The present invention relates to a measuring steady rest which has a device for supporting central workpiece regions, in particular, bearing points on shaft parts, in particular crankshafts, and a measurement device integrated therein for directly adjusting the measurement of the workpiece regions before and/or during machining of the shaft parts. The measuring steady rest is preferably designed in the form of a prism, the measurement device being arranged on the bottom of the prism between the lateral flanks of the prism. The present invention further relates to a grinding machine comprising such a measuring steady rest, and to a method for supporting and measuring central workpiece regions on such a grinding machine comprising such a measuring steady rest.

The present invention relates to a measuring steady rest which has a device for supporting central workpiece regions, in particular, bearing points on shaft parts, in particular crankshafts, and a measurement device integrated therein for directly adjusting the measurement of the workpiece regions before and/or during machining of the shaft parts. The measuring steady rest is preferably designed in the form of a prism, the measurement device being arranged on the bottom of the prism between the lateral flanks of the prism. The present invention further relates to a grinding machine comprising such a measuring steady rest, and to a method for supporting and measuring central workpiece regions on such a grinding machine comprising such a measuring steady rest.

The sum of torques: the torque of the sun gear and the torque of the internal gear, and the ratio of the torques are controlled within predetermined ranges.

A polishing apparatus capable of preventing condensation on an inner surface of a transparent window provided in a polishing pad and capable of achieving accurate measuring of a film thickness is disclosed. The polishing apparatus includes: a polishing pad having a polishing surface; a polishing head configured to press a workpiece against the polishing surface; a transparent window disposed in the polishing pad; a polishing table configured to support the polishing pad; an optical sensor head located below the transparent window and configured to direct light to the workpiece through the transparent window and receive reflected light from the workpiece through the transparent window; and a cooling device configured to cool a space between the transparent window and the optical sensor head.

A grinding device is operated by grinding of a surface of the workpiece with at least one grinding medium while recording actual data of the surface after grinding with at least one data collection device. Actual data recorded during grinding is then compared with target data stored in an electronic memory in an electronic data processing device. Based on the comparison, adjustments are made to at least one grinding parameter if a deviation of the actual data from the target data exceeds a predetermined limit.

A grinding device is operated by grinding of a surface of the workpiece with at least one grinding medium while recording actual data of the surface after grinding with at least one data collection device. Actual data recorded during grinding is then compared with target data stored in an electronic memory in an electronic data processing device. Based on the comparison, adjustments are made to at least one grinding parameter if a deviation of the actual data from the target data exceeds a predetermined limit.

A polishing head system capable of precisely controlling a pressing force of a retainer member, such as a retainer ring, against a polishing pad. The polishing head system includes: a polishing head including an actuator configured to apply a pressing force to the workpiece, a retainer member arranged outside the actuator, and piezoelectric elements coupled to the retainer member; and a drive-voltage application device configured to apply voltages independently to the piezoelectric elements.

A polishing head system capable of precisely controlling a pressing force of a retainer member, such as a retainer ring, against a polishing pad. The polishing head system includes: a polishing head including an actuator configured to apply a pressing force to the workpiece, a retainer member arranged outside the actuator, and piezoelectric elements coupled to the retainer member; and a drive-voltage application device configured to apply voltages independently to the piezoelectric elements.

To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.

A grinding machine and a method for measuring and producing a target outer contour is disclosed, particularly for a pin-bearing journal of a crankshaft. First, a measurement device acquires measurement values for the dimensions and shape of a workpiece in at least two measurement planes that are spaced apart and extend transversely to a longitudinal extension of a workpiece region. The measurement planes are produced by a relative movement of the workpiece region and the measurement device in a Z axis direction, relative to the movement of a grinding disc in the direction of the Z-axis thereof. These measurement values are transmitted to a CNC system for advancing a grinding disc, such that any deviations from the target contour that may be present are corrected, and the target contour of the workpiece region in question is ground adaptively on the basis of the measurement values.