grinding wheel so as to form two-dimensional ultrasonic vibration and nanofluid micro-lubrication grinding coupling; the device applies the variable-angle two-dimensional ultrasonic vibration technology to grinding processing, and adjusts the angles of two ultrasonic vibrators to generate different combined vibration directions to change the relative movement trajectories of abrasive particles and a workpiece. A grinding force and grinding temperature are detected in real time by force measurement and temperature measurement devices, meanwhile cooperation with nanofluid micro-lubrication is utilized.